DE69941060D1 - Lösemittelsystem für positiv-arbeitende photoresiste - Google Patents
Lösemittelsystem für positiv-arbeitende photoresisteInfo
- Publication number
- DE69941060D1 DE69941060D1 DE69941060T DE69941060T DE69941060D1 DE 69941060 D1 DE69941060 D1 DE 69941060D1 DE 69941060 T DE69941060 T DE 69941060T DE 69941060 T DE69941060 T DE 69941060T DE 69941060 D1 DE69941060 D1 DE 69941060D1
- Authority
- DE
- Germany
- Prior art keywords
- photore
- list
- positive
- working
- solvent system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002904 solvent Substances 0.000 title 1
- -1 alkylene glycol alkyl ether Chemical class 0.000 abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 239000003504 photosensitizing agent Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011877 solvent mixture Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Pyrane Compounds (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17205198A | 1998-10-14 | 1998-10-14 | |
PCT/EP1999/007299 WO2000022481A1 (en) | 1998-10-14 | 1999-10-02 | A mixed solvent system for positive photoresists |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69941060D1 true DE69941060D1 (de) | 2009-08-13 |
Family
ID=22626161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69941060T Expired - Fee Related DE69941060D1 (de) | 1998-10-14 | 1999-10-02 | Lösemittelsystem für positiv-arbeitende photoresiste |
Country Status (10)
Country | Link |
---|---|
US (1) | US6391514B1 (de) |
EP (1) | EP1131675B1 (de) |
JP (1) | JP2002527795A (de) |
KR (1) | KR100551934B1 (de) |
CN (1) | CN1160597C (de) |
AT (1) | ATE435441T1 (de) |
DE (1) | DE69941060D1 (de) |
MY (1) | MY117069A (de) |
TW (1) | TWI234051B (de) |
WO (1) | WO2000022481A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1788436B1 (de) * | 2005-11-16 | 2013-01-09 | Shin-Etsu Chemical Company, Ltd. | Nachbearbeitungsverfahren für Fotoresist-Filme |
EP3537217B1 (de) * | 2005-12-09 | 2022-08-31 | FUJIFILM Corporation | Positive resistzusammensetzung, für die positive resistzusammensetzung verwendetes harz, für die synthese des harzes verwendete verbindung und musterformungsverfahren mit verwendung positiven resistzusammensetzung |
EP1840940B8 (de) | 2006-03-28 | 2014-11-26 | Thallner, Erich, Dipl.-Ing. | Vorrichtung und Verfahren zum Beschichten eines mikro- und/oder nanostrukturierten Struktursubstrats |
JP2007260895A (ja) * | 2006-03-28 | 2007-10-11 | Erich Thallner | マイクロ構造および/またはナノ構造の構造基板をコーティングするための装置および方法 |
CN103003752A (zh) * | 2010-06-03 | 2013-03-27 | 住友电木株式会社 | 感光性树脂组合物和感光性树脂组合物的制造方法 |
US10031416B2 (en) | 2013-08-07 | 2018-07-24 | Toyo Gosei Co., Ltd. | Reagent for enhancing generation of chemical species |
WO2015022779A1 (en) * | 2013-08-14 | 2015-02-19 | Toyo Gosei Co., Ltd. | Reagent for enhancing generation of chemical species |
JP2018056178A (ja) * | 2016-09-26 | 2018-04-05 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法 |
JP6775174B2 (ja) * | 2019-10-11 | 2020-10-28 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5196289A (en) * | 1989-09-07 | 1993-03-23 | Ocg Microelectronic Materials, Inc. | Selected block phenolic oligomers and their use in radiation-sensitive resist compositions |
MX9201930A (es) * | 1991-04-26 | 1992-11-01 | Sumitomo Chemical Co | Composicion de capa protectora positiva (caso 516303). |
US5221592A (en) * | 1992-03-06 | 1993-06-22 | Hoechst Celanese Corporation | Diazo ester of a benzolactone ring compound and positive photoresist composition and element utilizing the diazo ester |
JP3488332B2 (ja) * | 1996-02-02 | 2004-01-19 | 東京応化工業株式会社 | ポジ型ホトレジスト塗布液 |
WO1998027462A1 (en) * | 1996-12-18 | 1998-06-25 | Clariant International Ltd. | Photoresist composition containing a polymeric additive |
KR100376984B1 (ko) * | 1998-04-30 | 2003-07-16 | 주식회사 하이닉스반도체 | 포토레지스트중합체및이를이용한미세패턴의형성방법 |
-
1999
- 1999-09-09 TW TW088115562A patent/TWI234051B/zh not_active IP Right Cessation
- 1999-10-02 WO PCT/EP1999/007299 patent/WO2000022481A1/en active IP Right Grant
- 1999-10-02 EP EP99950596A patent/EP1131675B1/de not_active Expired - Lifetime
- 1999-10-02 AT AT99950596T patent/ATE435441T1/de not_active IP Right Cessation
- 1999-10-02 KR KR1020017004604A patent/KR100551934B1/ko not_active IP Right Cessation
- 1999-10-02 DE DE69941060T patent/DE69941060D1/de not_active Expired - Fee Related
- 1999-10-02 JP JP2000576320A patent/JP2002527795A/ja active Pending
- 1999-10-02 CN CNB998120057A patent/CN1160597C/zh not_active Expired - Fee Related
- 1999-10-12 MY MYPI99004389A patent/MY117069A/en unknown
-
2000
- 2000-08-18 US US09/642,128 patent/US6391514B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100551934B1 (ko) | 2006-02-16 |
JP2002527795A (ja) | 2002-08-27 |
CN1160597C (zh) | 2004-08-04 |
CN1323410A (zh) | 2001-11-21 |
ATE435441T1 (de) | 2009-07-15 |
KR20010088864A (ko) | 2001-09-28 |
EP1131675B1 (de) | 2009-07-01 |
TWI234051B (en) | 2005-06-11 |
MY117069A (en) | 2004-04-30 |
WO2000022481A1 (en) | 2000-04-20 |
EP1131675A1 (de) | 2001-09-12 |
US6391514B1 (en) | 2002-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |