ID22590A - Produk-produk tidak konduktif yang dilapisi dan metode pelapisannya - Google Patents
Produk-produk tidak konduktif yang dilapisi dan metode pelapisannyaInfo
- Publication number
- ID22590A ID22590A IDP981531A ID981531A ID22590A ID 22590 A ID22590 A ID 22590A ID P981531 A IDP981531 A ID P981531A ID 981531 A ID981531 A ID 981531A ID 22590 A ID22590 A ID 22590A
- Authority
- ID
- Indonesia
- Prior art keywords
- coated
- coating
- conductive products
- conductive
- products
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32657397 | 1997-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
ID22590A true ID22590A (id) | 1999-11-25 |
Family
ID=18189332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IDP981531A ID22590A (id) | 1997-11-27 | 1998-11-25 | Produk-produk tidak konduktif yang dilapisi dan metode pelapisannya |
Country Status (6)
Country | Link |
---|---|
US (1) | US6468593B1 (id) |
EP (1) | EP0920033B1 (id) |
KR (1) | KR100531554B1 (id) |
CA (1) | CA2254834A1 (id) |
DE (1) | DE69808225T2 (id) |
ID (1) | ID22590A (id) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU6531600A (en) | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US20070006865A1 (en) * | 2003-02-21 | 2007-01-11 | Wiker John H | Self-cleaning oven |
US20080289619A1 (en) * | 2003-02-21 | 2008-11-27 | Middleby Corporation | Charbroiler |
US7297373B2 (en) * | 2005-11-18 | 2007-11-20 | Noble Fiber Technologies, Llc | Conductive composites |
KR20080084812A (ko) | 2005-11-22 | 2008-09-19 | 쇼킹 테크놀로지스 인코포레이티드 | 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스 |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
US7968010B2 (en) * | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Method for electroplating a substrate |
EP2067145A2 (en) * | 2006-09-24 | 2009-06-10 | Shocking Technologies, Inc. | Technique for plating substrate devices using voltage switchable dielectric material and light assistance |
KR20090055017A (ko) | 2006-09-24 | 2009-06-01 | 쇼킹 테크놀로지스 인코포레이티드 | 스탭 전압 응답을 가진 전압 가변 유전 재료를 위한 조성물및 그 제조 방법 |
US20090050856A1 (en) * | 2007-08-20 | 2009-02-26 | Lex Kosowsky | Voltage switchable dielectric material incorporating modified high aspect ratio particles |
US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
US20090220771A1 (en) * | 2008-02-12 | 2009-09-03 | Robert Fleming | Voltage switchable dielectric material with superior physical properties for structural applications |
US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
WO2010039902A2 (en) | 2008-09-30 | 2010-04-08 | Shocking Technologies, Inc. | Voltage switchable dielectric material containing conductive core shelled particles |
US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
US8399773B2 (en) * | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
CN102550132A (zh) * | 2009-03-26 | 2012-07-04 | 肖克科技有限公司 | 具有电压可切换电介质材料的元件 |
US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
US9224728B2 (en) | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
CN103826844A (zh) * | 2011-09-27 | 2014-05-28 | 日本电气株式会社 | 生物塑料成型体以及生物塑料成型体的制造方法 |
CN104513402B (zh) * | 2013-09-29 | 2017-11-03 | 深圳光启创新技术有限公司 | 树脂纤维复合材料的制备方法及树脂纤维复合材料 |
FR3019187B1 (fr) * | 2014-03-27 | 2016-04-15 | Univ Toulouse 3 Paul Sabatier | Procede de preparation d'une piece composite electriquement conductrice en surface et applications |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4077853A (en) * | 1975-03-25 | 1978-03-07 | Stauffer Chemical Company | Method of metallizing materials |
US4469714A (en) * | 1983-09-02 | 1984-09-04 | Okuno Chemical Industry Co., Ltd. | Composition for bonding electroconductive metal coating to electrically nonconductive material |
JPS6077977A (ja) * | 1983-10-03 | 1985-05-02 | Mitsubishi Rayon Co Ltd | 複合材料の表面処理方法 |
DE3510202A1 (de) * | 1985-03-21 | 1986-09-25 | Bayer Ag, 5090 Leverkusen | Elektrische leiterplatten |
JP2566259B2 (ja) * | 1987-11-17 | 1996-12-25 | カヤバ工業株式会社 | 複合材料の表面処理方法 |
KR920009567B1 (ko) * | 1987-12-29 | 1992-10-19 | 마쯔시다덴기산교 가부시기가이샤 | 산화아연위스커 및 그 제조방법 |
CA1334479C (en) * | 1988-08-29 | 1995-02-21 | Minoru Yoshinaka | Conductive composition and method for making the same |
WO1990009896A1 (en) * | 1989-02-27 | 1990-09-07 | Pentel Kabushiki Kaisha | Mechanical pencil |
JPH085981B2 (ja) * | 1994-02-14 | 1996-01-24 | 栄電子工業株式会社 | 無極性樹脂用表面処理剤 |
-
1998
- 1998-11-25 US US09/200,658 patent/US6468593B1/en not_active Expired - Fee Related
- 1998-11-25 EP EP98122355A patent/EP0920033B1/en not_active Expired - Lifetime
- 1998-11-25 ID IDP981531A patent/ID22590A/id unknown
- 1998-11-25 DE DE69808225T patent/DE69808225T2/de not_active Expired - Fee Related
- 1998-11-26 CA CA002254834A patent/CA2254834A1/en not_active Abandoned
- 1998-11-26 KR KR1019980050936A patent/KR100531554B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69808225T2 (de) | 2003-02-20 |
KR19990045600A (ko) | 1999-06-25 |
DE69808225D1 (de) | 2002-10-31 |
US6468593B1 (en) | 2002-10-22 |
CA2254834A1 (en) | 1999-05-27 |
EP0920033B1 (en) | 2002-09-25 |
EP0920033A1 (en) | 1999-06-02 |
KR100531554B1 (ko) | 2006-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ID22590A (id) | Produk-produk tidak konduktif yang dilapisi dan metode pelapisannya | |
DE69720031D1 (de) | Beschichtetes nahrungsmittel und beschichtungsverfahren | |
KR960007486A (ko) | 코팅된 지지체 및 상기의 형성 방법 | |
NO983014D0 (no) | Bioaktiv belegning av overflater under anvendelse av makroinitiatorer | |
ID16656A (id) | Pelapis antikilau dan antistatik serta metoda pelapisannya | |
NO980018D0 (no) | Bioaktive belegg av overflater | |
BR9305464A (pt) | Revestimento intumescente e método de manufatura | |
BR9611102A (pt) | Composição de revestimento e substrato revestido | |
NO991405D0 (no) | Belagt partikkelformulering | |
DE69713970D1 (de) | Pulverbeschichtungsverfahren und so beschichteter Gegenstand | |
ATE225164T1 (de) | Elektrostatisches beschichtungsverfahren und dadurch erhaltene beschichtete produkte | |
GB9701229D0 (en) | Method of applying conductive coating | |
EP0913496A4 (en) | PART COATED BY HIGH-TEMPERATURE SPRAYING AND METHOD FOR THE PRODUCTION THEREOF | |
NO983012D0 (no) | Bioaktiv belegning av overflater under anvendelse av tverrbindingsmidler | |
ID24463A (id) | Metode meningkatkan ketersediaan hayati feksofenadin dan turunan-turunannya | |
GB2335202B (en) | Flame-spray process for the pre-treatment and coating of surfaces | |
DE69414872D1 (de) | Pulversprühbeschichtung | |
PL338431A1 (en) | Coating material and method of obtaining same | |
BR9508713A (pt) | Composição de revestimento e substrato revestido | |
GB9402597D0 (en) | The coating of surfaces | |
DE59610452D1 (de) | Pulverlack | |
ID21289A (id) | Metode perekatan dan peralatan daripadanya | |
ID24515A (id) | Metode pelapisan bahan logam dengan bahan pelapis termoplastik | |
BR9611023A (pt) | Composição de revestimento e substrato revestido | |
ID16119A (id) | Pelapisan baru untuk permukaan logam dan metoda penerapannya |