ID22590A - Produk-produk tidak konduktif yang dilapisi dan metode pelapisannya - Google Patents

Produk-produk tidak konduktif yang dilapisi dan metode pelapisannya

Info

Publication number
ID22590A
ID22590A IDP981531A ID981531A ID22590A ID 22590 A ID22590 A ID 22590A ID P981531 A IDP981531 A ID P981531A ID 981531 A ID981531 A ID 981531A ID 22590 A ID22590 A ID 22590A
Authority
ID
Indonesia
Prior art keywords
coated
coating
conductive products
conductive
products
Prior art date
Application number
IDP981531A
Other languages
English (en)
Inventor
Tsutomu Iijawa
Takuya Ishida
Tamotsu Murayama
Takayuki Yagi
Original Assignee
Kanto Kasei Kogyo
Tanabe Chemical Industry Co Lt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Kasei Kogyo, Tanabe Chemical Industry Co Lt filed Critical Kanto Kasei Kogyo
Publication of ID22590A publication Critical patent/ID22590A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
IDP981531A 1997-11-27 1998-11-25 Produk-produk tidak konduktif yang dilapisi dan metode pelapisannya ID22590A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32657397 1997-11-27

Publications (1)

Publication Number Publication Date
ID22590A true ID22590A (id) 1999-11-25

Family

ID=18189332

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP981531A ID22590A (id) 1997-11-27 1998-11-25 Produk-produk tidak konduktif yang dilapisi dan metode pelapisannya

Country Status (6)

Country Link
US (1) US6468593B1 (id)
EP (1) EP0920033B1 (id)
KR (1) KR100531554B1 (id)
CA (1) CA2254834A1 (id)
DE (1) DE69808225T2 (id)
ID (1) ID22590A (id)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6531600A (en) 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
WO2004076928A2 (en) 2003-02-21 2004-09-10 Middleby Corporation Self-cleaning oven
WO2005112650A1 (en) * 2003-02-21 2005-12-01 Middleby Corporation Charbroiler
US7297373B2 (en) * 2005-11-18 2007-11-20 Noble Fiber Technologies, Llc Conductive composites
WO2007062122A2 (en) 2005-11-22 2007-05-31 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US7968014B2 (en) 2006-07-29 2011-06-28 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
KR20090055017A (ko) 2006-09-24 2009-06-01 쇼킹 테크놀로지스 인코포레이티드 스탭 전압 응답을 가진 전압 가변 유전 재료를 위한 조성물및 그 제조 방법
WO2008036984A2 (en) * 2006-09-24 2008-03-27 Shocking Technologies Inc Technique for plating substrate devices using voltage switchable dielectric material and light assistance
US20090050856A1 (en) * 2007-08-20 2009-02-26 Lex Kosowsky Voltage switchable dielectric material incorporating modified high aspect ratio particles
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
WO2010039902A2 (en) 2008-09-30 2010-04-08 Shocking Technologies, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8968606B2 (en) * 2009-03-26 2015-03-03 Littelfuse, Inc. Components having voltage switchable dielectric materials
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
CN103826844A (zh) * 2011-09-27 2014-05-28 日本电气株式会社 生物塑料成型体以及生物塑料成型体的制造方法
CN104513402B (zh) * 2013-09-29 2017-11-03 深圳光启创新技术有限公司 树脂纤维复合材料的制备方法及树脂纤维复合材料
FR3019187B1 (fr) * 2014-03-27 2016-04-15 Univ Toulouse 3 Paul Sabatier Procede de preparation d'une piece composite electriquement conductrice en surface et applications

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4077853A (en) * 1975-03-25 1978-03-07 Stauffer Chemical Company Method of metallizing materials
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material
JPS6077977A (ja) * 1983-10-03 1985-05-02 Mitsubishi Rayon Co Ltd 複合材料の表面処理方法
DE3510202A1 (de) * 1985-03-21 1986-09-25 Bayer Ag, 5090 Leverkusen Elektrische leiterplatten
JP2566259B2 (ja) * 1987-11-17 1996-12-25 カヤバ工業株式会社 複合材料の表面処理方法
KR920009567B1 (ko) * 1987-12-29 1992-10-19 마쯔시다덴기산교 가부시기가이샤 산화아연위스커 및 그 제조방법
US5183594A (en) * 1988-08-29 1993-02-02 Matsushita Electric Industrial Co., Ltd. Conductive resin composition containing zinc oxide whiskers having a tetrapod structure
DE4090276T1 (de) * 1989-02-27 1991-02-21 Pentel Kk Mechanischer bleistift
JPH085981B2 (ja) * 1994-02-14 1996-01-24 栄電子工業株式会社 無極性樹脂用表面処理剤

Also Published As

Publication number Publication date
DE69808225D1 (de) 2002-10-31
EP0920033B1 (en) 2002-09-25
CA2254834A1 (en) 1999-05-27
KR19990045600A (ko) 1999-06-25
DE69808225T2 (de) 2003-02-20
EP0920033A1 (en) 1999-06-02
US6468593B1 (en) 2002-10-22
KR100531554B1 (ko) 2006-01-27

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