DE69934668D1 - Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür - Google Patents

Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür

Info

Publication number
DE69934668D1
DE69934668D1 DE69934668T DE69934668T DE69934668D1 DE 69934668 D1 DE69934668 D1 DE 69934668D1 DE 69934668 T DE69934668 T DE 69934668T DE 69934668 T DE69934668 T DE 69934668T DE 69934668 D1 DE69934668 D1 DE 69934668D1
Authority
DE
Germany
Prior art keywords
wafers
loading
processing device
method therefor
water processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69934668T
Other languages
English (en)
Other versions
DE69934668T2 (de
Inventor
C Edwards
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE69934668D1 publication Critical patent/DE69934668D1/de
Publication of DE69934668T2 publication Critical patent/DE69934668T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing
    • Y10S438/908—Utilizing cluster apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69934668T 1998-01-12 1999-01-12 Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür Expired - Lifetime DE69934668T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/005,862 US6042623A (en) 1998-01-12 1998-01-12 Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor
PCT/US1999/000609 WO1999035673A1 (en) 1998-01-12 1999-01-12 Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor
US5862 2001-11-08

Publications (2)

Publication Number Publication Date
DE69934668D1 true DE69934668D1 (de) 2007-02-15
DE69934668T2 DE69934668T2 (de) 2007-10-18

Family

ID=21718117

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934668T Expired - Lifetime DE69934668T2 (de) 1998-01-12 1999-01-12 Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür

Country Status (7)

Country Link
US (1) US6042623A (de)
EP (1) EP1048059B1 (de)
JP (1) JP3447698B2 (de)
KR (1) KR100354205B1 (de)
DE (1) DE69934668T2 (de)
TW (1) TW406285B (de)
WO (1) WO1999035673A1 (de)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961269A (en) 1996-11-18 1999-10-05 Applied Materials, Inc. Three chamber load lock apparatus
KR100296651B1 (ko) * 1998-07-09 2001-10-26 윤종용 반도체진공설비및이를이용하는방법
US6350321B1 (en) * 1998-12-08 2002-02-26 International Business Machines Corporation UHV horizontal hot wall cluster CVD/growth design
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
US6318945B1 (en) * 1999-07-28 2001-11-20 Brooks Automation, Inc. Substrate processing apparatus with vertically stacked load lock and substrate transport robot
US6309161B1 (en) * 1999-11-04 2001-10-30 Brooks Automation, Inc. Load lock with vertically movable support
US6558509B2 (en) 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
EP1124252A2 (de) * 2000-02-10 2001-08-16 Applied Materials, Inc. Verfahren und Vorrichtung zur Verarbeitung von Substraten
US6609877B1 (en) * 2000-10-04 2003-08-26 The Boc Group, Inc. Vacuum chamber load lock structure and article transport mechanism
US6609869B2 (en) * 2001-01-04 2003-08-26 Asm America Transfer chamber with integral loadlock and staging station
US6575186B2 (en) 2001-01-16 2003-06-10 Chartered Semiconductor Manufacturing Ltd. Multiple speed slit valve controller
KR20020071393A (ko) * 2001-03-06 2002-09-12 주식회사 아이피에스 자동연속 웨이퍼가공시스템 및 그를 이용한 웨이퍼가공방법
KR20020073931A (ko) * 2001-03-17 2002-09-28 주식회사 아이피에스 자동연속 웨이퍼가공시스템 및 그를 이용한 웨이퍼가공방법
KR20020076039A (ko) * 2001-03-27 2002-10-09 주식회사 아이피에스 자동연속 웨이퍼가공시스템 및 그를 이용한 웨이퍼가공방법
US6585470B2 (en) * 2001-06-19 2003-07-01 Brooks Automation, Inc. System for transporting substrates
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
JP3686866B2 (ja) * 2001-12-18 2005-08-24 株式会社日立製作所 半導体製造装置及び製造方法
JP3660626B2 (ja) 2002-01-15 2005-06-15 株式会社野田スクリーン 真空印刷装置
US6899507B2 (en) * 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
WO2003100836A1 (en) * 2002-05-21 2003-12-04 Asm America, Inc. Reduced cross-contamination between chambers in a semiconductor processing tool
US6854948B1 (en) 2002-08-15 2005-02-15 Nanometrics Incorporated Stage with two substrate buffer station
US6696367B1 (en) 2002-09-27 2004-02-24 Asm America, Inc. System for the improved handling of wafers within a process tool
US8241701B2 (en) * 2005-08-31 2012-08-14 Lam Research Corporation Processes and systems for engineering a barrier surface for copper deposition
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US8029226B2 (en) 2003-11-10 2011-10-04 Brooks Automation, Inc. Semiconductor manufacturing systems
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP2007537606A (ja) * 2004-05-14 2007-12-20 ザ・ビーオーシー・グループ・インコーポレーテッド 低圧環境で物品を処理するための装置及び方法
US7784164B2 (en) 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
US8292563B2 (en) * 2004-06-28 2012-10-23 Brooks Automation, Inc. Nonproductive wafer buffer module for substrate processing apparatus
US20090304914A1 (en) * 2006-08-30 2009-12-10 Lam Research Corporation Self assembled monolayer for improving adhesion between copper and barrier layer
US7578650B2 (en) * 2004-07-29 2009-08-25 Kla-Tencor Technologies Corporation Quick swap load port
KR100615091B1 (ko) * 2004-08-16 2006-08-23 삼성전자주식회사 슬릿밸브 제어시스템 및 그 제어방법
WO2006023326A1 (en) * 2004-08-17 2006-03-02 Mattson Technology, Inc. Advanced low cost high throughput processing platform
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
US20060273815A1 (en) * 2005-06-06 2006-12-07 Applied Materials, Inc. Substrate support with integrated prober drive
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
US20070020890A1 (en) * 2005-07-19 2007-01-25 Applied Materials, Inc. Method and apparatus for semiconductor processing
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US20080067368A1 (en) * 2006-04-19 2008-03-20 Mks Instruments Inc Ionizing system for vacuum process and metrology equipment
US7665951B2 (en) * 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US20080019806A1 (en) * 2006-07-24 2008-01-24 Nyi Oo Myo Small footprint modular processing system
US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
US20080251019A1 (en) * 2007-04-12 2008-10-16 Sriram Krishnaswami System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
JP5795162B2 (ja) 2007-05-18 2015-10-14 ブルックス オートメーション インコーポレイテッド ロードロック高速排気および通気
US10541157B2 (en) 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
KR20100031681A (ko) 2007-05-18 2010-03-24 브룩스 오토메이션 인코퍼레이티드 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
JP5108557B2 (ja) * 2008-02-27 2012-12-26 東京エレクトロン株式会社 ロードロック装置および基板冷却方法
US7972961B2 (en) * 2008-10-09 2011-07-05 Asm Japan K.K. Purge step-controlled sequence of processing semiconductor wafers
US8216380B2 (en) 2009-01-08 2012-07-10 Asm America, Inc. Gap maintenance for opening to process chamber
US8287648B2 (en) 2009-02-09 2012-10-16 Asm America, Inc. Method and apparatus for minimizing contamination in semiconductor processing chamber
JP2011091160A (ja) * 2009-10-21 2011-05-06 Ulvac Japan Ltd 基板搬送装置及び基板処理装置
JP5952526B2 (ja) * 2011-02-04 2016-07-13 株式会社ダイヘン ワーク搬送システム
KR101713630B1 (ko) * 2011-11-25 2017-03-09 주식회사 원익아이피에스 기판처리시스템 및 그에 사용되는 반송모듈
KR101713629B1 (ko) * 2011-11-25 2017-03-09 주식회사 원익아이피에스 기판처리시스템 및 그에 사용되는 반송모듈
TW201639063A (zh) 2015-01-22 2016-11-01 應用材料股份有限公司 批量加熱和冷卻腔室或負載鎖定裝置
US10007198B2 (en) * 2015-09-23 2018-06-26 Globalfoundries Inc. Method including an adjustment of a plurality of wafer handling elements, system including a plurality of wafer handling elements and photolithography track
DE102017103468A1 (de) * 2017-02-21 2018-08-23 Mecora Medizintechnik Gmbh Raum und Verfahren zum Herstellen eines Raums
JP6863784B2 (ja) * 2017-03-16 2021-04-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10872803B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
US10872804B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
KR102598402B1 (ko) * 2018-07-24 2023-11-06 현대자동차 주식회사 기어 검사장치 및 이를 이용한 기어 검사방법
JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5259881A (en) * 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
JPS63157870A (ja) * 1986-12-19 1988-06-30 Anelva Corp 基板処理装置
JPS63204726A (ja) * 1987-02-20 1988-08-24 Anelva Corp 真空処理装置
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
JPH03241853A (ja) * 1990-02-20 1991-10-29 Teru Barian Kk 処理装置
US5067218A (en) * 1990-05-21 1991-11-26 Motorola, Inc. Vacuum wafer transport and processing system and method using a plurality of wafer transport arms
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP3186262B2 (ja) * 1992-10-14 2001-07-11 ソニー株式会社 半導体装置の製造方法
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
EP0608633B1 (de) * 1993-01-28 1999-03-03 Applied Materials, Inc. Verfahren zur CVD-Beschichtung einer Mehrschichtstruktur in einer einzigen Kammer
US5638687A (en) * 1994-11-21 1997-06-17 Dainippon Screen Mfg. Co., Ltd. Substrate cooling method and apparatus
TW359849B (en) * 1994-12-08 1999-06-01 Tokyo Electron Ltd Sputtering apparatus having an on board service module
US5520002A (en) * 1995-02-01 1996-05-28 Sony Corporation High speed pump for a processing vacuum chamber
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン

Also Published As

Publication number Publication date
KR20010034036A (ko) 2001-04-25
DE69934668T2 (de) 2007-10-18
JP2002501303A (ja) 2002-01-15
EP1048059B1 (de) 2007-01-03
JP3447698B2 (ja) 2003-09-16
WO1999035673A1 (en) 1999-07-15
EP1048059A1 (de) 2000-11-02
TW406285B (en) 2000-09-21
US6042623A (en) 2000-03-28
KR100354205B1 (ko) 2002-09-26
WO1999035673B1 (en) 1999-09-10

Similar Documents

Publication Publication Date Title
DE69934668D1 (de) Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür
SG63810A1 (en) Wafer processing apparatus wafer processing method and semiconductor substrate fabrication method
IL137996A0 (en) Apparatus and method for cleaning semiconductor wafers
EP1174912A4 (de) Halbleiterscheiben-erzeugungsapparat und herstellungsmethode
AU4432899A (en) Semiconductor wafer evaluating apparatus and method
DE69939573D1 (de) In-situ Messmethode und Halbleiterherstellungsapparat
DE69604810T2 (de) Halbleiter-wafer test und burn-in
DE69713108T2 (de) Schleifvorrichtung zum modifizieren von halbleiterwafer
EP1075652A4 (de) Vorrichtung und verfahren zum prüfen von halbleiterscheiben
DE69626345T2 (de) Apparat zum Laden und Abladen einer Halbleiterscheibe
DE69712561D1 (de) Vertikale Behälter für wafer
SG101431A1 (en) Semiconductor wafer having regular or irregular chip pattern and dicing method for the same
DE69937255D1 (de) Schnell-aufheiz- und -kühlvorrichtung für halbleiterwafer
DE69416771D1 (de) Inspektionsapparat für Halbleiterscheiben
DE60014994D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
SG75876A1 (en) Process and device for polishing semiconductor wafers
EP1129362A4 (de) Methode und apparat zur minimierung von überschlägen auf der halbleiterscheibe während der herstellung
AU6613000A (en) Apparatus and method for texture analysis on semiconductor wafers
ATA88697A (de) Anordnung zum behandeln wafer-förmiger gegenstände, insbesondere von siliziumwafern
SG73498A1 (en) Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus
AU3903000A (en) Semiconductor wafer cleaning apparatus and method
GB9914083D0 (en) Method and apparatus for improved semiconductor wafer polishing
GB9900410D0 (en) Methods and apparatus for cleaning,rinsing and drying wafers
EP1123639A4 (de) Thermische testträgerplatte und einbrennen auf platinebene und entsprechendes verfahren
GB0023795D0 (en) Wafer surface inspection method

Legal Events

Date Code Title Description
8364 No opposition during term of opposition