DE7036187U - Halbleiteranordnung. - Google Patents

Halbleiteranordnung.

Info

Publication number
DE7036187U
DE7036187U DE7036187U DE7036187U DE7036187U DE 7036187 U DE7036187 U DE 7036187U DE 7036187 U DE7036187 U DE 7036187U DE 7036187 U DE7036187 U DE 7036187U DE 7036187 U DE7036187 U DE 7036187U
Authority
DE
Germany
Prior art keywords
semiconductor
stack
assembly
connection means
head piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7036187U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE7036187U publication Critical patent/DE7036187U/de
Expired legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W74/121—
    • H10W74/131—
    • H10W76/40—
    • H10W90/00—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE7036187U 1969-10-02 1970-09-30 Halbleiteranordnung. Expired DE7036187U (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86320869A 1969-10-02 1969-10-02

Publications (1)

Publication Number Publication Date
DE7036187U true DE7036187U (de) 1972-04-27

Family

ID=25340554

Family Applications (2)

Application Number Title Priority Date Filing Date
DE7036187U Expired DE7036187U (de) 1969-10-02 1970-09-30 Halbleiteranordnung.
DE19702048067 Pending DE2048067A1 (de) 1969-10-02 1970-09-30 Halbleiteranordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19702048067 Pending DE2048067A1 (de) 1969-10-02 1970-09-30 Halbleiteranordnung

Country Status (6)

Country Link
JP (1) JPS50353B1 (Direct)
DE (2) DE7036187U (Direct)
FR (1) FR2064104B1 (Direct)
GB (1) GB1320412A (Direct)
IE (1) IE34521B1 (Direct)
SE (1) SE365067B (Direct)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
JPS63193160U (Direct) * 1987-05-30 1988-12-13
CN118451792A (zh) * 2021-12-10 2024-08-06 维谢综合半导体有限责任公司 具有增强的保护的堆叠式多芯片结构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716243A (en) * 1951-04-05 1954-09-29 Standard Telephones Cables Ltd Improvements in or relating to electrically conducting cements
FR1481857A (fr) * 1964-08-07 1967-05-19 Rca Corp Procédé de fabrication de dispositifs semiconducteurs à empilage et dispositifs semiconducteurs obtenus par ce procédé
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3416046A (en) * 1965-12-13 1968-12-10 Dickson Electronics Corp Encased zener diode assembly and method of producing same
FR1544424A (fr) * 1966-11-14 1968-10-31 Gen Electric Perfectionnements aux dispositifs à semiconducteurs encapsulés

Also Published As

Publication number Publication date
IE34521L (en) 1971-04-02
FR2064104B1 (Direct) 1974-04-26
GB1320412A (en) 1973-06-13
DE2048067A1 (de) 1971-04-22
JPS50353B1 (Direct) 1975-01-08
FR2064104A1 (Direct) 1971-07-16
IE34521B1 (en) 1975-05-28
SE365067B (Direct) 1974-03-11

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