CA1092724A - Semiconductor pressure mounting - Google Patents
Semiconductor pressure mountingInfo
- Publication number
- CA1092724A CA1092724A CA270,099A CA270099A CA1092724A CA 1092724 A CA1092724 A CA 1092724A CA 270099 A CA270099 A CA 270099A CA 1092724 A CA1092724 A CA 1092724A
- Authority
- CA
- Canada
- Prior art keywords
- yoke
- clamping body
- button
- semiconductor
- spring packet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Clamps And Clips (AREA)
Abstract
TITLE OF THE INVENTION:
SEMICONDUCTOR PRESSURE MOUNTING
ABSTRACT OF THE DISCLOSURE
A semiconductor unit with one or more semiconductor elements, particu-larly for conversion or control of high electric power, in which unit at least one semiconductor element is clamped between a first and a second clamping body, at least two drawbolts are provided running parallel to one another and perpendicular to the flat faces of the semiconductor element, the drawbolts connecting at one end with a yoke, and means are provided for exerting a clamping force on the first clamping body, which means hold the latter and the yoke apart by means of a spring force and comprise a button in contact with the first clamping body and a spring packet on top of the button and in contact with the yoke. The invention is also concerned with a method of assembling the semiconductor unit.
SEMICONDUCTOR PRESSURE MOUNTING
ABSTRACT OF THE DISCLOSURE
A semiconductor unit with one or more semiconductor elements, particu-larly for conversion or control of high electric power, in which unit at least one semiconductor element is clamped between a first and a second clamping body, at least two drawbolts are provided running parallel to one another and perpendicular to the flat faces of the semiconductor element, the drawbolts connecting at one end with a yoke, and means are provided for exerting a clamping force on the first clamping body, which means hold the latter and the yoke apart by means of a spring force and comprise a button in contact with the first clamping body and a spring packet on top of the button and in contact with the yoke. The invention is also concerned with a method of assembling the semiconductor unit.
Description
10~ 4 Sl.MICON nucT~ p RISSUI~ oUN~
_ 13}\Cl;('.i~OUND 0:1~ Tl~ INVI'NTI(~N
-Field of the Invention The present invention relates generally to a semi-conductor unit and a method for assembling the semiconductor unit.
Description of the Prior Art Semiconductor units with semiconductor elements clamped between heat sinks for the conversion or control of electric power are already known. The clamping of the semiconductor element between the heat sinks is a particularly troublesome problem since, for satisfactory current and heat transfer through the semiconductor element, a pressure, hereafter called clamping force, uniformly distributed over the semiconductor element is necessary, its magnitude being directly related to the electric power to be converted or controlled.
In the Swiss Patent Specification No. 522288, issued June 15, 1972, Patentee: BBC Brown, Boveri & Company, Ltd., ` Baden; said patent having a corresponding U.S. patent No. 3,740,618 issued on ~une 16, 1973;
2a and Swiss patent specification 526,857 issued September 29, 1972, Patentee: BBC Brown, Boveri & Company, Ltd., Baden; said patent having a corresponding U.S.
patent No. 3,805,122 issued April 16, 1974, semiconductor units are described in which means are provided for exerting a clamping force with which the necessary magnitude of clampir.g force and uniformity of distribution can be assured.
However, these are made for manual adJustment and are suited only for the exertion of clamping forces of the order of - ' magnitude of about 1500 kp per semiconductor element. Accord-ingly the magnitude of the electric power converted or controlled is limited by the maximum achievable clamping force.
Because of this the said semiconductor units are not suited for power levels customary nowadays, since these require larger C clamping forces.
lO~Z7~4 _MMARY 0~ IE INVI:~NTION
Accordinqly, it is one object of this invention to develop a semiconductor unit of the aforementioned type in which a significantly greater clamping force per semiconductor element than heretofore can be produced and thereby considerably higher electric power can be converted or controlled.
Briefly, the present invention comprehends a semiconductor pressure mounting unit for mounting one or more semiconductor elements. The unit includes a first clamping body and a second clamping body, whereby at least one semiconductor element may be clamped between the first and the second clamping body. The unit further includes a yoke and at least two drawbolts, parallel to one another and perpendicular to the flat faces of a semiconductor element to be clamped. The drawbolts each connect with the yoke at their respective ends. A means is provided for exerting a clamping force on the first clamping body to hold the first clamping body and the yoke apart by means of a spring force. The exerting means includes a button in contact with the first clamping body, and a spring packet on top of the button .~ .
