DE69931991D1 - Eine Polymerfolie verwendendes Beschichtungsverfahren, beschichtetes Produkt und Verfahren zur Herstellung von Metall-Polymer Laminaten - Google Patents
Eine Polymerfolie verwendendes Beschichtungsverfahren, beschichtetes Produkt und Verfahren zur Herstellung von Metall-Polymer LaminatenInfo
- Publication number
- DE69931991D1 DE69931991D1 DE69931991T DE69931991T DE69931991D1 DE 69931991 D1 DE69931991 D1 DE 69931991D1 DE 69931991 T DE69931991 T DE 69931991T DE 69931991 T DE69931991 T DE 69931991T DE 69931991 D1 DE69931991 D1 DE 69931991D1
- Authority
- DE
- Germany
- Prior art keywords
- polymeric film
- coated product
- making metal
- polymer laminates
- coating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/55—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/02—Alignment layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/06—Substrate layer characterised by chemical composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1059—Splitting sheet lamina in plane intermediate of faces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9756198 | 1998-04-09 | ||
JP9756198 | 1998-04-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69931991D1 true DE69931991D1 (de) | 2006-08-03 |
DE69931991T2 DE69931991T2 (de) | 2007-08-30 |
Family
ID=14195658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1999631991 Expired - Lifetime DE69931991T2 (de) | 1998-04-09 | 1999-04-06 | Eine Polymerfolie verwendendes Beschichtungsverfahren, beschichtetes Produkt und Verfahren zur Herstellung von Metallpolymer-Laminaten |
Country Status (7)
Country | Link |
---|---|
US (1) | US6334922B1 (de) |
EP (1) | EP0949067B1 (de) |
KR (1) | KR100360045B1 (de) |
CN (2) | CN1116164C (de) |
DE (1) | DE69931991T2 (de) |
HK (1) | HK1023093A1 (de) |
TW (1) | TW426608B (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19850227C1 (de) * | 1998-10-26 | 2000-06-21 | Siegfried Schwert | Schlauch zur Auskleidung von Rohrleitungen |
JP4216433B2 (ja) * | 1999-03-29 | 2009-01-28 | 株式会社クラレ | 回路基板用金属張積層板の製造方法 |
US6538211B2 (en) | 2000-08-15 | 2003-03-25 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
WO2002024791A2 (en) | 2000-09-20 | 2002-03-28 | World Properties, Inc. | Electrostatic deposition of high temperature, high performance thermoplastics |
JP4532713B2 (ja) * | 2000-10-11 | 2010-08-25 | 東洋鋼鈑株式会社 | 多層金属積層フィルム及びその製造方法 |
US6602583B2 (en) | 2000-12-14 | 2003-08-05 | World Properties, Inc. | Liquid crystalline polymer bond plies and circuits formed therefrom |
EP1220596A1 (de) | 2000-12-29 | 2002-07-03 | Icos Vision Systems N.V. | Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente |
DE60137306D1 (de) * | 2001-03-02 | 2009-02-26 | Icos Vision Systems Nv | Selbsttragendes und anpassbares Messgerät |
TW528676B (en) * | 2001-03-07 | 2003-04-21 | Kuraray Co | Method for producing metal laminate |
US20040040651A1 (en) * | 2002-08-28 | 2004-03-04 | Kuraray Co., Ltd. | Multi-layer circuit board and method of making the same |
AU2003267221A1 (en) * | 2002-09-16 | 2004-04-30 | World Properties, Inc. | Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
