DE9113601U1 - Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten - Google Patents

Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten

Info

Publication number
DE9113601U1
DE9113601U1 DE9113601U DE9113601U DE9113601U1 DE 9113601 U1 DE9113601 U1 DE 9113601U1 DE 9113601 U DE9113601 U DE 9113601U DE 9113601 U DE9113601 U DE 9113601U DE 9113601 U1 DE9113601 U1 DE 9113601U1
Authority
DE
Germany
Prior art keywords
chip card
cover
carrier substrate
card according
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9113601U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELBUS GESELLSCHAFT fur ELEKTRONISCHE KOMMUNIKATIONS-SYSTEME MBH 8057 ECHING DE
Original Assignee
TELBUS GESELLSCHAFT fur ELEKTRONISCHE KOMMUNIKATIONS-SYSTEME MBH 8057 ECHING DE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TELBUS GESELLSCHAFT fur ELEKTRONISCHE KOMMUNIKATIONS-SYSTEME MBH 8057 ECHING DE filed Critical TELBUS GESELLSCHAFT fur ELEKTRONISCHE KOMMUNIKATIONS-SYSTEME MBH 8057 ECHING DE
Priority to DE9113601U priority Critical patent/DE9113601U1/de
Publication of DE9113601U1 publication Critical patent/DE9113601U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
DE9113601U 1991-10-31 1991-10-31 Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten Expired - Lifetime DE9113601U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9113601U DE9113601U1 (de) 1991-10-31 1991-10-31 Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9113601U DE9113601U1 (de) 1991-10-31 1991-10-31 Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten

Publications (1)

Publication Number Publication Date
DE9113601U1 true DE9113601U1 (de) 1993-03-04

Family

ID=6872842

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9113601U Expired - Lifetime DE9113601U1 (de) 1991-10-31 1991-10-31 Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten

Country Status (1)

Country Link
DE (1) DE9113601U1 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29516811U1 (de) * 1995-10-25 1995-12-21 Hornig, Wolfgang, Dr.-Ing., 90542 Eckental Chipkarten aus Metall

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3124332A1 (de) * 1980-07-09 1982-06-03 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven "tragbares, aus mehreren schichten aufgebautes ausweiselement"
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
US4552383A (en) * 1981-12-24 1985-11-12 Gao Gesellschaft Fur Automation Und Organisation Mbh Identification card having an IC module
DE2659573C2 (de) * 1975-12-31 1986-02-27 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull, Paris Karte nach Art einer genormten Kreditkarte zur Verarbeitung von elektrischen Signalen und Verfahren zur Herstellung der Karte
DE3535791A1 (de) * 1984-11-05 1986-05-07 Casio Computer Co., Ltd., Tokio/Tokyo Karte mit eingebautem chip
FR2586886A1 (fr) * 1985-08-09 1987-03-06 Sharp Kk Dispositif electronique mince du type carte.
FR2599893A1 (fr) * 1986-05-23 1987-12-11 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
DE3633257A1 (de) * 1986-09-30 1988-05-05 Wilde Membran Impuls Tech Metallisiertes, textiles flaechengebilde als schirmschutz gegen elektromagnetische strahlung und brandschutz bei gegenstaenden, insbesondere elektrischen und elektronischen geraeten und bauteilen sowie raeumen
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
EP0312067A2 (en) * 1987-10-16 1989-04-19 Sumitomo Metal Industries, Ltd. Metal case for housing an IC and a manufacturing method therefor
EP0317201A2 (en) * 1987-11-14 1989-05-24 Kabushiki Kaisha Toshiba Portable storage medium
DE3118298C2 (cs) * 1981-05-08 1989-09-28 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De
EP0391790A1 (fr) * 1989-04-07 1990-10-10 STMicroelectronics S.A. Procédé de fabrication d'un module électronique
US5005106A (en) * 1988-12-08 1991-04-02 E. I. Du Pont De Nemours And Company Multifunctional card having an electromagnetic wave protection
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
DE4109959A1 (de) * 1990-03-26 1991-10-02 Mitsubishi Electric Corp Verfahren zur herstellung einer ic-karte

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2659573C2 (de) * 1975-12-31 1986-02-27 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull, Paris Karte nach Art einer genormten Kreditkarte zur Verarbeitung von elektrischen Signalen und Verfahren zur Herstellung der Karte
DE3124332A1 (de) * 1980-07-09 1982-06-03 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven "tragbares, aus mehreren schichten aufgebautes ausweiselement"
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3118298C2 (cs) * 1981-05-08 1989-09-28 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
US4552383A (en) * 1981-12-24 1985-11-12 Gao Gesellschaft Fur Automation Und Organisation Mbh Identification card having an IC module
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
DE3535791A1 (de) * 1984-11-05 1986-05-07 Casio Computer Co., Ltd., Tokio/Tokyo Karte mit eingebautem chip
FR2586886A1 (fr) * 1985-08-09 1987-03-06 Sharp Kk Dispositif electronique mince du type carte.
FR2599893A1 (fr) * 1986-05-23 1987-12-11 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
DE3633257A1 (de) * 1986-09-30 1988-05-05 Wilde Membran Impuls Tech Metallisiertes, textiles flaechengebilde als schirmschutz gegen elektromagnetische strahlung und brandschutz bei gegenstaenden, insbesondere elektrischen und elektronischen geraeten und bauteilen sowie raeumen
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
EP0312067A2 (en) * 1987-10-16 1989-04-19 Sumitomo Metal Industries, Ltd. Metal case for housing an IC and a manufacturing method therefor
EP0317201A2 (en) * 1987-11-14 1989-05-24 Kabushiki Kaisha Toshiba Portable storage medium
US5005106A (en) * 1988-12-08 1991-04-02 E. I. Du Pont De Nemours And Company Multifunctional card having an electromagnetic wave protection
EP0391790A1 (fr) * 1989-04-07 1990-10-10 STMicroelectronics S.A. Procédé de fabrication d'un module électronique
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
DE4109959A1 (de) * 1990-03-26 1991-10-02 Mitsubishi Electric Corp Verfahren zur herstellung einer ic-karte

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
2-30597 A., M-960, Vol.14, No.177 *
JP Patents Abstracts of Japan: 2-92597 A., M-989, June 22, 1990, Vol.14, No.291 *
RIGID DISH SMART CARD. In: IBM Technical Disclo- sure Bulletin, Vol.32, No.4A, Sept. 1989, S.431-432 *
STIFFEND CARD WITH INTEGRATED CIRCUIT. In: IBM Technical Disclosure Bulletin, Vol. 28, No.11, April 1986, S.4723-4725 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29516811U1 (de) * 1995-10-25 1995-12-21 Hornig, Wolfgang, Dr.-Ing., 90542 Eckental Chipkarten aus Metall

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