HK1023093A1 - Coating method utilizing a polymer film, coated product and method of making metal-polymer laminates - Google Patents

Coating method utilizing a polymer film, coated product and method of making metal-polymer laminates

Info

Publication number
HK1023093A1
HK1023093A1 HK00102224A HK00102224A HK1023093A1 HK 1023093 A1 HK1023093 A1 HK 1023093A1 HK 00102224 A HK00102224 A HK 00102224A HK 00102224 A HK00102224 A HK 00102224A HK 1023093 A1 HK1023093 A1 HK 1023093A1
Authority
HK
Hong Kong
Prior art keywords
polymer
coated product
making metal
coating method
polymer film
Prior art date
Application number
HK00102224A
Other languages
English (en)
Inventor
Yoshinobu Tanaka
Takeichi Tsudaka
Minoru Onodera
Toshiaki Sato
Original Assignee
Kuraray Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co filed Critical Kuraray Co
Publication of HK1023093A1 publication Critical patent/HK1023093A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/02—Alignment layer characterised by chemical composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/06—Substrate layer characterised by chemical composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1059—Splitting sheet lamina in plane intermediate of faces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
HK00102224A 1998-04-09 2000-04-12 Coating method utilizing a polymer film, coated product and method of making metal-polymer laminates HK1023093A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9756198 1998-04-09

Publications (1)

Publication Number Publication Date
HK1023093A1 true HK1023093A1 (en) 2000-09-01

Family

ID=14195658

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00102224A HK1023093A1 (en) 1998-04-09 2000-04-12 Coating method utilizing a polymer film, coated product and method of making metal-polymer laminates

Country Status (7)

