DE7603408U1 - Halbleitereinheit, insbesondere zur umformung oder steuerung grosser elektrischer leistungen - Google Patents

Halbleitereinheit, insbesondere zur umformung oder steuerung grosser elektrischer leistungen

Info

Publication number
DE7603408U1
DE7603408U1 DE19767603408U DE7603408U DE7603408U1 DE 7603408 U1 DE7603408 U1 DE 7603408U1 DE 19767603408 U DE19767603408 U DE 19767603408U DE 7603408 U DE7603408 U DE 7603408U DE 7603408 U1 DE7603408 U1 DE 7603408U1
Authority
DE
Germany
Prior art keywords
semiconductor
yoke
pin
pressure body
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19767603408U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of DE7603408U1 publication Critical patent/DE7603408U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Clamps And Clips (AREA)
DE19767603408U 1976-01-22 1976-02-06 Halbleitereinheit, insbesondere zur umformung oder steuerung grosser elektrischer leistungen Expired DE7603408U1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH77576A CH593560A5 (enExample) 1976-01-22 1976-01-22

Publications (1)

Publication Number Publication Date
DE7603408U1 true DE7603408U1 (de) 1977-11-10

Family

ID=4194894

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19767603408U Expired DE7603408U1 (de) 1976-01-22 1976-02-06 Halbleitereinheit, insbesondere zur umformung oder steuerung grosser elektrischer leistungen
DE19762604701 Withdrawn DE2604701A1 (de) 1976-01-22 1976-02-06 Halbleitereinheit, insbesondere zur umformung oder steuerung grosser elektrischer leistungen und verfahren zur herstellung derselben

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19762604701 Withdrawn DE2604701A1 (de) 1976-01-22 1976-02-06 Halbleitereinheit, insbesondere zur umformung oder steuerung grosser elektrischer leistungen und verfahren zur herstellung derselben

Country Status (5)

Country Link
CA (1) CA1092724A (enExample)
CH (1) CH593560A5 (enExample)
DE (2) DE7603408U1 (enExample)
FR (1) FR2339253A1 (enExample)
IT (1) IT1075060B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH522288A (de) * 1970-09-29 1972-06-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben
DE7148146U (de) * 1971-12-03 1973-11-29 Bbc Ag Halbleitereinheit

Also Published As

Publication number Publication date
DE2604701A1 (de) 1977-07-28
FR2339253A1 (fr) 1977-08-19
IT1075060B (it) 1985-04-22
FR2339253B3 (enExample) 1981-01-09
CA1092724A (en) 1980-12-30
CH593560A5 (enExample) 1977-12-15

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