DE69935051T2 - BGA Widerstandsnetzwerk mit geringem Übersprechen - Google Patents

BGA Widerstandsnetzwerk mit geringem Übersprechen Download PDF

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Publication number
DE69935051T2
DE69935051T2 DE69935051T DE69935051T DE69935051T2 DE 69935051 T2 DE69935051 T2 DE 69935051T2 DE 69935051 T DE69935051 T DE 69935051T DE 69935051 T DE69935051 T DE 69935051T DE 69935051 T2 DE69935051 T2 DE 69935051T2
Authority
DE
Germany
Prior art keywords
common
resistors
resistor
resistor network
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69935051T
Other languages
German (de)
English (en)
Other versions
DE69935051D1 (de
Inventor
Terry R. Elkhart Bloom
Richard O. Wells Cooper
David L. Portland Jay Poole
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTS Corp
Original Assignee
CTS Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CTS Corp filed Critical CTS Corp
Application granted granted Critical
Publication of DE69935051D1 publication Critical patent/DE69935051D1/de
Publication of DE69935051T2 publication Critical patent/DE69935051T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Attenuators (AREA)
DE69935051T 1998-08-10 1999-07-29 BGA Widerstandsnetzwerk mit geringem Übersprechen Expired - Fee Related DE69935051T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US132081 1998-08-10
US09/132,081 US5977863A (en) 1998-08-10 1998-08-10 Low cross talk ball grid array resistor network

Publications (2)

Publication Number Publication Date
DE69935051D1 DE69935051D1 (de) 2007-03-22
DE69935051T2 true DE69935051T2 (de) 2007-11-15

Family

ID=22452375

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69935051T Expired - Fee Related DE69935051T2 (de) 1998-08-10 1999-07-29 BGA Widerstandsnetzwerk mit geringem Übersprechen

Country Status (6)

Country Link
US (1) US5977863A (https=)
EP (1) EP0980079B1 (https=)
JP (1) JP2000124015A (https=)
KR (1) KR100612773B1 (https=)
DE (1) DE69935051T2 (https=)
TW (1) TW432398B (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6326677B1 (en) 1998-09-04 2001-12-04 Cts Corporation Ball grid array resistor network
US6194979B1 (en) 1999-03-18 2001-02-27 Cts Corporation Ball grid array R-C network with high density
US6246312B1 (en) 2000-07-20 2001-06-12 Cts Corporation Ball grid array resistor terminator network
US6576489B2 (en) * 2001-05-07 2003-06-10 Applied Materials, Inc. Methods of forming microstructure devices
US6577225B1 (en) 2002-04-30 2003-06-10 Cts Corporation Array resistor network
AU2003291150A1 (en) * 2002-11-21 2004-06-18 Sanmina-Sci Corporation Laser trimming of resistors
US6972391B2 (en) * 2002-11-21 2005-12-06 Hadco Santa Clara, Inc. Laser trimming of annular passive components
US7297896B2 (en) * 2002-11-21 2007-11-20 Hadco Santa Clara, Inc. Laser trimming of resistors
US6897761B2 (en) * 2002-12-04 2005-05-24 Cts Corporation Ball grid array resistor network
US6882266B2 (en) * 2003-01-07 2005-04-19 Cts Corporation Ball grid array resistor network having a ground plane
US7180186B2 (en) * 2003-07-31 2007-02-20 Cts Corporation Ball grid array package
US6946733B2 (en) * 2003-08-13 2005-09-20 Cts Corporation Ball grid array package having testing capability after mounting
US20050062587A1 (en) * 2003-09-24 2005-03-24 Wei-Chun Yang Method and structure of a substrate with built-in via hole resistors
US7342804B2 (en) * 2004-08-09 2008-03-11 Cts Corporation Ball grid array resistor capacitor network
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
JP2007150201A (ja) * 2005-11-30 2007-06-14 Toshiba Corp チップ抵抗器
US7940148B2 (en) * 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7646255B2 (en) * 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
US20090236134A1 (en) * 2008-03-20 2009-09-24 Knecht Thomas A Low frequency ball grid array resonator
KR20160052283A (ko) * 2014-11-04 2016-05-12 삼성전기주식회사 저항 소자, 그 제조방법 및 저항 소자의 실장 기판
KR101670140B1 (ko) * 2014-12-15 2016-10-27 삼성전기주식회사 저항 소자, 그 제조방법 및 저항 소자의 실장 기판

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4332341A (en) * 1979-12-26 1982-06-01 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages using solid phase solder bonding
US4300115A (en) * 1980-06-02 1981-11-10 The United States Of America As Represented By The Secretary Of The Army Multilayer via resistors
US4658234A (en) * 1984-06-06 1987-04-14 Alps Electric Co., Ltd. Resistor network
JPH0331046Y2 (https=) * 1985-03-01 1991-07-01
US4945399A (en) * 1986-09-30 1990-07-31 International Business Machines Corporation Electronic package with integrated distributed decoupling capacitors
AU627663B2 (en) * 1990-07-25 1992-08-27 Matsushita Electric Industrial Co., Ltd. Sic thin-film thermistor
JP2637662B2 (ja) * 1992-02-25 1997-08-06 ローム株式会社 チップ型複合電子部品の製造方法及びチップ型ネットワーク抵抗器の製造方法
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
KR0130030B1 (ko) * 1994-08-25 1998-10-01 김광호 반도체 메모리 장치의 컬럼 리던던시 회로 및 그 방법
US5557502A (en) * 1995-03-02 1996-09-17 Intel Corporation Structure of a thermally and electrically enhanced plastic ball grid array package
US5661450A (en) * 1995-11-21 1997-08-26 Sun Microsystems, Inc. Low inductance termination resistor arrays
WO1997030461A1 (en) * 1996-02-15 1997-08-21 Bourns, Inc. Resistor network in ball grid array package
US5729438A (en) * 1996-06-07 1998-03-17 Motorola, Inc. Discrete component pad array carrier

Also Published As

Publication number Publication date
TW432398B (en) 2001-05-01
US5977863A (en) 1999-11-02
EP0980079B1 (en) 2007-02-07
JP2000124015A (ja) 2000-04-28
KR100612773B1 (ko) 2006-08-18
EP0980079A3 (en) 2002-01-02
KR20000016980A (ko) 2000-03-25
EP0980079A2 (en) 2000-02-16
DE69935051D1 (de) 2007-03-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee