JP3410011B2 - Stack for flat type semiconductor device - Google Patents
Stack for flat type semiconductor deviceInfo
- Publication number
- JP3410011B2 JP3410011B2 JP1166398A JP1166398A JP3410011B2 JP 3410011 B2 JP3410011 B2 JP 3410011B2 JP 1166398 A JP1166398 A JP 1166398A JP 1166398 A JP1166398 A JP 1166398A JP 3410011 B2 JP3410011 B2 JP 3410011B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure contact
- pressure
- stack
- flat
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Power Conversion In General (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、平型半導体素子と
冷却体を交互に積層した積層体に圧接力を加えてなる平
型半導体素子用スタックに係り、特に圧接負荷構造に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stack for flat semiconductor devices, which is formed by applying a pressing force to a stack of alternating flat semiconductor devices and cooling bodies, and more particularly to a pressure load structure.
【０００２】[0002]
【従来の技術】半導体変換装置は大容量化（高電圧化）
の傾向にあり、それに伴い多数個の平型半導体素子が用
いられるようになって来ている。半導体変換装置は複数
個の平型半導体素子と、その平型半導体素子を冷却する
ための冷却体としてのヒートシンクを交互に積層し弾性
的な押圧力を負荷する圧接負荷部、フレームとしての絶
縁バンド又はスタッドボルトと端板、バネ等から構成し
てなる平型半導体素子用スタック（以下、単にスタック
とも言う）を半導体変換装置の回路構成要素として多数
使用している。近年、特に設置場所、スペース等の制限
から益々半導体変換装置のコンパクト化が要求されてい
るが、半導体変換装置の大容量化（高電圧化、大電流
化）は、部品の大型化を招くばかりでなく用品間の絶縁
距離確保の点からコンパクト化とは相反する要因となっ
ている。2. Description of the Related Art A semiconductor conversion device has a large capacity (higher voltage).
Therefore, a large number of flat semiconductor devices have come to be used accordingly. The semiconductor conversion device is composed of a plurality of flat semiconductor elements and a heat sink serving as a cooling body for cooling the flat semiconductor elements, which are alternately laminated to apply an elastic pressing force, and an insulating band as a frame. Alternatively, a large number of flat semiconductor element stacks (hereinafter, also simply referred to as stacks) configured by stud bolts, end plates, springs, etc. are used as circuit components of a semiconductor conversion device. In recent years, the semiconductor conversion devices have been required to be more and more compact due to the limitation of the installation place, space, etc. However, increasing the capacity of the semiconductor conversion devices (higher voltage and larger current) not only leads to larger parts. In addition, it is a factor contradictory to compactness in terms of securing insulation distance between items.
【０００３】以下、半導体変換装置に使用している従来
のスタック例を、図１２及び図１３を用いて説明する。
一般に、半導体変換装置は、モジュールと呼ばれるユニ
ットを複数台搭載して構成されている。図１２は、代表
的なモジュール内の回路を示している。モジュール３１
は、複数個の平型半導体素子３２及びその付属回路であ
るアノードリアクトル３４、分圧抵抗３５、スナバコン
デンサ３６及びスナバ抵抗３７を収納して構成されてお
り、破線の部分がスタック３０である。図１３は、スタ
ック３０の構成を示しており、同図（ａ）は正面図、同
図（ｂ）は側面図である。スタック３０は複数個の平型
半導体素子３２及びヒートシンク３３を交互に積層し、
さらにその両端に電気回路接続端子となる導体３８とそ
の外側に押さえ板３９を配置してなる積層体と、この積
層体の一方の端部に設けられるＵ字型ブロック４０から
なり、その開口側の中心に積層方向に移動可能にねじ込
まれた可動ボルト４１と、この可動ボルト４１に取付け
られたロックナット４２を備えた押さえブロック４３
と、この積層体の他方の端部に設けられるＵ字型ブロッ
ク４０からなり、その開口部の中心に積層方向に移動可
能にねじ込まれ且つさらばね４４が装着された可動ボル
ト４５を備えたブロックと、積層体と一対の押さえブロ
ックを取り囲む、例えばガラス繊維強化プラスチック絶
縁体からなる絶縁バンド４６とで構成されている。An example of a conventional stack used in a semiconductor conversion device will be described below with reference to FIGS. 12 and 13.
Generally, a semiconductor conversion device is configured by mounting a plurality of units called modules. FIG. 12 shows a circuit in a typical module. Module 31
Includes a plurality of flat semiconductor elements 32 and an anode reactor 34, which is an accessory circuit thereof, a voltage dividing resistor 35, a snubber capacitor 36, and a snubber resistor 37, and the broken line portion is a stack 30. 13A and 13B show the structure of the stack 30. FIG. 13A is a front view and FIG. 13B is a side view. The stack 30 has a plurality of flat semiconductor elements 32 and heat sinks 33 alternately stacked,
Further, a conductor 38 serving as an electric circuit connecting terminal at both ends thereof, a laminated body in which a pressing plate 39 is arranged outside the conductor 38, and a U-shaped block 40 provided at one end of the laminated body are provided on the opening side thereof. A holding block 43 provided with a movable bolt 41 screwed into the center of the movable movably in the stacking direction and a lock nut 42 attached to the movable bolt 41.
And a U-shaped block 40 provided at the other end of this laminated body, and a movable bolt 45 screwed movably in the laminating direction in the center of the opening and having a flat spring 44 mounted thereon. And an insulating band 46 surrounding the laminated body and the pair of pressing blocks, for example, made of a glass fiber reinforced plastic insulator.
【０００４】このように構成された平型半導体素子用ス
タック３０に弾性的な圧接力を保持させるため、図示し
ないプレス機により所定の圧接力を加える。その後、可
動ボルト４１を押さえ板３９に接触するまで下げ、ロッ
クナット４２がＵ字型ブロック４０の開口面に接触する
まで上げる。この状態では絶縁バンド４６により引張り
力が加わってないが、プレス機を取り去るとレーストラ
ック形状の絶縁バンド４６に圧接力の反力として引張り
力が加わる。つまり、圧接力を絶縁バンド４６の内側に
閉じ込めるような構造で絶縁バンド４６に圧接力の反力
としての引張り力が加わることになる。したがって、プ
レス機を取り去った時に加わる絶縁バンド４６の伸び分
を見込んで所定の押圧力を加えるか、或いは絶縁バンド
４６の引張り力が圧接力の反力になるまで可動ボルト４
１を押し下げる必要があった。In order to maintain the elastic pressure contact force on the flat semiconductor element stack 30 thus constructed, a predetermined press contact force is applied by a press machine (not shown). After that, the movable bolt 41 is lowered until it comes into contact with the pressing plate 39, and is raised until the lock nut 42 comes into contact with the opening surface of the U-shaped block 40. In this state, the tensile force is not applied by the insulating band 46, but when the press machine is removed, the tensile force is applied to the racetrack-shaped insulating band 46 as a reaction force of the pressure contact force. That is, a tensile force as a reaction force of the pressure contact force is applied to the insulation band 46 in a structure in which the pressure contact force is confined inside the insulation band 46. Therefore, the movable bolt 4 is applied until a predetermined pressing force is applied in consideration of the expansion of the insulating band 46 applied when the press machine is removed, or until the tensile force of the insulating band 46 becomes a reaction force of the pressure contact force.
I had to depress 1.
【０００５】[0005]
【発明が解決しようとする課題】近年、サイリスタ素子
等の平型半導体素子は、その大容量化に伴って直径が大
きくなり、積層体を構成したときの素子への圧接力が増
大している。したがって、圧接後の力を保持するための
ボルトも大径化しスパナ等の工具も大きいものを使用す
ることからネジの回転角度が思うようにとれず、締め込
むことが困難になってきている。また、スタックが大型
になり従来のプレス機で圧接するのが困難になってきて
いる。In recent years, flat semiconductor elements such as thyristor elements have increased in diameter with the increase in capacity, and the pressure contact force to the elements when forming a laminated body has increased. . Therefore, since the diameter of the bolt for holding the force after the pressure contact is large and the tool such as the spanner is also large, the rotation angle of the screw cannot be expected and the tightening becomes difficult. In addition, the stack becomes large and it is difficult to press-contact with a conventional press machine.
【０００６】本発明は、上記に鑑みてなされたもので、
第１に積層体の圧接を人力で容易に行うことができ、第
２に積層体に所要の圧接力を容易に且つ均等に負荷する
ことができ、第３に平型半導体素子に過大な圧接力が負
荷されるのを防止することができ、第４に組み立て容易
性を有する平型半導体素子用スタックを提供することを
目的とする。The present invention has been made in view of the above,
First, the laminated body can be pressure-contacted easily by human power, secondly, a required pressure-contacting force can be easily and evenly applied to the laminated body, and thirdly, the flat semiconductor element is excessively pressure-contacted. A fourth object of the present invention is to provide a stack for a flat semiconductor device, which can prevent a force from being applied and fourthly has easy assembly.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に、請求項１記載の発明は、複数個の平型半導体素子と
冷却体とを交互に積層した積層体の両端の少なくとも一
方に圧接支持体を配置し、この圧接支持体に設けたボル
トを介して前記積層体に圧接力を負荷し、フレームでそ
の圧接力を保持する平型半導体素子用スタックにおい
て、前記ボルトは、前記圧接力の負荷を分担する複数の
ボルトで構成されて前記圧接支持体の中心から等距離に
配設され、さらに、前記圧接支持体と前記積層体の間に
配設された凹凸１対の球面座と前記圧接支持体との間に
配設された加圧円板にねじ込まれるように構成してなる
ことを要旨とする。この構成により、積層体に負荷され
る圧接力が複数のボルトに均等に分担され、ボルト１本
当たりの荷重が小さくなる。また、この構成により、加
圧円板は、複数のボルトに対し共通のナットとして機能
する。少量ずつの各ボルトの締め込みを繰り返し、この
締め込みで各ボルトの締め込み量に多少の差が生じても
凹凸１対の球面座でこれが吸収されて、所要の圧接力で
積層体を均等に圧接することが可能となる。圧接できる
荷重は、ボルト１本を締め付けられる最大の力×ボルト
の本数まで可能となる。 In order to solve the above-mentioned problems, the invention according to claim 1 press-contacts at least one of both ends of a laminated body in which a plurality of flat semiconductor elements and cooling bodies are alternately laminated. In a stack for a flat-type semiconductor device, in which a support is arranged, a pressure contact force is applied to the laminated body through a bolt provided in the pressure contact support, and the pressure contact force is held by a frame, the bolt is the pressure contact force. is composed of a plurality of bolts to share the load from the center of the pressure contact support disposed equidistantly, further between the press support and the laminate
Between the pair of concave and convex spherical seats and the pressure contact support.
It is constructed so that it can be screwed into the placed pressure disk.
That is the summary. With this configuration, the pressure contact force applied to the laminated body is evenly shared by the plurality of bolts, and the load per bolt is reduced. Also, with this configuration,
The pressure disc acts as a common nut for multiple bolts
To do. Repeat tightening each bolt little by little,
Even if there is some difference in the tightening amount of each bolt due to tightening
This is absorbed by the pair of concave and convex spherical seats, and the required pressure contact force is applied.
It is possible to press the laminated body uniformly. Can be pressed
The load is the maximum force to tighten one bolt x bolt
It is possible up to the number of.
【０００８】[0008]
【０００９】請求項２記載の発明は、上記請求項１記載
の平型半導体素子用スタックにおいて、前記圧接支持体
と前記積層体の間に金属円板又は絶縁円板の何れかを配
設し、さらに前記圧接支持体と前記金属円板又は絶縁円
板の何れかとの間に加圧円板を配設し、該加圧円板に前
記複数のボルトをねじ込むように構成してなることを要
旨とする。この構成により、凹凸１対の球面座に代えて
金属円板又は絶縁円板の何れかを用いても、上記請求項
１記載の発明の作用と略同様の作用が得られる。According to a second aspect of the present invention, in the stack for a flat semiconductor device according to the first aspect, either a metal disc or an insulating disc is arranged between the pressure contact support and the laminated body. Further, a pressure disk is disposed between the pressure contact support and either the metal disk or the insulating disk, and the plurality of bolts are screwed into the pressure disk. Use as a summary. With this configuration, even if either a metal disk or an insulating disk is used instead of the pair of concave and convex spherical seats, an operation substantially similar to the operation of the invention described in claim 1 can be obtained.
【００１０】請求項３記載の発明は、上記請求項１又は
２記載の平型半導体素子用スタックにおいて、前記複数
のボルトは前記圧接支持体を貫通し、前記複数のボルト
１本毎に前記圧接支持体と前記加圧円板との間に弾性部
材を縮設してなることを要旨とする。この構成により、
各ボルトを締め込むことで弾性部材が圧縮され、その反
力が圧接力となって積層体に均等に負荷される。The invention according to claim 3 is the above-mentioned claim 1 or
In the stack for a flat semiconductor device according to 2 , the plurality of bolts penetrate the pressure contact support, and an elastic member is contracted between the pressure contact support and the pressure disk for each of the plurality of bolts. The point is to set up. With this configuration,
The elastic member is compressed by tightening the bolts, and the reaction force acts as a pressure contact force and is evenly applied to the laminated body.
【００１１】請求項４記載の発明は、上記請求項３記載
の平型半導体素子用スタックにおいて、前記加圧円板の
中心に円筒を取付け、該円筒を前記圧接支持体の中心部
に設けた孔から外部に突出させ、前記円筒内を移動自在
に貫通する丸棒を前記球面座の凹側に取付け、前記円筒
端部から前記丸棒を突出させてなることを要旨とする。
この構成により、丸棒と円筒が上下する変異の差で圧接
力が検出され、丸棒が円筒の中心に位置しているか否か
で各ボルトが均等に締め込まれているかどうかがわか
る。According to a fourth aspect of the present invention, in the flat type semiconductor device stack according to the third aspect, a cylinder is attached to the center of the pressure disk, and the cylinder is provided at the center of the press contact support. A gist of the present invention is that a round bar that projects outward from a hole and movably penetrates the inside of the cylinder is attached to the concave side of the spherical seat, and the round bar projects from the end of the cylinder.
With this configuration, the pressure contact force is detected by the difference between the up and down movement of the round bar and the cylinder, and it can be known whether or not each bolt is evenly tightened depending on whether or not the round bar is located at the center of the cylinder.
【００１２】請求項５記載の発明は、上記請求項１記載
の平型半導体素子用スタックにおいて、前記１対の球面
座の接触部分の形状をドーナツ状としてなることを要旨
とする。この構成により、複数のボルトを締め込んだと
きの圧接力は荷重点から広がる。荷重点がドーナツ状と
なることで、圧接力が分散されて積層体がより一層均等
に圧接される。[0012] According to a fifth aspect of the invention, in the flat type semiconductor device for said stack of claim 1 wherein, the gist to become the shape of the contact portion of the spherical seat of the pair as a donut shape. With this configuration, the pressure contact force when tightening the plurality of bolts spreads from the load point. Since the load points are doughnut-shaped, the pressure contact force is dispersed and the laminated body is evenly pressure contacted.
【００１３】請求項６記載の発明は、上記請求項４記載
の平型半導体素子用スタックにおいて、前記丸棒の突出
端部にねじ加工し、ナット、座金を取付けられるように
してなることを要旨とする。この構成により、組み立て
時に、加圧機構部分の各部品を圧接支持体に一体に接続
することができて、容易組み立て性が得られる。According to a sixth aspect of the present invention, in the stack for a flat semiconductor device according to the fourth aspect, the protruding end of the round bar is threaded so that a nut and a washer can be attached. And With this configuration, each part of the pressing mechanism portion can be integrally connected to the press contact support during assembly, and easy assembling can be obtained.
【００１４】[0014]
【００１５】請求項７記載の発明は、複数個の平型半導
体素子と冷却体とを交互に積層した積層体に圧接力を負
荷し、フレームでその圧接力を保持する平型半導体素子
用スタックにおいて、側周面の対称位置２箇所に第１の
孔を開けた有底の圧接円筒体に、側面に前記第１の孔に
対応した第２の孔を貫通した圧接円柱を挿入し、該圧接
円柱と前記圧接円筒体との間には弾性部材を挟んだ構造
で、予め前記圧接円柱と前記圧接円筒体間を加圧し、設
定圧接力に達した状態で前記第１、第２の孔にピンを挿
入、固定した圧接負荷装置を構成し、該圧接負荷装置を
前記積層体の端部に取付け、前記ピンを抜くことにより
前記設定圧接力を前記積層体に負荷することを要旨とす
る。この構成により、圧接負荷装置を積層体の端部に取
付け後、外部から設定圧接力と略同じ圧接力を加えると
ピンが容易に抜ける。このピンを抜くことで、設定圧接
力が積層体に負荷される。According to a seventh aspect of the present invention, a stack for flat semiconductor devices is constructed in which a pressure contact force is applied to a laminated body in which a plurality of flat semiconductor devices and cooling bodies are alternately laminated, and the frame retains the pressure contact force. In, in a bottomed press-contacting cylinder having first holes formed at two symmetrical positions on the side circumferential surface, a press-connecting cylinder penetrating a second hole corresponding to the first hole is inserted into the side surface, A structure in which an elastic member is sandwiched between the press contact cylinder and the press contact cylinder, and the first and second holes are pre-pressed between the press contact cylinder and the press contact cylinder to reach a set press contact force. A pin is inserted into and fixed to a pressure contact load device, the pressure contact load device is attached to an end portion of the laminate, and the pin is pulled out to apply the set pressure contact force to the laminate. . With this configuration, when the pressure contact load device is attached to the end portion of the laminated body and a pressure contact force substantially equal to the set pressure contact force is applied from the outside, the pin can be easily pulled out. By pulling out this pin, the set pressure contact force is applied to the laminated body.
【００１６】請求項８記載の発明は、上記請求項７記載
の平型半導体素子用スタックにおいて、前記積層体に対
する前記圧接負荷装置の取付け位置は、前記積層体の端
部に代えて、前記平型半導体素子と冷却体の積層部分の
任意位置としてなることを要旨とする。この構成によ
り、既存の平型半導体素子用スタックに圧接負荷装置を
挟み込むことで、上記請求項７記載の発明の作用と同様
の作用が得られる。圧接負荷装置における圧接円筒体及
び圧接円柱等をセラミック等の絶縁材で形成すれば、積
層部分の任意位置を絶縁する絶縁板としての機能も得ら
れる。According to an eighth aspect of the present invention, in the flat-type semiconductor element stack according to the seventh aspect , the pressure welding device is attached to the laminated body at the flat portion instead of at the end portion of the laminated body. The gist is that it is provided at an arbitrary position of the laminated portion of the semiconductor device and the cooling body. With this configuration, by sandwiching the pressure contact load device in the existing stack for flat semiconductor elements, the same action as the action of the invention described in claim 7 is obtained. If the pressure contact cylinder and the pressure contact cylinder in the pressure contact load device are formed of an insulating material such as ceramic, a function as an insulating plate that insulates an arbitrary position of the laminated portion can be obtained.
【００１７】請求項９記載の発明は、上記請求項７記載
の平型半導体素子用スタックにおいて、前記圧接円柱
に、それぞれ外部に突出するとともに前記圧接円筒体を
貫通する複数のボルトをねじ込んで設けてなることを要
旨とする。この構成により、複数のボルトが圧接負荷装
置に内蔵の圧接機構として機能する。圧接負荷装置を積
層体の端部に取付け後、複数のボルトを締め込んで設定
圧接力と略同じ圧接力にすることでピンを抜くことがで
きる。According to a ninth aspect of the invention, in the stack for a flat semiconductor device according to the seventh aspect, a plurality of bolts projecting to the outside and penetrating the pressure-contacting cylinder are provided in the pressure-contacting cylinder. The main point is to become. With this configuration, the plurality of bolts function as a pressure contact mechanism built in the pressure contact load device. The pin can be pulled out by attaching the pressure contact load device to the end of the laminated body and tightening the plurality of bolts to make the pressure contact force substantially the same as the set pressure contact force.
【００１８】請求項１０記載の発明は、上記請求項１，
２，３，４又は９記載の平型半導体素子用スタックにお
いて、前記複数のボルトの数は３の倍数とし、前記加圧
円板の中心を中心とした同一円上に等分に配置し、配置
位置が正三角形となる３本のボルトを一組として締め付
けることを要旨とする。この構成により、複数のボルト
のうち、配置位置が正三角形となる３本のボルトを一組
として締め込みを繰り返すことで、積層体をより確実に
均等に圧接することが可能となる。The invention as defined in claim 10 is based on claim 1,
In the stack for a flat semiconductor device according to 2, 3, 4 or 9, the number of the plurality of bolts is a multiple of 3, and the bolts are equally arranged on the same circle centered on the center of the pressure disk, The gist is to tighten three bolts, which are arranged in an equilateral triangle, as a set. With this configuration, among the plurality of bolts, three bolts whose arrangement position is an equilateral triangle are set as one set, and tightening is repeated, so that the stacked body can be pressed more reliably and evenly.
【００１９】[0019]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【００２０】図１は、本発明の第１の実施の形態を示す
図である。同図（ａ）は平面図、同図（ｂ）は正面図で
ある。図１において、平型半導体素子用スタック１Ａ
は、例えばガラス繊維強化プラスチック製の絶縁バンド
２でスタッキングのためのフレームが構成され、この絶
縁バンド２の内側に複数個の冷却体としてのヒートシン
ク３及び平型半導体素子４を交互に積層した積層体が設
けられ、絶縁バンド２両端部のＲ部には積層体を弾性的
な押圧力で圧接保持するための加圧機構が取付けられた
圧接支持体５が設けられている。加圧機構部分は、丸棒
６をねじ込んで取付けた凹球面座７ｂと、その丸棒６を
自在に貫通させる孔の開いた凸球面座７ａと、中心に円
筒８が取付けられ複数個のボルト１０がねじ込まれた加
圧円板１１と、複数個のボルト１０の１本毎に圧接支持
体５と加圧円板１１との間に縮設された弾性部材として
のさらばね９等により構成されている。ボルト１０は、
六角穴付き止めネジボルトや先端が一部平面の球が着い
た六角穴付き止めネジボルト等が用いられ、図１の例で
は３の倍数の６本のボルト１０が圧接支持体５の孔を貫
通し、加圧円板１１の中心から同一円の等分位置にそれ
ぞれねじ込まれている。加圧円板１１は金属板で形成さ
れている。なお、図１の例では、加圧機構は積層体の両
端に設けてあるが、何れか一方のみでもよい。FIG. 1 is a diagram showing a first embodiment of the present invention. The figure (a) is a top view and the figure (b) is a front view. In FIG. 1, a stack 1A for a flat semiconductor device
The stacking frame is composed of, for example, an insulating band 2 made of glass fiber reinforced plastic, and a plurality of heat sinks 3 as cooling bodies and flat semiconductor elements 4 are alternately stacked inside the insulating band 2. A body is provided, and a pressure contact support 5 to which a pressure mechanism for attaching and holding the laminated body with an elastic pressing force is attached is provided at the R portions at both ends of the insulating band 2. The pressurizing mechanism portion has a concave spherical seat 7b to which the round bar 6 is screwed and mounted, a convex spherical seat 7a with a hole that allows the round bar 6 to freely pass therethrough, and a cylinder 8 attached to the center of the plurality of bolts. 10 is screwed into the pressure disc 11, and each of the plurality of bolts 10 is composed of a compression spring 11 as a resilient member that is compressed between the pressure contact support 5 and the pressure disc 11 and the like. Has been done. Bolt 10
A hexagon socket set screw bolt or a hexagon set screw bolt with a partially flat ball tip is used. In the example of FIG. 1, six bolts 10 in multiples of 3 penetrate the holes of the press contact support 5. , Are respectively screwed from the center of the pressurizing disk 11 into equal positions on the same circle. The pressure disk 11 is formed of a metal plate. In the example of FIG. 1, the pressing mechanism is provided at both ends of the laminated body, but only one of them may be provided.
【００２１】上述のように構成された平型半導体素子用
スタック１Ａの作用、効果を説明する。加圧円板１１
は、複数のボルト１０に共通のナットであり、ボルト１
０を加圧円板１１にねじ込むと凸球面座７ａと加圧円板
１１との間に隙間ができ、この隙間の増加分がさらばね
９を圧縮し、その反力で球面座７ａ，７ｂを圧接する。
次の図２に示すように、ボルト１０が６本ねじ込んであ
る場合、ねじ込み位置が三角形となるボルト１０ａ、ボ
ルト１０ｂ、ボルト１０ｃと３本ずつ締め込むことで加
圧円板１１と凸球面座７ａとの隙間が広がり、締め込ま
なかったボルト１０ｄ、ボルト１０ｅ、ボルト１０ｆは
加圧円板１１ごとに持ち上げられ、このボルト１０ｄ、
ボルト１０ｅ、ボルト１０ｆにかかっていた圧縮力は低
下する。このとき、締め込んだ３本のボルト１０ａ、ボ
ルト１０ｂ、ボルト１０ｃは圧縮力が増大し、さらばね
９は６箇所全て圧縮されスタック１Ａ全体の圧接力は増
大する。次にボルト１０ｄ、ボルト１０ｅ、ボルト１０
ｆを締めると、ボルト１０ａ、ボルト１０ｂ、ボルト１
０ｃにかかる圧縮力が低くなる。この繰り返しによって
加圧円板１１と圧接支持体５の間のさらばね９を圧縮
し、その反力が加圧円板１１及びボルト１０、球面座７
ａ，７ｂと伝わりヒートシンク３や平型半導体素子４な
どを圧接することができる。圧接できる荷重は、ボルト
１本を人力で締め付けられる最大の力×ボルトの本数ま
で可能である。また、スタック１Ａの両端を同じ圧接構
造とすることにより、さらばね９の圧接変位が２倍とな
り通電時の平型半導体素子４などの熱膨張をさらばね９
の圧縮のたわみで吸収し平型半導体素子４に過大な圧接
力が負荷されるのを防止することができる。The operation and effect of the flat semiconductor element stack 1A having the above-described structure will be described. Pressure disk 11
Is a nut common to the plurality of bolts 10, and the bolt 1
When 0 is screwed into the pressure disk 11, a gap is created between the convex spherical seat 7a and the pressure disk 11, and the increased amount of this space compresses the flat spring 9, and the reaction force causes the spherical seats 7a and 7b to move. Pressure contact.