:
109~,.7Z4 and making contact with the yoke. The button and the spring packet are located in a borehole in the first clamping body.
The sprinq packet is so formed and compressible that a force acting on an operatively clamped semiconductor element is greater than 1500 kp.
The method of assembling the semiconductor unit includes the steps of placing the spring packet on the button, setting the yoke on the spring packet and a hydraulic device on the yoke, and inserting the drawbolt through the hydraulic device and the yoke and fastening same to the button. The method further includes the steps of filling the hydraulic device with fluid, thereby exerting hydraulic force on the drawbolt and the button, pressing the button against the spring packet and compressing the latter, placing the yoke with the button, the spring packet, the drawbolt and the hydraulic device on the first clamping body and screwing the former on tight with the drawbolts and nuts, and emptying the hydraulic device, thereby reducing the hydraulic force acting on the button to zero and releasing the spring packet so that it exerts its spring force on the first clamping body and squeezes the semiconductor element between the clamping bodies.
` 25 `
.i 10~7Z~
!
The main advantage of the semiconductor unit of the invention is that ~ now the spring packet can be compressed and released by hydraulic means in-¦ stead of by hand, so that the cup springs of the spring packet can be much I stiffer, and the total spring force and thus the clamping force acting on a 5 ! semiconductor element, together with the electric power convertible or con-trollable with the semiconductor unit, can be significantly greater. Fur-ther, the semiconductor unit can be mass produced simply and economically.
BRIEF DESCRIPTION OF THE DRAWINGS
A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better under-stood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
FIG. 1 shows a semiconductor unit with a semiconductor element clamped between heat sinks;
lS FIG. 2 is a semiconductor unit like that of FIG. 1 with the device for assembling ;t.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views, and more par-ticularly to FIG. 1 thereof, the semiconductor unit consists of a first clamping body 1 and a second clamping body 2, both in the form of heat sinks,, and a semiconductor element 3 in the form of a disk thyristor clamped between them. Two drawbolts 4, parallel to one another and perpendicular to the flat faces the semiconductor element 3, pass through the clamping bodies lOgZ724 I
1, 2 and the yoke 5, which is pressed down on the first clamping body 1 with a spring packet 6 and a button 7 interposed. The inner face of the button 7 in the borehole 14 of the clamping body 1 contacts the bottom of the hole.
The outer surface of the button 7 bears a spring packet 6, made up of cup springs, which is compressed between its seat on the button 7 and the yoke 5, held at the desired distance from the clamping body 1 by means of the nuts 8, and which exerts the desired clamping force on the semiconductor element 3 through the clamping body 1. This clamping force can be varied between certain limits by choice of the number and coupling mode of the cup springs, by suitable dimensioning of them and/or by choice of the distance between the clamping body 1 and the yoke 5.
More than two clamping bodies, arranged one above the other, can also be provided, with one semiconductor element 3, or several semiconductor ele- ~
ments, arranged side by side, between two adjacent clamping bodies. Further, !
in place of the nuts 8, threaded holes can be provided in the yoke 5 and the drawbolts 4 screwed into them.
In FIG. 2 the semiconductor unit is shown in the process of assembly ~ ~ wherein a piston-cylinder hydraulic device 9 rests on the yoke 5 and a draw-: bolt 10 through the device 9 and the yoke 5 is screwed into the button 7. A
hydraulic pump 11 supplies the fluid for filling the hydraulic device 9 and is furnished with an adjustable valve 12 with which a maximal pressure, indi-cated on the manometer 13, can be set, which pressure is determined by the clamping force to be exerted on the semiconductor element 3.
In assembling the semiconductor unit the spring packet 6 is placed on 2S the button 7, the yoke 5 on the spring packet and the hydraulic device 9 on the yoke. a he dr~wbolt 10 is screwed tight to the button 7 through the 'l ,, ~ hydraulic device 9 and the yoke 5. Next the hydraulic pump 11 is activated : and the device 9 filled to a predetermined pressure set by the valve 12 and indicated on the manometer 13, whereby a hydraulic force is exerted on the button 7, the yoke is pre$sed against the spring force of the spring packet S 6 and thus the distance between the button 7 and the yoke 5 is decreasedthereby placing the spring packet 6 under compression. Then the yoke 5, together with the button 7, the drawbolt 10, the spring packet 6 and the device 9, is placed on the clamping body l and secured with the drawbolts 4 and nuts 8.
Finally, by closing the valve 12 of the hydraulic pump ll, the device 9 is depressurized and the device 9 along with the drawbolt lO is removed, . whereby the first clamping body l is subjected to the clamping force of the spring packet 6 compressed between the yoke 5 and the button 7.
Obviously, numerous additional modifications and variations of the present invention are possible in light of the above teachings. It is there-fore to be understood that within the scope of the appended claims, the in-vention may practtced otherwise than as spec;fically described herein.
Z ' ~:
'~ .
' -6-
_ 13}\Cl;('.i~OUND 0:1~ Tl~ INVI'NTI(~N
-Field of the Invention The present invention relates generally to a semi-conductor unit and a method for assembling the semiconductor unit.
Description of the Prior Art Semiconductor units with semiconductor elements clamped between heat sinks for the conversion or control of electric power are already known. The clamping of the semiconductor element between the heat sinks is a particularly troublesome problem since, for satisfactory current and heat transfer through the semiconductor element, a pressure, hereafter called clamping force, uniformly distributed over the semiconductor element is necessary, its magnitude being directly related to the electric power to be converted or controlled.
In the Swiss Patent Specification No. 522288, issued June 15, 1972, Patentee: BBC Brown, Boveri & Company, Ltd., ` Baden; said patent having a corresponding U.S. patent No. 3,740,618 issued on ~une 16, 1973;
2a and Swiss patent specification 526,857 issued September 29, 1972, Patentee: BBC Brown, Boveri & Company, Ltd., Baden; said patent having a corresponding U.S.
patent No. 3,805,122 issued April 16, 1974, semiconductor units are described in which means are provided for exerting a clamping force with which the necessary magnitude of clampir.g force and uniformity of distribution can be assured.
However, these are made for manual adJustment and are suited only for the exertion of clamping forces of the order of - ' magnitude of about 1500 kp per semiconductor element. Accord-ingly the magnitude of the electric power converted or controlled is limited by the maximum achievable clamping force.
Because of this the said semiconductor units are not suited for power levels customary nowadays, since these require larger C clamping forces.
lO~Z7~4 _MMARY 0~ IE INVI:~NTION
Accordinqly, it is one object of this invention to develop a semiconductor unit of the aforementioned type in which a significantly greater clamping force per semiconductor element than heretofore can be produced and thereby considerably higher electric power can be converted or controlled.
Briefly, the present invention comprehends a semiconductor pressure mounting unit for mounting one or more semiconductor elements. The unit includes a first clamping body and a second clamping body, whereby at least one semiconductor element may be clamped between the first and the second clamping body. The unit further includes a yoke and at least two drawbolts, parallel to one another and perpendicular to the flat faces of a semiconductor element to be clamped. The drawbolts each connect with the yoke at their respective ends. A means is provided for exerting a clamping force on the first clamping body to hold the first clamping body and the yoke apart by means of a spring force. The exerting means includes a button in contact with the first clamping body, and a spring packet on top of the button .~ .
:
109~,.7Z4 and making contact with the yoke. The button and the spring packet are located in a borehole in the first clamping body.
The sprinq packet is so formed and compressible that a force acting on an operatively clamped semiconductor element is greater than 1500 kp.
The method of assembling the semiconductor unit includes the steps of placing the spring packet on the button, setting the yoke on the spring packet and a hydraulic device on the yoke, and inserting the drawbolt through the hydraulic device and the yoke and fastening same to the button. The method further includes the steps of filling the hydraulic device with fluid, thereby exerting hydraulic force on the drawbolt and the button, pressing the button against the spring packet and compressing the latter, placing the yoke with the button, the spring packet, the drawbolt and the hydraulic device on the first clamping body and screwing the former on tight with the drawbolts and nuts, and emptying the hydraulic device, thereby reducing the hydraulic force acting on the button to zero and releasing the spring packet so that it exerts its spring force on the first clamping body and squeezes the semiconductor element between the clamping bodies.
` 25 `
.i 10~7Z~
!
The main advantage of the semiconductor unit of the invention is that ~ now the spring packet can be compressed and released by hydraulic means in-¦ stead of by hand, so that the cup springs of the spring packet can be much I stiffer, and the total spring force and thus the clamping force acting on a 5 ! semiconductor element, together with the electric power convertible or con-trollable with the semiconductor unit, can be significantly greater. Fur-ther, the semiconductor unit can be mass produced simply and economically.
BRIEF DESCRIPTION OF THE DRAWINGS
A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better under-stood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
FIG. 1 shows a semiconductor unit with a semiconductor element clamped between heat sinks;
lS FIG. 2 is a semiconductor unit like that of FIG. 1 with the device for assembling ;t.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views, and more par-ticularly to FIG. 1 thereof, the semiconductor unit consists of a first clamping body 1 and a second clamping body 2, both in the form of heat sinks,, and a semiconductor element 3 in the form of a disk thyristor clamped between them. Two drawbolts 4, parallel to one another and perpendicular to the flat faces the semiconductor element 3, pass through the clamping bodies lOgZ724 I
1, 2 and the yoke 5, which is pressed down on the first clamping body 1 with a spring packet 6 and a button 7 interposed. The inner face of the button 7 in the borehole 14 of the clamping body 1 contacts the bottom of the hole.
The outer surface of the button 7 bears a spring packet 6, made up of cup springs, which is compressed between its seat on the button 7 and the yoke 5, held at the desired distance from the clamping body 1 by means of the nuts 8, and which exerts the desired clamping force on the semiconductor element 3 through the clamping body 1. This clamping force can be varied between certain limits by choice of the number and coupling mode of the cup springs, by suitable dimensioning of them and/or by choice of the distance between the clamping body 1 and the yoke 5.
More than two clamping bodies, arranged one above the other, can also be provided, with one semiconductor element 3, or several semiconductor ele- ~
ments, arranged side by side, between two adjacent clamping bodies. Further, !
in place of the nuts 8, threaded holes can be provided in the yoke 5 and the drawbolts 4 screwed into them.
In FIG. 2 the semiconductor unit is shown in the process of assembly ~ ~ wherein a piston-cylinder hydraulic device 9 rests on the yoke 5 and a draw-: bolt 10 through the device 9 and the yoke 5 is screwed into the button 7. A
hydraulic pump 11 supplies the fluid for filling the hydraulic device 9 and is furnished with an adjustable valve 12 with which a maximal pressure, indi-cated on the manometer 13, can be set, which pressure is determined by the clamping force to be exerted on the semiconductor element 3.
In assembling the semiconductor unit the spring packet 6 is placed on 2S the button 7, the yoke 5 on the spring packet and the hydraulic device 9 on the yoke. a he dr~wbolt 10 is screwed tight to the button 7 through the 'l ,, ~ hydraulic device 9 and the yoke 5. Next the hydraulic pump 11 is activated : and the device 9 filled to a predetermined pressure set by the valve 12 and indicated on the manometer 13, whereby a hydraulic force is exerted on the button 7, the yoke is pre$sed against the spring force of the spring packet S 6 and thus the distance between the button 7 and the yoke 5 is decreasedthereby placing the spring packet 6 under compression. Then the yoke 5, together with the button 7, the drawbolt 10, the spring packet 6 and the device 9, is placed on the clamping body l and secured with the drawbolts 4 and nuts 8.
Finally, by closing the valve 12 of the hydraulic pump ll, the device 9 is depressurized and the device 9 along with the drawbolt lO is removed, . whereby the first clamping body l is subjected to the clamping force of the spring packet 6 compressed between the yoke 5 and the button 7.
Obviously, numerous additional modifications and variations of the present invention are possible in light of the above teachings. It is there-fore to be understood that within the scope of the appended claims, the in-vention may practtced otherwise than as spec;fically described herein.
Z ' ~:
'~ .
' -6-
Claims (4)
1. A semiconductor pressure mounting unit for mounting one or more semiconductor elements, comprising:
a first clamping body and a second clamping body whereby at least one semi-conductor element may be clamped between the first and the second clamping body;
a yoke;
at least two drawbolts, parallel to one another and perpendicular to flat faces of a semiconductor element to be clamped, the drawbolts each connecting with the yoke at their respective ends; and means for exerting a clamping force on the first clamping body to hold the first clamping body and the yoke apart by means of a spring force, the exerting means including a button in contact with the first clamping body, and a spring packet on top of the button and making contact with the yoke, the button and the spring packet being located in a borehole in the first clamping body, the spring packet being so formed and compress-ible that a force acting on an operatively clamped semi-conductor element is greater than 1500 kp.
a first clamping body and a second clamping body whereby at least one semi-conductor element may be clamped between the first and the second clamping body;
a yoke;
at least two drawbolts, parallel to one another and perpendicular to flat faces of a semiconductor element to be clamped, the drawbolts each connecting with the yoke at their respective ends; and means for exerting a clamping force on the first clamping body to hold the first clamping body and the yoke apart by means of a spring force, the exerting means including a button in contact with the first clamping body, and a spring packet on top of the button and making contact with the yoke, the button and the spring packet being located in a borehole in the first clamping body, the spring packet being so formed and compress-ible that a force acting on an operatively clamped semi-conductor element is greater than 1500 kp.
2. A method of assembling a semiconductor unit comprising the steps of:
placing a spring packet on a button setting a yoke on the spring packet;
setting a hydraulic device on the yoke;
inserting a drawbolt through the hydraulic device and the yoke;
screwing the drawbolt into the button;
filling the hydraulic device with fluid, thereby exerting a hydraulic force on the drawbolt and the button whereby the button is pressed against the spring packet to compress the spring packet;
placing and making fast the yoke, the button, the spring packet, the drawbolt and the hydraulic device on top of a first clamping body with bolts and nuts; the semiconductor being between the first clamping body and a second clamping body; and emptying the hydraulic device whereby the hydraulic force exerted on the button is reduced to zero and the spring packet released so that it exerts its spring force on the first clamping body and clamps the semiconductor element tightly between the first and second clamping bodies.
placing a spring packet on a button setting a yoke on the spring packet;
setting a hydraulic device on the yoke;
inserting a drawbolt through the hydraulic device and the yoke;
screwing the drawbolt into the button;
filling the hydraulic device with fluid, thereby exerting a hydraulic force on the drawbolt and the button whereby the button is pressed against the spring packet to compress the spring packet;
placing and making fast the yoke, the button, the spring packet, the drawbolt and the hydraulic device on top of a first clamping body with bolts and nuts; the semiconductor being between the first clamping body and a second clamping body; and emptying the hydraulic device whereby the hydraulic force exerted on the button is reduced to zero and the spring packet released so that it exerts its spring force on the first clamping body and clamps the semiconductor element tightly between the first and second clamping bodies.
3. The method recited in claim 2 including the step of removing the hydraulic device together with the drawbolt from the yoke after the emptying step thus leaving the finished semiconductor unit free.
4. The method recited in claim 2, including the step of:
filling the hydraulic device with fluid to a predetermined pressure, set with a valve by means of a hydraulic pump.
filling the hydraulic device with fluid to a predetermined pressure, set with a valve by means of a hydraulic pump.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CHNR.775/76 | 1976-01-22 | ||
| CH77576A CH593560A5 (en) | 1976-01-22 | 1976-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1092724A true CA1092724A (en) | 1980-12-30 |
Family
ID=4194894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA270,099A Expired CA1092724A (en) | 1976-01-22 | 1977-01-20 | Semiconductor pressure mounting |
Country Status (5)
| Country | Link |
|---|---|
| CA (1) | CA1092724A (en) |
| CH (1) | CH593560A5 (en) |
| DE (2) | DE7603408U1 (en) |
| FR (1) | FR2339253A1 (en) |
| IT (1) | IT1075060B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2135119A (en) * | 1983-01-19 | 1984-08-22 | Westinghouse Electric Corp | Self-aligning, self-loading semiconductor clamp |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH522288A (en) * | 1970-09-29 | 1972-06-15 | Bbc Brown Boveri & Cie | Semiconductor device and method of manufacturing the same |
| DE7148146U (en) * | 1971-12-03 | 1973-11-29 | Bbc Ag | SEMI-CONDUCTOR UNIT |
-
1976
- 1976-01-22 CH CH77576A patent/CH593560A5/xx not_active IP Right Cessation
- 1976-02-06 DE DE19767603408 patent/DE7603408U1/en not_active Expired
- 1976-02-06 DE DE19762604701 patent/DE2604701A1/en not_active Withdrawn
-
1977
- 1977-01-20 CA CA270,099A patent/CA1092724A/en not_active Expired
- 1977-01-20 FR FR7701573A patent/FR2339253A1/en active Granted
- 1977-01-20 IT IT1946077A patent/IT1075060B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| IT1075060B (en) | 1985-04-22 |
| FR2339253B3 (en) | 1981-01-09 |
| CH593560A5 (en) | 1977-12-15 |
| FR2339253A1 (en) | 1977-08-19 |
| DE2604701A1 (en) | 1977-07-28 |
| DE7603408U1 (en) | 1977-11-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |