DE69934668D1 - Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür - Google Patents

Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür

Info

Publication number
DE69934668D1
DE69934668D1 DE69934668T DE69934668T DE69934668D1 DE 69934668 D1 DE69934668 D1 DE 69934668D1 DE 69934668 T DE69934668 T DE 69934668T DE 69934668 T DE69934668 T DE 69934668T DE 69934668 D1 DE69934668 D1 DE 69934668D1
Authority
DE
Germany
Prior art keywords
wafers
loading
processing device
method therefor
water processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69934668T
Other languages
English (en)
Other versions
DE69934668T2 (de
Inventor
C Edwards
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69934668D1 publication Critical patent/DE69934668D1/de
Application granted granted Critical
Publication of DE69934668T2 publication Critical patent/DE69934668T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing
    • Y10S438/908—Utilizing cluster apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69934668T 1998-01-12 1999-01-12 Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür Expired - Lifetime DE69934668T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/005,862 US6042623A (en) 1998-01-12 1998-01-12 Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor
US5862 1998-01-12
PCT/US1999/000609 WO1999035673A1 (en) 1998-01-12 1999-01-12 Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor

Publications (2)

Publication Number Publication Date
DE69934668D1 true DE69934668D1 (de) 2007-02-15
DE69934668T2 DE69934668T2 (de) 2007-10-18

Family

ID=21718117

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934668T Expired - Lifetime DE69934668T2 (de) 1998-01-12 1999-01-12 Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür

Country Status (7)

Country Link
US (1) US6042623A (de)
EP (1) EP1048059B1 (de)
JP (1) JP3447698B2 (de)
KR (1) KR100354205B1 (de)
DE (1) DE69934668T2 (de)
TW (1) TW406285B (de)
WO (1) WO1999035673A1 (de)

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US6350321B1 (en) * 1998-12-08 2002-02-26 International Business Machines Corporation UHV horizontal hot wall cluster CVD/growth design
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
US6318945B1 (en) * 1999-07-28 2001-11-20 Brooks Automation, Inc. Substrate processing apparatus with vertically stacked load lock and substrate transport robot
US6309161B1 (en) * 1999-11-04 2001-10-30 Brooks Automation, Inc. Load lock with vertically movable support
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
EP1124252A2 (de) * 2000-02-10 2001-08-16 Applied Materials, Inc. Verfahren und Vorrichtung zur Verarbeitung von Substraten
US6609877B1 (en) * 2000-10-04 2003-08-26 The Boc Group, Inc. Vacuum chamber load lock structure and article transport mechanism
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KR20020076039A (ko) * 2001-03-27 2002-10-09 주식회사 아이피에스 자동연속 웨이퍼가공시스템 및 그를 이용한 웨이퍼가공방법
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JP3660626B2 (ja) 2002-01-15 2005-06-15 株式会社野田スクリーン 真空印刷装置
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US8029226B2 (en) * 2003-11-10 2011-10-04 Brooks Automation, Inc. Semiconductor manufacturing systems
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
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US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
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US7578650B2 (en) * 2004-07-29 2009-08-25 Kla-Tencor Technologies Corporation Quick swap load port
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US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
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US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
US20070020890A1 (en) * 2005-07-19 2007-01-25 Applied Materials, Inc. Method and apparatus for semiconductor processing
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US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
US20080251019A1 (en) * 2007-04-12 2008-10-16 Sriram Krishnaswami System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
KR101887110B1 (ko) * 2007-05-18 2018-08-09 브룩스 오토메이션 인코퍼레이티드 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
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Also Published As

Publication number Publication date
EP1048059A1 (de) 2000-11-02
US6042623A (en) 2000-03-28
WO1999035673B1 (en) 1999-09-10
WO1999035673A1 (en) 1999-07-15
DE69934668T2 (de) 2007-10-18
KR20010034036A (ko) 2001-04-25
TW406285B (en) 2000-09-21
KR100354205B1 (ko) 2002-09-26
JP3447698B2 (ja) 2003-09-16
EP1048059B1 (de) 2007-01-03
JP2002501303A (ja) 2002-01-15

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