As shown in FIG. 2 below, when six bolts 10 are screwed in, the pressing disk 11 and the convex spherical seat are tightened by tightening three bolts 10a, 10b, and 10c each having a triangular screwing position. The bolt 10d, the bolt 10e, and the bolt 10f, which are not tightened, are lifted up for each pressure disk 11, and the bolt 10d,
The compressive force applied to the bolts 10e and 10f decreases. At this time, the compression force of the three bolts 10a, 10b, and 10c tightened increases, and the belleville spring 9 is compressed at all six positions, so that the pressure contact force of the entire stack 1A increases. Next, bolt 10d, bolt 10e, bolt 10
When f is tightened, bolt 10a, bolt 10b, bolt 1
The compression force applied to 0c becomes low. By repeating this, the compression spring 11 between the pressure disk 11 and the pressure support 5 is compressed, and the reaction force of the compression spring 11 and the bolt 10, the spherical seat 7
The heat sink 3 and the flat semiconductor element 4 can be pressed against each other by being transmitted to a and 7b. The load that can be pressed is up to the maximum force for tightening one bolt manually × the number of bolts. Further, by making the both ends of the stack 1A have the same pressure contact structure, the pressure contact displacement of the spiral spring 9 is doubled, and the thermal expansion of the flat semiconductor element 4 and the like during energization is suppressed by the spiral spring 9.
It is possible to prevent the flat semiconductor element 4 from being absorbed by the compression deflection and being applied with an excessive pressure contact force.
【００２２】図２及び図３には、本発明の第２の実施の
形態を示す。図２（ｂ）及び図３（ｂ）において、圧接
力の検出は、圧接支持体５と加圧円板１１との間隔Ａ1
を、凹球面座７ｂに固定された丸棒６と加圧円板１１に
固定された円筒８が上下する変位の差で検出する。圧接
力は球面座７ａ，７ｂを圧接する加圧円板１１と圧接支
持体５との間隔Ａ1 が図３（ｂ）に示すようにＡ2 に変
化すると、スタック１Ａの圧接支持体５の外側に突出し
た円筒８から丸棒６が出ている部分の長さＬ1 がゼロに
変化することで表示される。また、図２（ａ）に示すよ
うに、円筒８の中心に丸棒６の中心が位置しているかど
うかで荷重の偏りもわかる。2 and 3 show a second embodiment of the present invention. 2 (b) and 3 (b), the pressure contact force is detected by the distance A 1 between the pressure contact support 5 and the pressure disk 11.
Is detected by the difference in the vertical displacement of the round bar 6 fixed to the concave spherical seat 7b and the cylinder 8 fixed to the pressure disk 11. When the distance A 1 between the pressure disk 11 for pressing the spherical seats 7a and 7b and the pressure support 5 changes to A 2 as shown in FIG. 3 (b), the pressure contact force of the pressure support 5 of the stack 1A is changed. This is indicated by the length L 1 of the portion of the round bar 6 protruding from the cylinder 8 protruding outwardly changing to zero. Further, as shown in FIG. 2A, the deviation of the load can be known depending on whether the center of the round bar 6 is located at the center of the cylinder 8.
【００２３】本実施の形態によれば、加圧円板１１と凸
球面座７ａとの間隔を加圧円板１１に固定された円筒８
と、この円筒８内に移動自在に貫通して凹球面座７ｂに
取付けられた丸棒６との相対的な移動量の差がさらばね
９のたわみ量であり、たわみと圧縮荷重の関係から、圧
接荷重を求めることができる。また、円筒８の内径の中
心部に丸棒６が位置するようにボルト１０を締め込むこ
とで球面座７ａ，７ｂに傾きがない状態で、さらばね９
を均等に圧縮することができる。According to this embodiment, the space between the pressure disk 11 and the convex spherical seat 7a is fixed to the cylinder 8 fixed to the pressure disk 11.
And the difference in the relative amount of movement between the round bar 6 movably penetrating into the cylinder 8 and attached to the concave spherical seat 7b is the amount of deflection of the flat spring 9, and from the relationship between the deflection and the compression load. , The pressure contact load can be obtained. Further, by tightening the bolt 10 so that the round bar 6 is located at the center of the inner diameter of the cylinder 8, the spherical springs 7a and 7b are not tilted and the flat spring 9
Can be compressed evenly.
【００２４】本発明の第３の実施の形態を、前記図２
（ｂ）を用いて説明する。図２（ｂ）において、凸球面
座７ａの球面部分の先端を平らに削ったもので、凹球面
座７ｂとの接触部分の形状がドーナツ状となる。圧接力
は荷重点から広がるため、球面座の先端が接触している
と、接触している先端に圧接力が集中し、平型半導体素
子４の中央部のみの圧接力が大きくなる。A third embodiment of the present invention is shown in FIG.
An explanation will be given using (b). In FIG. 2B, the tip of the spherical portion of the convex spherical seat 7a is ground flat so that the contact portion with the concave spherical seat 7b has a donut shape. Since the pressure contact force spreads from the load point, if the tip of the spherical seat is in contact, the pressure contact force is concentrated at the contacting tip, and the pressure contact force only at the central portion of the flat semiconductor element 4 becomes large.
【００２５】本実施の形態によれば、圧接力は凸球面座
７ａと凹球面座７ｂとの接触部分を介して積層体に伝わ
るため、荷重点がドーナツ状となっていることで、圧接
力が分散されて集中することなくヒートシンク３を介し
て平型半導体素子４に伝えられる。According to the present embodiment, the pressure contact force is transmitted to the laminated body through the contact portion between the convex spherical surface seat 7a and the concave spherical surface seat 7b. Are transmitted to the flat semiconductor element 4 via the heat sink 3 without being dispersed and concentrated.
【００２６】図４には、本発明の第４の実施の形態を示
す。図４は、スタック１Ａを組み込むときの圧接負荷部
の取付け状態を示したもので、圧接支持体５に、凹球面
座７ｂ、凸球面座７ａ、加圧円板１１、複数のボルト１
０及びさらばね９を含む全ての部品を、凹球面座７ｂに
ねじ込んだ丸棒６に加工したネジ部分にナット１２及び
座金１３を取付けて締め付けることで固定できるように
したものである。FIG. 4 shows a fourth embodiment of the present invention. FIG. 4 shows the mounting state of the pressure contact load part when the stack 1A is assembled. The pressure contact support 5 has a concave spherical seat 7b, a convex spherical seat 7a, a pressure disk 11, and a plurality of bolts 1
All parts including 0 and the countersunk spring 9 can be fixed by attaching a nut 12 and a washer 13 to a threaded portion formed on the round bar 6 screwed into the concave spherical seat 7b and tightening.
【００２７】本実施の形態によれば、スタック組み立て
時に各部品を組み立てた状態で保持できるため、ヒート
シンク３や平型半導体素子４の積層組み立てが簡単にな
る。また、スタック１Ａを横置きで組み立てる場合も部
品が一体化されるため、作業しやすくなる。According to the present embodiment, since each component can be held in the assembled state at the time of assembling the stack, the heat sink 3 and the flat semiconductor element 4 can be easily laminated and assembled. Further, even when the stack 1A is assembled horizontally, the parts are integrated, which facilitates the work.
【００２８】図５には、本発明の第５の実施の形態を示
す。本実施の形態は、前記第１の実施の形態における凹
凸１対の球面座に代えて金属円板又は絶縁円板の何れか
を用いるようにしたものである。図５において、金属円
板１４を用いても、平型半導体素子４やヒートシンク３
の接触面の加工精度の差による傾きを、加圧円板１１、
複数のボルト１０及びさらばね９で調整することができ
るので、凹凸１対の球面座を用いた場合と略同じ作用、
効果が得られる。FIG. 5 shows a fifth embodiment of the present invention. In the present embodiment, either a metal disk or an insulating disk is used instead of the pair of spherical seats of the concave and convex in the first embodiment. In FIG. 5, even if the metal disk 14 is used, the flat semiconductor element 4 and the heat sink 3
The inclination due to the difference in processing accuracy of the contact surface of the pressure disc 11,
Since it can be adjusted by the plurality of bolts 10 and the belleville spring 9, the same operation as when a pair of concave and convex spherical seats is used,
The effect is obtained.
【００２９】本実施の形態によると、図５に示すよう
に、金属円板１４の板厚が均等でなかったり、図に示し
てないが平型半導体素子４とヒートシンク３の積層体全
体が傾斜していても加圧円板１１はさらばね９を圧縮し
ている反力で常に圧接支持体５と平行であり、積層体の
傾きに対しては、高低に応じてボルト１０を繰り出すこ
とで凹凸１対の球面座の場合と略同じ作用、効果が得ら
れる。また、ボルト１０と加圧円板１１のネジ部の接触
部分は加圧円板１１の厚さの範囲であるため、ボルト１
０のねじ込み長さに影響されることなくボルト１０の締
め込みトルクは複数のボルト１０全てで同じとなる。ま
た、金属円板１４のほかにセラミックなどの絶縁円板を
用いても上記と同様の作用、効果が得られる。According to this embodiment, as shown in FIG. 5, the thickness of the metal disk 14 is not uniform, or although not shown in the figure, the entire stack of the flat semiconductor element 4 and the heat sink 3 is inclined. However, the pressure disk 11 is always parallel to the press contact support 5 due to the reaction force compressing the belleville spring 9, and the bolt 10 is extended according to the height of the stack with respect to the inclination of the stack. The same operation and effect as in the case of a pair of concave and convex spherical seats can be obtained. Further, since the contact portion between the bolt 10 and the screw portion of the pressure disk 11 is within the range of the thickness of the pressure disk 11, the bolt 1
The tightening torque of the bolt 10 is the same for all the bolts 10 without being affected by the screw-in length of 0. Moreover, the same action and effect as described above can be obtained by using an insulating disk such as a ceramic in addition to the metal disk 14.
【００３０】図６には、本発明の第６の実施の形態を示
す。本実施の形態は、図６（ｂ）に示すように、圧接支
持体５に直接ねじ込んだ複数の圧接ボルト１６で、板ば
ね１５をたわませ、その反力をスタック１Ａの圧接力と
したものである。板ばね１５の材料は、ばね鋼やステン
レス鋼などであり、図６（ａ）に示すように、圧接支持
体５の内側に取付けられる。圧接ボルト１６の材料、形
状は先端に球を取付けた六角穴付きの止めネジタイプの
クランプボルトや先端を丸くした六角穴付き止めネジボ
ルトなどである。また一般の六角ボルトでも同じ作用、
効果が得られる。FIG. 6 shows a sixth embodiment of the present invention. In the present embodiment, as shown in FIG. 6B, the leaf spring 15 is deflected by a plurality of press-contact bolts 16 screwed directly into the press-contact support 5 and the reaction force thereof is used as the press-contact force of the stack 1A. It is a thing. The material of the leaf spring 15 is spring steel, stainless steel, or the like, and is attached to the inside of the press contact support 5 as shown in FIG. The material and shape of the press contact bolt 16 are a hexagon socket set screw type clamp bolt with a ball attached to the tip, a hexagon socket set screw bolt with a rounded tip, and the like. In addition, the same effect can be achieved with general hexagon bolts,
The effect is obtained.
【００３１】本実施の形態によると、圧接力を複数のボ
ルト１６で負荷するため、ボルト１本当たりの圧接力は
小さくなり人力で圧接することができる。According to the present embodiment, since the pressure contact force is applied by the plurality of bolts 16, the pressure contact force per one bolt becomes small and the pressure contact can be performed manually.
【００３２】図７及び図８には、本発明の第７の実施の
形態を示す。本実施の形態では、フレームとしてスタッ
ドボルト方式によるスタックに適用した場合を例にとっ
て説明する。図７の（ａ），（ｂ）に示す圧接負荷装置
１７は、円筒の片端部を閉じた断面がコの字型をした有
底の圧接円筒体１８と、この圧接円筒体１８に挿入され
る圧接円柱１９との間に、さらばね９や圧縮コイルばね
などの弾性部材を挟んだ構造で、スタックに取付ける前
に、両者１８，１９をプレス機などで圧縮し、設定した
圧接力に達したときピン２０を挿入し圧接円柱１９を圧
接円筒体１８に固定するものである。圧接円筒体１８や
圧接円柱１９、ピン２０は熱処理して硬くしたものであ
る。図７（ｃ）は、弾性部材装着の例として、さらばね
９の場合を示したもので、さらばね９を圧接円筒体１８
底部に均等に並べたものである。図示しないが、さらば
ね９を２段にして変位を２倍にしたいときには、１段目
のさらばね９と２段目のさらばね９との間に金属円板を
挿入することで２倍の変位を得ることができる。7 and 8 show a seventh embodiment of the present invention. In the present embodiment, a case where the frame is applied to a stack by a stud bolt method will be described as an example. The pressure welding load device 17 shown in FIGS. 7A and 7B is a bottomed pressure welding cylindrical body 18 having a U-shaped cross section with one end of the cylinder closed, and is inserted into the pressure welding cylindrical body 18. With a structure in which elastic members such as a bellows spring 9 and a compression coil spring are sandwiched between the press contact cylinder 19 and the press contact cylinder 19, both 18 and 19 are compressed by a press machine or the like before they are attached to the stack, and the set press contact force is reached. At this time, the pin 20 is inserted to fix the pressure contact cylinder 19 to the pressure contact cylinder body 18. The pressure contact cylinder 18, the pressure contact cylinder 19, and the pin 20 are hardened by heat treatment. FIG. 7 (c) shows a case of a spiral spring 9 as an example of mounting an elastic member.
They are evenly arranged on the bottom. Although not shown, when it is desired to double the displacement by making the flat spring 9 in two stages, it is possible to double the displacement by inserting a metal disc between the flat spring 9 in the first stage and the flat spring 9 in the second stage. The displacement can be obtained.
【００３３】図８は、上記のように構成した圧接負荷装
置１７を積層体の端部に組み込んだ平型半導体素子用ス
タック１Ｂの一部断面の正面図である。端板２１とスタ
ッドボルト２２で構成したフレーム中にヒートシンク
３、平型半導体素子４を積層し、両端に絶縁板２３を挟
み込み圧接負荷装置１７とともに圧縮ボルト２４で圧接
するものである。ここで、圧接負荷装置１７は、ピン２
０を挿入したままで積層体の端部に取付けてピン２０が
抜けるまで圧接力を加えればよい。ピン２０を挿入した
ときの圧接力になるとピン２０を少ない力で抜くことが
できる。図７（ｂ）に示すように、ピン２０には圧接円
筒体１８と圧接円柱１９の反発力よるせん断力が作用し
圧接力を加えないと抜くことはできない。またスタック
１Ｂの部品交換などのときは、スタック１Ｂを圧接した
ままピン２０を挿入した後に圧接力を除去し、圧接力を
圧接負荷装置１７に固定することでスタック１Ｂの圧接
力はゼロとなる。このように、圧接負荷装置１７を用い
れば、平型半導体素子４には徐々に圧接力が加わり過負
荷がかからないため安定した素子特性が得られる。ま
た、ピン２０の断面形状とピン２０を挿入する孔形状を
長円とすることで、長円の長さを微妙に変えたピン２０
を挿入することにより、圧接力の調整とピン２０のせん
断強度を向上させることができる。FIG. 8 is a front view of a partial cross section of a stack 1B for a flat semiconductor device in which the pressure contact load device 17 configured as described above is incorporated in the end portion of the laminated body. The heat sink 3 and the flat semiconductor element 4 are stacked in a frame constituted by the end plate 21 and the stud bolts 22, the insulating plates 23 are sandwiched at both ends, and the compression load 24 is pressed together with the compression load device 17. Here, the press-contact load device 17 has a pin 2
It is sufficient to attach 0 to the end portion of the laminated body while inserting 0 and apply a pressing force until the pin 20 comes off. The pin 20 can be pulled out with a small force when the pressure contact force when the pin 20 is inserted is reached. As shown in FIG. 7B, a shearing force acts on the pin 20 due to the repulsive force of the pressure contact cylinder 18 and the pressure contact cylinder 19, and the pin 20 cannot be pulled out unless the pressure contact force is applied. In addition, when the parts of the stack 1B are replaced, the pressure contact force of the stack 1B becomes zero by removing the pressure contact force after inserting the pin 20 while the stack 1B is pressure contacted and fixing the pressure contact force to the pressure contact load device 17. . As described above, when the pressure contact load device 17 is used, pressure contact force is gradually applied to the flat semiconductor element 4 and an overload is not applied, so that stable element characteristics can be obtained. Further, by making the cross-sectional shape of the pin 20 and the hole shape into which the pin 20 is inserted into an ellipse, the length of the ellipse is slightly changed.
It is possible to adjust the press contact force and improve the shear strength of the pin 20 by inserting the pin.
【００３４】図９には、本発明の第８の実施の形態を示
す。図９において、上記第７の実施の形態における圧接
負荷装置１７を、平型半導体素子用スタック１Ｂの平型
半導体素子４とヒートシンク３の積層部分の任意の位置
の部分に挿入したものである。FIG. 9 shows an eighth embodiment of the present invention. In FIG. 9, the pressure contact load device 17 according to the seventh embodiment is inserted into an arbitrary position of the laminated portion of the flat semiconductor element 4 and the heat sink 3 of the flat semiconductor element stack 1B.