FR2848016B1 (fr) * | 2002-11-29 | 2005-01-28 | Nexans | Cable ignifuge |
US6764748B1 (en) | 2003-03-18 | 2004-07-20 | International Business Machines Corporation | Z-interconnections with liquid crystal polymer dielectric films |
DE10318157A1 (de) | 2003-04-17 | 2004-11-11 | Leonhard Kurz Gmbh & Co. Kg | Folie und optisches Sicherungselement |
JP5041652B2 (ja) * | 2003-05-21 | 2012-10-03 | 株式会社クラレ | フィルムの製造方法 |
JP3968068B2 (ja) * | 2003-09-30 | 2007-08-29 | 株式会社クラレ | 液晶ポリマーフィルムの製造方法 |
US7549220B2 (en) * | 2003-12-17 | 2009-06-23 | World Properties, Inc. | Method for making a multilayer circuit |
US7744802B2 (en) * | 2004-06-25 | 2010-06-29 | Intel Corporation | Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin |
JP2006137011A (ja) * | 2004-11-10 | 2006-06-01 | Kuraray Co Ltd | 金属張積層体およびその製造方法 |
US7343675B2 (en) * | 2004-11-12 | 2008-03-18 | Harris Corporation | Method of constructing a structural circuit |
US20070196578A1 (en) * | 2006-10-10 | 2007-08-23 | Michael Karp | Method and system for coating |
US8161633B2 (en) * | 2007-04-03 | 2012-04-24 | Harris Corporation | Method of fabricating non-planar circuit board |
US9117602B2 (en) | 2008-01-17 | 2015-08-25 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
US8778124B2 (en) * | 2008-01-17 | 2014-07-15 | Harris Corporation | Method for making three-dimensional liquid crystal polymer multilayer circuit boards |
US20090186169A1 (en) * | 2008-01-17 | 2009-07-23 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods |
KR100957220B1 (ko) * | 2008-03-18 | 2010-05-11 | 삼성전기주식회사 | 절연시트 제조방법과 이를 이용한 금속층적층판 및인쇄회로기판 제조방법 |
EP2111982A1 (de) * | 2008-04-25 | 2009-10-28 | Amcor Flexibles Transpac N.V. | Verfahren zur Herstellung eines dünnen Polymerfilms |
FR2968241B1 (fr) * | 2010-12-02 | 2012-12-21 | Corso Magenta | Procede de fabrication d'un article permettant l'apposition d'un film |
US8867219B2 (en) * | 2011-01-14 | 2014-10-21 | Harris Corporation | Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices |
EP2774945B1 (de) | 2011-10-31 | 2016-12-28 | Kuraray Co., Ltd. | Thermoplastischer polymerfilm aus flüssigkristall sowie laminat und leiterplatte damit |
KR102082536B1 (ko) | 2012-09-20 | 2020-02-27 | 주식회사 쿠라레 | 회로 기판 및 그 제조 방법 |
KR102339434B1 (ko) | 2013-10-03 | 2021-12-14 | 주식회사 쿠라레 | 열가소성 액정 폴리머 필름, 회로 기판, 및 그들의 제조 방법 |
CN105984745A (zh) * | 2015-02-09 | 2016-10-05 | 住化电子材料科技(无锡)有限公司 | 膜层叠体的制造装置及膜层叠体的制造方法 |
KR101655025B1 (ko) * | 2015-04-16 | 2016-09-06 | 지엠 글로벌 테크놀러지 오퍼레이션스 엘엘씨 | 차량용 변속장치의 체결부재 및 이를 포함하는 피벗 어셈블리 |
JP6656231B2 (ja) * | 2015-04-20 | 2020-03-04 | 株式会社クラレ | 金属張積層板の製造方法およびこれを用いた金属張積層板 |
WO2017154811A1 (ja) * | 2016-03-08 | 2017-09-14 | 株式会社クラレ | 金属張積層板の製造方法および金属張積層板 |
JP7238648B2 (ja) * | 2019-07-08 | 2023-03-14 | Tdk株式会社 | プリント配線板、多層プリント配線板、およびプリント配線板の製造方法 |
KR20220156004A (ko) * | 2020-03-24 | 2022-11-24 | 주식회사 쿠라레 | 금속 피복 적층체의 제조 방법 |
CN112410729B (zh) * | 2020-11-09 | 2022-12-06 | 中国科学院宁波材料技术与工程研究所 | 一种超薄液态金属薄膜及制备方法和应用 |
KR20230136346A (ko) | 2022-03-18 | 2023-09-26 | 권도형 | 웨어러블형 유해 환경 감지장치 |
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US3360422A (en) * | 1965-10-19 | 1967-12-26 | Armstrong Cork Co | Reinforced cellular floor covering |
US3813315A (en) * | 1968-12-18 | 1974-05-28 | Valyi Emery I | Method of laminating plastic to metal |
US4851503A (en) | 1986-12-29 | 1989-07-25 | Kuraray Company, Ltd. | Wholly aromatic thermotropic liquid crystal polyester |
JP2506352B2 (ja) | 1986-12-29 | 1996-06-12 | 株式会社クラレ | 全芳香族ポリエステル及びそれを用いた射出成形品の製造法 |
JP2710779B2 (ja) | 1987-06-03 | 1998-02-10 | 株式会社クラレ | 高分子液晶化合物への電場印加方法 |
JPH0639533B2 (ja) | 1988-06-17 | 1994-05-25 | 株式会社クラレ | 全芳香族ポリエステルフイルム及びその製造方法 |
US5066348A (en) * | 1989-12-04 | 1991-11-19 | James River Corporation | Method of making a flannelized film |
US5326848A (en) | 1990-07-09 | 1994-07-05 | Kuraray Co., Ltd. | Thermotropic liquid crystal polyester |
JP2963165B2 (ja) * | 1990-08-01 | 1999-10-12 | 松下電工株式会社 | 片面銅張り積層板の製造方法 |
JP3245437B2 (ja) * | 1991-04-05 | 2002-01-15 | 株式会社クラレ | 積層体の製造方法 |
JP3090706B2 (ja) | 1991-04-08 | 2000-09-25 | 株式会社クラレ | 液晶高分子よりなるフィルムの製造方法 |
JPH0564865A (ja) * | 1991-09-10 | 1993-03-19 | Toray Ind Inc | 位相差板用非晶ポリオレフイン積層シートおよび位相差板 |
US5843562A (en) | 1992-12-22 | 1998-12-01 | Hoechst Celanese Corporation | LCP films having roughened surface and process therefor |
US6027771A (en) * | 1993-02-25 | 2000-02-22 | Moriya; Akira | Liquid crystal polymer film and a method for manufacturing the same |
JP2939477B2 (ja) | 1994-08-16 | 1999-08-25 | エイチエヌエイ・ホールディングス・インコーポレーテッド | 液晶重合体−金属積層品および該積層品の製造法 |
US5529740A (en) | 1994-09-16 | 1996-06-25 | Jester; Randy D. | Process for treating liquid crystal polymer film |
US5719354A (en) | 1994-09-16 | 1998-02-17 | Hoechst Celanese Corp. | Monolithic LCP polymer microelectronic wiring modules |
EP0865905B1 (de) * | 1997-03-19 | 2004-09-15 | Sumitomo Chemical Company, Limited | Laminat aus flüssigkristalliner Polyesterharzzusammensetzung |
-
1999
- 1999-03-31 CN CN99103481A patent/CN1116164C/zh not_active Expired - Lifetime
- 1999-04-01 US US09/283,867 patent/US6334922B1/en not_active Expired - Lifetime
- 1999-04-06 EP EP19990106126 patent/EP0949067B1/de not_active Expired - Lifetime
- 1999-04-06 TW TW88105431A patent/TW426608B/zh not_active IP Right Cessation
- 1999-04-06 DE DE1999631991 patent/DE69931991T2/de not_active Expired - Lifetime
- 1999-04-07 KR KR1019990012049A patent/KR100360045B1/ko not_active IP Right Cessation
-
2000
- 2000-04-12 HK HK00102224A patent/HK1023093A1/xx not_active IP Right Cessation
-
2002
- 2002-09-29 CN CNB021435766A patent/CN1219637C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0949067A2 (de) | 1999-10-13 |
EP0949067B1 (de) | 2006-06-21 |
HK1023093A1 (en) | 2000-09-01 |
EP0949067A3 (de) | 2001-07-18 |
CN1234336A (zh) | 1999-11-10 |
CN1219637C (zh) | 2005-09-21 |
TW426608B (en) | 2001-03-21 |
KR100360045B1 (ko) | 2002-11-04 |
DE69931991T2 (de) | 2007-08-30 |
CN1404987A (zh) | 2003-03-26 |
KR19990083011A (ko) | 1999-11-25 |
CN1116164C (zh) | 2003-07-30 |
US6334922B1 (en) | 2002-01-01 |
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