DE7121884U - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE7121884U
DE7121884U DE19717121884U DE7121884U DE7121884U DE 7121884 U DE7121884 U DE 7121884U DE 19717121884 U DE19717121884 U DE 19717121884U DE 7121884 U DE7121884 U DE 7121884U DE 7121884 U DE7121884 U DE 7121884U
Authority
DE
Germany
Prior art keywords
protective body
semiconductor component
alkali
glass
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19717121884U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEC
Original Assignee
GEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC filed Critical GEC
Publication of DE7121884U publication Critical patent/DE7121884U/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
DE19717121884U 1970-06-08 1971-06-05 Halbleiterbauelement Expired DE7121884U (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4439170A 1970-06-08 1970-06-08

Publications (1)

Publication Number Publication Date
DE7121884U true DE7121884U (de) 1972-04-27

Family

ID=21932128

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19717121884U Expired DE7121884U (de) 1970-06-08 1971-06-05 Halbleiterbauelement
DE19712128039 Pending DE2128039A1 (de) 1970-06-08 1971-06-05 Halbleiterbauelement und Verfahren zu seiner Herstellung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19712128039 Pending DE2128039A1 (de) 1970-06-08 1971-06-05 Halbleiterbauelement und Verfahren zu seiner Herstellung

Country Status (4)

Country Link
DE (2) DE7121884U (enExample)
FR (1) FR2094112B1 (enExample)
GB (1) GB1343473A (enExample)
IE (1) IE35247B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1553243A (en) * 1975-08-04 1979-09-26 Gen Electric Semiconductor
US4168960A (en) * 1978-04-18 1979-09-25 Westinghouse Electric Corp. Method of making a glass encapsulated diode

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1303509B (enExample) * 1959-09-22 1972-07-13 Carman Laboratories Inc
US3505571A (en) * 1965-09-30 1970-04-07 Gen Electric Glass covered semiconductor device

Also Published As

Publication number Publication date
GB1343473A (en) 1974-01-10
DE2128039A1 (de) 1971-12-16
IE35247B1 (en) 1975-12-24
FR2094112B1 (enExample) 1977-08-05
IE35247L (en) 1971-12-08
FR2094112A1 (enExample) 1972-02-04

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