【００３５】本実施の形態によれば、既存のスタックに
圧接負荷装置１７を挟み込むだけで圧接負荷できる。本
実施の形態では、圧接負荷装置１７のさらばね９以外の
材質をアルミナなどのセラミックとすることで絶縁板の
代わりに挿入可能となる。According to the present embodiment, the pressure contact load can be applied only by sandwiching the pressure contact load device 17 in the existing stack. In this embodiment, the material other than the spring 9 of the pressure contact load device 17 is made of ceramic such as alumina so that it can be inserted instead of the insulating plate.
【００３６】図１０及び図１１には、本発明の第９の実
施の形態を示す。図１０に示す圧接負荷装置２７は、圧
接円筒体１８に挿入する圧接円柱１９に複数メネジ加工
し、複数の負荷ボルト２５を圧接円筒体１８を貫通し、
さらばね９を複数個挿入し、圧接円柱１９にねじ込ん
で、プレス機などで圧縮し、上記第７の実施の形態と同
様にピン２０を挿入し取付けたもので、その他の部分の
構造は前記図７と同じである。10 and 11 show a ninth embodiment of the present invention. In the pressure contact load device 27 shown in FIG. 10, a plurality of female threads are formed on the pressure contact cylinder 19 to be inserted into the pressure contact cylinder 18, and a plurality of load bolts 25 penetrate the pressure contact cylinder 18.
A plurality of countersunk springs 9 are inserted, screwed into the press contact cylinder 19, compressed by a press machine, etc., and the pin 20 is inserted and attached in the same manner as in the above-mentioned seventh embodiment. It is the same as FIG. 7.
【００３７】図１１に、上記のように構成した圧接負荷
装置２７を積層体の端部に組み込んだ平型半導体素子用
スタック１Ｂの一部断面の正面図である。圧接負荷装置
２７の圧接円柱１９に、スタック１Ｂの端板２１とさら
ばね９と圧接円筒体１８とを貫通して、スタック１Ｂの
端板２１から複数個突出する長さの負荷ボルト２５をね
じ込み、前記第７の実施の形態と同様にピン２０を挿入
してスタック１Ｂの端部に取付けたもので、加圧構造を
内蔵した構成となっている。このように、複数の負荷ボ
ルト２５を圧接円柱１９にねじ込むことで、さらばね９
や圧縮コイルばねなどの弾性部材を圧縮し、その反力が
積層体を圧接するもので設定圧接力になると第７の実施
の形態と同様にピン２０が抜ける構造である。FIG. 11 is a front view of a partial cross section of a stack 1B for a flat semiconductor device in which the pressure contact load device 27 having the above-described structure is incorporated in the end portion of the laminated body. A load bolt 25 having a length projecting from the end plate 21 of the stack 1B, the flat spring 9 and the pressure contact cylinder 18 into the pressure contact cylinder 19 of the pressure contact load device 27 and protruding from the end plate 21 of the stack 1B is screwed. As in the seventh embodiment, the pin 20 is inserted and attached to the end portion of the stack 1B, which has a built-in pressure structure. In this way, by screwing the plurality of load bolts 25 into the pressure contact cylinder 19, the flat spring 9
The elastic member such as a compression coil spring or the like is compressed, and the reaction force presses against the laminated body, and when the set press contact force is reached, the pin 20 is pulled out similarly to the seventh embodiment.
【００３８】本実施の形態によると、圧接力を複数の負
荷ボルト２５で負荷するため負荷ボルト１本当たりの圧
接力は小さくなり、人力で圧接することが可能になる。
また、圧接機構を持っているスタックに組み込むための
特別の圧接用ボルトや油圧プレス機などを必要としな
い。According to the present embodiment, since the pressure contact force is applied by the plurality of load bolts 25, the pressure contact force per load bolt becomes small, and the pressure contact can be performed manually.
Further, there is no need for a special pressure welding bolt, a hydraulic press machine, or the like for assembling into a stack having a pressure welding mechanism.
【００３９】上述した平型半導体素子用スタック１Ａ，
１Ｂにおいて、平型半導体素子には、ＬＴＴ，ＧＴＯ，
ＩＧＢＴ，ＩＥＧＴ又はダイオード等の平型形状の半導
体素子を用いる。The above-mentioned flat semiconductor device stack 1A,
In 1B, the flat semiconductor device has LTT, GTO,
A flat semiconductor element such as an IGBT, IEGT, or diode is used.
【００４０】[0040]
【発明の効果】以上説明したように、請求項１記載の発
明によれば、ボルトは、圧接力の負荷を分担する複数の
ボルトで構成し、該複数のボルトを圧接支持体の中心か
ら等距離に配設したため、ボルト１本当たりの荷重が小
さくなって、人力で各ボルトを締め込むことができ、積
層体に所要の圧接力を容易かつ均等に負荷することがで
きる。また、前記圧接支持体と前記積層体の間に凹凸１
対の球面座を配設し、さらに前記圧接支持体と前記凹凸
１対の球面座との間に加圧円板を配設し、該加圧円板に
前記複数のボルトをねじ込むように構成したため、人力
による各ボルトの締め込み量に多少の差が生じても凹凸
１対の球面座でこれが吸収されて、所要の圧接力で積層
体を均等に圧接することができる。 As described above, according to the first aspect of the invention, the bolt is composed of a plurality of bolts that share the load of the pressure contact force, and the plurality of bolts are arranged from the center of the pressure contact support. Since the bolts are arranged at a distance, the load per bolt is reduced, and the bolts can be tightened manually, and the required pressure contact force can be easily and evenly applied to the laminate. In addition, unevenness 1 is formed between the pressure contact support and the laminate.
A pair of spherical seats are provided, and the pressure contact support and the unevenness are provided.
A pressure disc is arranged between the pair of spherical seats, and the pressure disc is
Since the plurality of bolts are configured to be screwed in, human power is required.
Even if there is some difference in the tightening amount of each bolt due to
This is absorbed by a pair of spherical seats and laminated with the required pressure contact force.
The body can be pressed evenly.
【００４１】[0041]
【００４２】請求項２記載の発明によれば、前記圧接支
持体と前記積層体の間に金属円板又は絶縁円板の何れか
を配設し、さらに前記圧接支持体と前記金属円板又は絶
縁円板の何れかとの間に加圧円板を配設し、該加圧円板
に前記複数のボルトをねじ込むように構成したため、凹
凸１対の球面座に代えて、構成容易な金属円板又は絶縁
円板の何れかを用いても、上記請求項１記載の発明の効
果と略同様の効果がある。According to the second aspect of the present invention, either a metal disc or an insulating disc is disposed between the pressure contact support and the laminated body, and the pressure contact support and the metal disc or Since a pressurizing disc is arranged between any of the insulating discs and the plurality of bolts are screwed into the pressurizing disc, it is possible to replace the spherical seats of the pair of concave and convex with a simple metal circle. Even if either a plate or an insulating disc is used, the same effect as the effect of the invention described in claim 1 can be obtained.
【００４３】請求項３記載の発明によれば、前記複数の
ボルトは前記圧接支持体を貫通し、前記複数のボルト１
本毎に前記圧接支持体と前記加圧円板との間に弾性部材
を縮設したため、圧縮された弾性部材の反力が圧接力と
なって積層体に均等に負荷することができ、また通電時
の平型半導体素子等の熱膨張が弾性部材で吸収されて平
型半導体素子に過大な圧接力が加わるのを防止すること
ができる。According to the third aspect of the present invention, the plurality of bolts pass through the press contact support, and the plurality of bolts 1
Since the elastic member is contracted between the press contact support and the pressure disc for each book, the reaction force of the compressed elastic member can be applied as a press contact force to the laminated body evenly. It is possible to prevent the thermal expansion of the flat semiconductor element or the like when energized from being absorbed by the elastic member and applying an excessive pressure contact force to the flat semiconductor element.
【００４４】請求項４記載の発明によれば、前記加圧円
板の中心に円筒を取付け、該円筒を前記圧接支持体の中
心部に設けた孔から外部に突出させ、前記円筒内を移動
自在に貫通する丸棒を前記球面座の凹側に取付け、前記
円筒端部から前記丸棒を突出させたため、丸棒と円筒が
上下する変異の差で圧接力を検出することができ、丸棒
が円筒の中心に位置しているか否かで各ボルトが均等に
締め込まれているかどうかを知ることができる。According to the fourth aspect of the present invention, a cylinder is attached to the center of the pressure disk, and the cylinder is made to project to the outside from a hole provided in the center of the press contact support and moved in the cylinder. Since a round bar freely penetrating was attached to the concave side of the spherical seat and the round bar was projected from the end of the cylinder, the pressure contact force can be detected by the difference between the up and down movement of the round bar and the cylinder. Whether or not each bolt is evenly tightened can be determined by whether or not the rod is located at the center of the cylinder.
【００４５】請求項５記載の発明によれば、前記１対の
球面座の接触部分の形状をドーナツ状としたため、複数
のボルトを締め込んだときの荷重点がドーナツ状となる
ことで圧接力が分散されて、積層体をより一層均等に圧
接することができる。According to the fifth aspect of the present invention, since the contact portions of the pair of spherical seats have a donut shape, the load point when a plurality of bolts are tightened becomes a donut shape so that the pressure contact force is increased. Are dispersed, and the laminated body can be evenly pressed against each other.
【００４６】請求項６記載の発明によれば、前記丸棒の
突出端部にねじ加工し、ナット、座金を取付けられるよ
うにしたため、組み立て時に、加圧機構部分の各部品を
圧接支持体に一体に接続することができて、容易に組み
立てを行うことができる。According to the sixth aspect of the present invention, the protruding end of the round bar is threaded so that the nut and the washer can be attached. It can be connected together and can be easily assembled.
【００４７】[0047]
【００４８】請求項７記載の発明によれば、側周面の対
称位置２箇所に第１の孔を開けた有底の圧接円筒体に、
側面に前記第１の孔に対応した第２の孔を貫通した圧接
円柱を挿入し、該圧接円柱と前記圧接円筒体との間には
弾性部材を挟んだ構造で、予め前記圧接円柱と前記圧接
円筒体間を加圧し、設定圧接力に達した状態で前記第
１、第２の孔にピンを挿入、固定した圧接負荷装置を構
成し、該圧接負荷装置を前記積層体の端部に取付け、前
記ピンを抜くことにより前記設定圧接力を積層体に負荷
するようにしたため、圧接負荷装置を積層体の端部に取
付け後、ピンを引き抜くことで、積層体に設定圧接力を
容易に負荷することができる。According to the seventh aspect of the present invention, there is provided a bottomed press-fitting cylindrical body having first holes at two symmetrical positions on the side peripheral surface,
A pressure contact cylinder penetrating a second hole corresponding to the first hole is inserted into the side surface, and an elastic member is sandwiched between the pressure contact cylinder and the pressure contact cylinder body. A pressure contact load device is constructed by pressing between the pressure contact cylinders and inserting and fixing pins into the first and second holes when the set pressure contact force is reached, and the pressure contact load device is attached to the end portion of the laminated body. Since the set pressure contact force is applied to the laminated body by mounting and removing the pin, the set pressure contact force can be easily applied to the laminated body by attaching the pressure contact load device to the end of the laminated body and then pulling out the pin. Can be loaded.
【００４９】請求項８記載の発明によれば、前記積層体
に対する前記圧接負荷装置の取付け位置は、前記積層体
の端部に代えて、前記平型半導体素子と冷却体の積層部
分の任意位置としたため、既存の平型半導体素子用スタ
ック等における積層部分の任意位置に圧接負荷装置を挟
み込むことで、上記請求項９記載の発明の効果と同様の
効果が得られる。圧接負荷装置の圧接円筒体及び圧接円
柱等をセラミック等の絶縁材で形成すれば、積層部分の
任意位置を絶縁する絶縁板としての機能を得ることがで
きる。According to the invention of claim 8 , the pressure contact load device is attached to the laminated body at an arbitrary position of the laminated portion of the flat semiconductor element and the cooling body instead of the end portion of the laminated body. Therefore, by sandwiching the pressure contact load device at an arbitrary position of the laminated portion in the existing stack for flat semiconductor elements or the like, the same effect as the effect of the invention described in claim 9 can be obtained. If the pressure contact cylinder and the pressure contact cylinder of the pressure contact load device are formed of an insulating material such as ceramic, it is possible to obtain a function as an insulating plate that insulates an arbitrary position of the laminated portion.
【００５０】請求項９記載の発明によれば、前記圧接円
柱に、それぞれ外部に突出するとともに前記圧接円筒体
を貫通する複数のボルトをねじ込んで設けたため、複数
のボルトが圧接負荷装置に内蔵の圧接機構として機能
し、圧接負荷装置を積層体の端部に取付け後、複数のボ
ルトを人力で締め込んで設定圧接力と略同じ圧接力にす
ることでピンを容易に抜くことができる。したがって、
特別の圧接用ボルトや油圧プレス機等が不要となる。According to the ninth aspect of the present invention, since the plurality of bolts projecting to the outside and penetrating the pressure-contacting cylinder are provided in the pressure-contacting cylinder, the plurality of bolts are built in the pressure-contacting load device. The pin functions as a press contact mechanism, and after the press contact load device is attached to the end portion of the laminated body, the pins can be easily pulled out by tightening a plurality of bolts manually to make the press contact force substantially the same as the set press contact force. Therefore,
No special pressure welding bolts or hydraulic press machines are required.
【００５１】請求項１０記載の発明によれば、前記複数
のボルトの数は３の倍数とし、前記加圧円板の中心を中
心とした同一円上に等分に配置し、配置位置が正三角形
となる３本のボルトを一組として締め付けるようにした
ため、所要の圧接力で積層体をより確実に均等に圧接す
ることができる。According to a tenth aspect of the present invention, the number of the plurality of bolts is a multiple of 3, and the bolts are equally arranged on the same circle centered on the center of the pressure disk, and the arrangement positions are regular. Since the three triangular bolts are tightened as one set, the laminated body can be more surely and uniformly pressed by a required pressing force.
【図１】本発明に係る平型半導体素子用スタックの第１
の実施の形態を示す平面図及び一部断面の正面図であ
る。FIG. 1 is a first of a stack for flat semiconductor devices according to the present invention.
FIG. 3 is a plan view and a partial cross-sectional front view showing the embodiment of FIG.
【図２】本発明の第２の実施の形態を示す平面図及び要
部の一部断面の正面図である。FIG. 2 is a plan view showing a second embodiment of the present invention and a front view of a partial cross section of a main part.
【図３】上記第２の実施の形態の平面図及び要部の一部
断面の正面図である。FIG. 3 is a plan view of the second embodiment and a front view of a partial cross section of a main part.
【図４】本発明の第４の実施の形態を示す要部断面図で
ある。FIG. 4 is a sectional view of an essential part showing a fourth embodiment of the present invention.
【図５】本発明の第５の実施の形態を示す要部の一部断
面の正面図である。FIG. 5 is a front view of a partial cross section of a main part showing a fifth embodiment of the present invention.
【図６】本発明の第６の実施の形態を示す平面図及び要
部の一部断面の正面図である。FIG. 6 is a plan view showing a sixth embodiment of the present invention and a front view of a partial cross section of a main part.
【図７】本発明の第７の実施の形態における圧接負荷装
置の構成を示す図である。FIG. 7 is a diagram showing a configuration of a pressure contact load device according to a seventh embodiment of the present invention.
【図８】上記第７の実施の形態の一部断面の正面図であ
る。FIG. 8 is a front view of a partial cross section of the seventh embodiment.
【図９】本発明の第８の実施の形態を示す一部断面の正
面図である。FIG. 9 is a partial cross-sectional front view showing an eighth embodiment of the present invention.
【図１０】本発明の第９の実施の形態における圧接負荷
装置の構成を示す図である。FIG. 10 is a diagram showing a configuration of a pressure contact load device according to a ninth embodiment of the present invention.
【図１１】上記第９の実施の形態の一部断面の正面図で
ある。FIG. 11 is a front view of a partial cross section of the ninth embodiment.
【図１２】従来の半導体変換装置を構成するモジュール
ユニットの回路図である。FIG. 12 is a circuit diagram of a module unit constituting a conventional semiconductor conversion device.
【図１３】従来の平型半導体素子用スタックの正面図及
び側面図である。FIG. 13 is a front view and a side view of a conventional stack for a flat semiconductor device.
１Ａ，１Ｂ 平型半導体素子用スタック ２ 絶縁バンド（フレーム） ３ ヒートシンク（冷却体） ４ 平型半導体素子 ５ 圧接支持体 ６ 丸棒 ７ａ 凸球面座 ７ｂ 凹球面座 ８ 円筒 ９ さらばね（弾性部材） １０ ボルト １１ 加圧円板 １２ ナット １３ 座金 １４ 金属円板 １５ 板ばね １６ 圧接ボルト １７，２７ 圧接負荷装置 １８ 圧接円筒体 １９ 圧接円柱 ２０ ピン ２１ 端板 ２２ 端板とともにフレームを構成するスタッドボルト ２５ 負荷ボルト 1A, 1B Stack for flat semiconductor device 2 Insulation band (frame) 3 Heat sink (cooling body) 4 Flat semiconductor device 5 Pressure support 6 round bar 7a Convex spherical seat 7b concave spherical seat 8 cylinders 9 Belleville spring (elastic member) 10 volts 11 Pressed disc 12 nuts 13 washer 14 Metal disk 15 leaf spring 16 Pressure welding bolt 17,27 Pressure contact load device 18 Pressure contact cylinder 19 Pressure contact cylinder 20 pin 21 End plate 22 Stud bolts that form a frame with end plates 25 load bolt
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H02M 1/00 H02M 7/04 Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H02M 1/00 H02M 7/04
Claims (10)
互に積層した積層体の両端の少なくとも一方に圧接支持
体を配置し、この圧接支持体に設けたボルトを介して前
記積層体に圧接力を負荷し、フレームでその圧接力を保
持する平型半導体素子用スタックにおいて、前記ボルト
は、前記圧接力の負荷を分担する複数のボルトで構成さ
れて前記圧接支持体の中心から等距離に配設され、さら
に、前記圧接支持体と前記積層体の間に配設された凹凸
１対の球面座と前記圧接支持体との間に配設された加圧
円板にねじ込まれるように構成してなることを特徴とす
る平型半導体素子用スタック。1. A pressure contact support is disposed on at least one of both ends of a laminate in which a plurality of flat semiconductor elements and a cooling body are alternately laminated, and the laminate is attached via bolts provided on the pressure contact support. loaded pressure contact force, in flat stacks for semiconductor element to hold the contact pressure in the frame, the bolt is composed of a plurality of bolts which share the load of the contact pressure
It is arranged at a constant distance from the center of the pressure contact support, further
The irregularities arranged between the pressure contact support and the laminate.
Pressurization disposed between a pair of spherical seats and the press contact support
A stack for a flat semiconductor element, which is configured to be screwed into a disk .
円板又は絶縁円板の何れかを配設し、さらに前記圧接支
持体と前記金属円板又は絶縁円板の何れかとの間に加圧
円板を配設し、該加圧円板に前記複数のボルトをねじ込
むように構成してなることを特徴とする請求項１記載の
平型半導体素子用スタック。2. A metal disc or an insulating disc is disposed between the pressure contact support and the laminated body, and further between the pressure contact support and the metal disc or the insulation disc. The stack for a flat semiconductor device according to claim 1, wherein a pressure disk is disposed on the pressure disk, and the plurality of bolts are screwed into the pressure disk.
通し、前記複数のボルト１本毎に前記圧接支持体と前記
加圧円板との間に弾性部材を縮設してなることを特徴と
する請求項１又は２記載の平型半導体素子用スタック。3. The plurality of bolts penetrate the pressure contact support, and an elastic member is contracted between the pressure contact support and the pressure disk for each of the plurality of bolts. claim 1 or 2 flat semiconductor elements stack wherein.
円筒を前記圧接支持体の中心部に設けた孔から外部に突
出させ、前記円筒内を移動自在に貫通する丸棒を前記球
面座の凹側に取付け、前記円筒端部から前記丸棒を突出
させてなることを特徴とする請求項３記載の平型半導体
素子用スタック。4. A cylinder is attached to the center of the pressure disk, the cylinder is projected to the outside from a hole provided in the center of the press contact support, and a round bar movably penetrating in the cylinder is provided. 4. The flat semiconductor device stack according to claim 3 , wherein the stack is attached to the concave side of the spherical seat, and the round bar is projected from the cylindrical end portion.
ーナツ状としてなることを特徴とする請求項１記載の平
型半導体素子用スタック。5. A flat type semiconductor device stack of claim 1 wherein the composed the shape of the contact portion of the spherical seat of the pair as a donut shape.
ト、座金を取付けられるようにしてなることを特徴とす
る請求項４記載の平型半導体素子用スタック。6. The stack for a flat-type semiconductor device according to claim 4, wherein the protruding end of the round bar is threaded so that a nut and a washer can be attached.
互に積層した積層体に圧接力を負荷し、フレームでその
圧接力を保持する平型半導体素子用スタックにおいて、
側周面の対称位置２箇所に第１の孔を開けた有底の圧接
円筒体に、側面に前記第１の孔に対応した第２の孔を貫
通した圧接円柱を挿入し、該圧接円柱と前記圧接円筒体
との間には弾性部材を挟んだ構造で、予め前記圧接円柱
と前記圧接円筒体間を加圧し、設定圧接力に達した状態
で前記第１、第２の孔にピンを挿入、固定した圧接負荷
装置を構成し、該圧接負荷装置を前記積層体の端部に取
付け、前記ピンを抜くことにより前記設定圧接力を前記
積層体に負荷することを特徴とする平型半導体素子用ス
タック。7. A stack for flat semiconductor devices, wherein a pressure contact force is applied to a laminated body in which a plurality of flat semiconductor devices and cooling bodies are alternately laminated, and the frame retains the pressure contact force.
A pressure welding cylinder having a first hole formed at two symmetrical positions on the side peripheral surface is inserted into a pressure welding cylinder having a bottom and a second hole corresponding to the first hole is inserted into the side surface of the pressure welding cylinder. An elastic member is sandwiched between the pressure contact cylinder and the pressure contact cylinder, and a pressure is applied between the pressure contact cylinder and the pressure contact cylinder in advance, and a pin is inserted into the first and second holes when a preset pressure contact force is reached. A flat type, characterized in that a pressure contact load device in which the pressure contact load device is inserted and fixed is attached, the pressure contact load device is attached to an end of the laminate, and the set pressure contact force is applied to the laminate by removing the pin. Stack for semiconductor devices.
取付け位置は、前記積層体の端部に代えて、前記平型半
導体素子と冷却体の積層部分の任意位置としてなること
を特徴とする請求項７記載の平型半導体素子用スタッ
ク。8. The mounting position of the pressure contact load device with respect to the laminated body is an arbitrary position of a laminated portion of the flat semiconductor element and the cooling body, instead of an end portion of the laminated body. Item 10. A flat-type semiconductor device stack according to item 7 .
るとともに前記圧接円筒体を貫通する複数のボルトをね
じ込んで設けてなることを特徴とする請求項７記載の平
型半導体素子用スタック。9. The stack for a flat-type semiconductor device according to claim 7 , wherein a plurality of bolts projecting to the outside and penetrating the pressure-welding cylinders are screwed into the pressure-welding cylinders.
し、前記加圧円板の中心を中心とした同一円上に等分に
配置し、配置位置が正三角形となる３本のボルトを一組
として締め付けることを特徴とする請求項１，２，３，
４又は９記載の平型半導体素子用スタック。10. The number of the plurality of bolts is a multiple of 3, and the three bolts are equidistantly arranged on the same circle centered on the center of the pressure disk, and the arrangement positions are equilateral triangles. 4. Fastening as a set , 4.
4. The stack for a flat semiconductor device according to 4 or 9 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1166398A JP3410011B2 (en) | 1998-01-23 | 1998-01-23 | Stack for flat type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1166398A JP3410011B2 (en) | 1998-01-23 | 1998-01-23 | Stack for flat type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11215804A JPH11215804A (en) | 1999-08-06 |
| JP3410011B2 true JP3410011B2 (en) | 2003-05-26 |
Family
ID=11784233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1166398A Expired - Lifetime JP3410011B2 (en) | 1998-01-23 | 1998-01-23 | Stack for flat type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3410011B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088007A (en) * | 2005-09-20 | 2007-04-05 | Toshiba Mitsubishi-Electric Industrial System Corp | Semiconductor stack |
| JP4525582B2 (en) * | 2005-12-15 | 2010-08-18 | 株式会社デンソー | Power converter |
| JP2010259203A (en) * | 2009-04-23 | 2010-11-11 | Denso Corp | Method of manufacturing power conversion apparatus |
| JP5510350B2 (en) * | 2011-01-31 | 2014-06-04 | 株式会社デンソー | Power converter and manufacturing method thereof |
| CN103430302B (en) * | 2011-03-17 | 2016-08-10 | 日本发条株式会社 | Pressing unit |
| WO2016074727A1 (en) * | 2014-11-13 | 2016-05-19 | Siemens Aktiengesellschaft | Clamping assembly, and a sub-module for a converter, comprising the clamping assembly |
| JP2017188622A (en) * | 2016-04-08 | 2017-10-12 | 東芝三菱電機産業システム株式会社 | Semiconductor device |
| JP6686848B2 (en) * | 2016-11-15 | 2020-04-22 | トヨタ自動車株式会社 | Power module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5795653A (en) * | 1980-12-05 | 1982-06-14 | Fuji Electric Co Ltd | Insulating method for thyristor stack having high voltage |
| JP3199349B2 (en) * | 1995-05-30 | 2001-08-20 | 株式会社東芝 | Semiconductor element stack |
-
1998
- 1998-01-23 JP JP1166398A patent/JP3410011B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11215804A (en) | 1999-08-06 |
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