DE69808225D1 - Beschichtete nicht-leitende Erzeugnisse und Verfahren zur Herstellung - Google Patents

Beschichtete nicht-leitende Erzeugnisse und Verfahren zur Herstellung

Info

Publication number
DE69808225D1
DE69808225D1 DE69808225T DE69808225T DE69808225D1 DE 69808225 D1 DE69808225 D1 DE 69808225D1 DE 69808225 T DE69808225 T DE 69808225T DE 69808225 T DE69808225 T DE 69808225T DE 69808225 D1 DE69808225 D1 DE 69808225D1
Authority
DE
Germany
Prior art keywords
manufacturing processes
coated non
conductive products
conductive
products
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69808225T
Other languages
English (en)
Other versions
DE69808225T2 (de
Inventor
Tsutomu Iizawa
Takuya Ishida
Tamotsu Murayama
Takayuki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANTO KASEI CO., LTD., YOKOSUKA, KANAGAWA, JP
Dai Nippon Toryo KK
Original Assignee
Kanto Kasei Co Ltd
Tanabe Chemical Industrial Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Kasei Co Ltd, Tanabe Chemical Industrial Inc filed Critical Kanto Kasei Co Ltd
Application granted granted Critical
Publication of DE69808225D1 publication Critical patent/DE69808225D1/de
Publication of DE69808225T2 publication Critical patent/DE69808225T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE69808225T 1997-11-27 1998-11-25 Beschichtete nicht-leitende Erzeugnisse und Verfahren zur Herstellung Expired - Fee Related DE69808225T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32657397 1997-11-27

Publications (2)

Publication Number Publication Date
DE69808225D1 true DE69808225D1 (de) 2002-10-31
DE69808225T2 DE69808225T2 (de) 2003-02-20

Family

ID=18189332

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69808225T Expired - Fee Related DE69808225T2 (de) 1997-11-27 1998-11-25 Beschichtete nicht-leitende Erzeugnisse und Verfahren zur Herstellung

Country Status (6)

Country Link
US (1) US6468593B1 (de)
EP (1) EP0920033B1 (de)
KR (1) KR100531554B1 (de)
CA (1) CA2254834A1 (de)
DE (1) DE69808225T2 (de)
ID (1) ID22590A (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6531600A (en) 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
WO2005112650A1 (en) * 2003-02-21 2005-12-01 Middleby Corporation Charbroiler
WO2004076928A2 (en) * 2003-02-21 2004-09-10 Middleby Corporation Self-cleaning oven
US7297373B2 (en) * 2005-11-18 2007-11-20 Noble Fiber Technologies, Llc Conductive composites
KR20080084812A (ko) 2005-11-22 2008-09-19 쇼킹 테크놀로지스 인코포레이티드 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US7968010B2 (en) * 2006-07-29 2011-06-28 Shocking Technologies, Inc. Method for electroplating a substrate
EP2084748A4 (de) * 2006-09-24 2011-09-28 Shocking Technologies Inc Formulierungen für ein spannungsumschaltbares dielektrisches material mit einem abgestuften spannungsansprechverhalten und herstellungsverfahren dafür
EP2067145A2 (de) * 2006-09-24 2009-06-10 Shocking Technologies, Inc. Verfahren zur plattierung von substratvorrichtungen mit einem spannungsumschaltbaren dielektrischen material und lichtunterstützung
US20090050856A1 (en) * 2007-08-20 2009-02-26 Lex Kosowsky Voltage switchable dielectric material incorporating modified high aspect ratio particles
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
KR101653426B1 (ko) 2008-09-30 2016-09-01 쇼킹 테크놀로지스 인코포레이티드 도전 코어 쉘 입자를 포함하는 전압 절환형 유전 물질
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
KR101679099B1 (ko) * 2009-03-26 2016-11-23 쇼킹 테크놀로지스 인코포레이티드 전압 스위칭형 유전 물질을 갖는 소자
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US20140227513A1 (en) * 2011-09-27 2014-08-14 Nec Corporation Bioplastic molded body and method for producing bioplastic molded body
CN104513402B (zh) * 2013-09-29 2017-11-03 深圳光启创新技术有限公司 树脂纤维复合材料的制备方法及树脂纤维复合材料
FR3019187B1 (fr) * 2014-03-27 2016-04-15 Univ Toulouse 3 Paul Sabatier Procede de preparation d'une piece composite electriquement conductrice en surface et applications

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4077853A (en) * 1975-03-25 1978-03-07 Stauffer Chemical Company Method of metallizing materials
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material
JPS6077977A (ja) * 1983-10-03 1985-05-02 Mitsubishi Rayon Co Ltd 複合材料の表面処理方法
DE3510202A1 (de) * 1985-03-21 1986-09-25 Bayer Ag, 5090 Leverkusen Elektrische leiterplatten
JP2566259B2 (ja) * 1987-11-17 1996-12-25 カヤバ工業株式会社 複合材料の表面処理方法
KR920009567B1 (ko) * 1987-12-29 1992-10-19 마쯔시다덴기산교 가부시기가이샤 산화아연위스커 및 그 제조방법
US5183594A (en) * 1988-08-29 1993-02-02 Matsushita Electric Industrial Co., Ltd. Conductive resin composition containing zinc oxide whiskers having a tetrapod structure
KR0137785B1 (ko) * 1989-02-27 1998-05-15 호리에 유키오 샤프 펜슬
JPH085981B2 (ja) * 1994-02-14 1996-01-24 栄電子工業株式会社 無極性樹脂用表面処理剤

Also Published As

Publication number Publication date
CA2254834A1 (en) 1999-05-27
US6468593B1 (en) 2002-10-22
EP0920033B1 (de) 2002-09-25
KR100531554B1 (ko) 2006-01-27
KR19990045600A (ko) 1999-06-25
ID22590A (id) 1999-11-25
DE69808225T2 (de) 2003-02-20
EP0920033A1 (de) 1999-06-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KANTO KASEI CO., LTD., YOKOSUKA, KANAGAWA, JP

Owner name: DAI NIPPON TORYO CO., LTD., OSAKA, JP

8339 Ceased/non-payment of the annual fee