Country Link
US (1) US6334922B1 (xx)
EP (1) EP0949067B1 (xx)
KR (1) KR100360045B1 (xx)
CN (2) CN1116164C (xx)
DE (1) DE69931991T2 (xx)
HK (1) HK1023093A1 (xx)
TW (1) TW426608B (xx)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19850227C1 (de) * 1998-10-26 2000-06-21 Siegfried Schwert Schlauch zur Auskleidung von Rohrleitungen
JP4216433B2 (ja) * 1999-03-29 2009-01-28 株式会社クラレ 回路基板用金属張積層板の製造方法
WO2002049405A2 (en) * 2000-08-15 2002-06-20 World Properties, Inc. Multi-layer circuits and methods of manufacture thereof
US6761834B2 (en) 2000-09-20 2004-07-13 World Properties, Inc. Electrostatic deposition of high temperature, high performance liquid crystalline polymers
JP4532713B2 (ja) * 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
AU2002227246A1 (en) 2000-12-14 2002-06-24 World Properties Inc. Liquid crystalline polymer bond plies and circuits formed therefrom
EP1220596A1 (en) 2000-12-29 2002-07-03 Icos Vision Systems N.V. A method and an apparatus for measuring positions of contact elements of an electronic component
EP1237178B8 (en) * 2001-03-02 2009-03-25 Icos Vision Systems N.V. Self-supporting adaptable metrology device
TW528676B (en) * 2001-03-07 2003-04-21 Kuraray Co Method for producing metal laminate
US20040040651A1 (en) * 2002-08-28 2004-03-04 Kuraray Co., Ltd. Multi-layer circuit board and method of making the same
JP2005539382A (ja) * 2002-09-16 2005-12-22 ワールド・プロパティーズ・インコーポレイテッド 液晶ポリマ複合物、その製造方法、およびそれから形成された物品
FR2848016B1 (fr) * 2002-11-29 2005-01-28 Nexans Cable ignifuge
US6764748B1 (en) 2003-03-18 2004-07-20 International Business Machines Corporation Z-interconnections with liquid crystal polymer dielectric films
DE10318157A1 (de) 2003-04-17 2004-11-11 Leonhard Kurz Gmbh & Co. Kg Folie und optisches Sicherungselement
JP5041652B2 (ja) * 2003-05-21 2012-10-03 株式会社クラレ フィルムの製造方法
JP3968068B2 (ja) * 2003-09-30 2007-08-29 株式会社クラレ 液晶ポリマーフィルムの製造方法
US7549220B2 (en) 2003-12-17 2009-06-23 World Properties, Inc. Method for making a multilayer circuit
US7744802B2 (en) * 2004-06-25 2010-06-29 Intel Corporation Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
JP2006137011A (ja) * 2004-11-10 2006-06-01 Kuraray Co Ltd 金属張積層体およびその製造方法
US7343675B2 (en) * 2004-11-12 2008-03-18 Harris Corporation Method of constructing a structural circuit
US20070196578A1 (en) * 2006-10-10 2007-08-23 Michael Karp Method and system for coating
US8161633B2 (en) * 2007-04-03 2012-04-24 Harris Corporation Method of fabricating non-planar circuit board
US9117602B2 (en) 2008-01-17 2015-08-25 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
US20090186169A1 (en) * 2008-01-17 2009-07-23 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods
US8778124B2 (en) * 2008-01-17 2014-07-15 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
KR100957220B1 (ko) * 2008-03-18 2010-05-11 삼성전기주식회사 절연시트 제조방법과 이를 이용한 금속층적층판 및인쇄회로기판 제조방법
EP2111982A1 (en) * 2008-04-25 2009-10-28 Amcor Flexibles Transpac N.V. Method for the production of thin polymer film
FR2968241B1 (fr) * 2010-12-02 2012-12-21 Corso Magenta Procede de fabrication d'un article permettant l'apposition d'un film
US8867219B2 (en) * 2011-01-14 2014-10-21 Harris Corporation Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
EP2774945B1 (en) 2011-10-31 2016-12-28 Kuraray Co., Ltd. Thermoplastic liquid crystal polymer film, and laminate and circuit board using same
CN104663007B (zh) 2012-09-20 2017-10-24 株式会社可乐丽 电路基板及其制造方法
JP6499584B2 (ja) 2013-10-03 2019-04-10 株式会社クラレ 熱可塑性液晶ポリマーフィルム、回路基板、およびそれらの製造方法
CN105984745A (zh) * 2015-02-09 2016-10-05 住化电子材料科技（无锡）有限公司 膜层叠体的制造装置及膜层叠体的制造方法
KR101655025B1 (ko) * 2015-04-16 2016-09-06 지엠 글로벌 테크놀러지 오퍼레이션스 엘엘씨 차량용 변속장치의 체결부재 및 이를 포함하는 피벗 어셈블리
US10987911B2 (en) * 2015-04-20 2021-04-27 Kuraray Co., Ltd. Metal-clad laminate sheet manufacturing method, and metal-clad laminate sheet using the same
EP3427926B1 (en) * 2016-03-08 2022-09-21 Kuraray Co., Ltd. Method for producing metal-clad laminate, and metal-clad laminate
JP7238648B2 (ja) * 2019-07-08 2023-03-14 Tdk株式会社 プリント配線板、多層プリント配線板、およびプリント配線板の製造方法
WO2021193194A1 (ja) * 2020-03-24 2021-09-30 株式会社クラレ 金属張積層体の製造方法
CN112410729B (zh) * 2020-11-09 2022-12-06 中国科学院宁波材料技术与工程研究所 一种超薄液态金属薄膜及制备方法和应用
KR20230136346A (ko) 2022-03-18 2023-09-26 권도형 웨어러블형 유해 환경 감지장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3360422A (en) * 1965-10-19 1967-12-26 Armstrong Cork Co Reinforced cellular floor covering
US3813315A (en) * 1968-12-18 1974-05-28 Valyi Emery I Method of laminating plastic to metal
US4851503A (en) 1986-12-29 1989-07-25 Kuraray Company, Ltd. Wholly aromatic thermotropic liquid crystal polyester
JP2506352B2 (ja) 1986-12-29 1996-06-12 株式会社クラレ 全芳香族ポリエステル及びそれを用いた射出成形品の製造法
JP2710779B2 (ja) 1987-06-03 1998-02-10 株式会社クラレ 高分子液晶化合物への電場印加方法
JPH0639533B2 (ja) 1988-06-17 1994-05-25 株式会社クラレ 全芳香族ポリエステルフイルム及びその製造方法
US5066348A (en) * 1989-12-04 1991-11-19 James River Corporation Method of making a flannelized film
US5326848A (en) 1990-07-09 1994-07-05 Kuraray Co., Ltd. Thermotropic liquid crystal polyester
JP2963165B2 (ja) * 1990-08-01 1999-10-12 松下電工株式会社 片面銅張り積層板の製造方法
JP3245437B2 (ja) * 1991-04-05 2002-01-15 株式会社クラレ 積層体の製造方法
JP3090706B2 (ja) 1991-04-08 2000-09-25 株式会社クラレ 液晶高分子よりなるフィルムの製造方法
JPH0564865A (ja) * 1991-09-10 1993-03-19 Toray Ind Inc 位相差板用非晶ポリオレフイン積層シートおよび位相差板
US5843562A (en) 1992-12-22 1998-12-01 Hoechst Celanese Corporation LCP films having roughened surface and process therefor
US6027771A (en) * 1993-02-25 2000-02-22 Moriya; Akira Liquid crystal polymer film and a method for manufacturing the same
JP2939477B2 (ja) 1994-08-16 1999-08-25 エイチエヌエイ・ホールディングス・インコーポレーテッド 液晶重合体−金属積層品および該積層品の製造法
US5719354A (en) 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
US5529740A (en) 1994-09-16 1996-06-25 Jester; Randy D. Process for treating liquid crystal polymer film
EP0865905B1 (en) * 1997-03-19 2004-09-15 Sumitomo Chemical Company, Limited Laminate of liquid crystal polyester resin composition

Also Published As

Publication number Publication date
EP0949067B1 (en) 2006-06-21
CN1234336A (zh) 1999-11-10
DE69931991D1 (de) 2006-08-03
TW426608B (en) 2001-03-21
CN1116164C (zh) 2003-07-30
EP0949067A3 (en) 2001-07-18
KR19990083011A (ko) 1999-11-25
EP0949067A2 (en) 1999-10-13
KR100360045B1 (ko) 2002-11-04
US6334922B1 (en) 2002-01-01
DE69931991T2 (de) 2007-08-30
CN1404987A (zh) 2003-03-26
CN1219637C (zh) 2005-09-21

Similar Documents

Publication Publication Date Title
HK1023093A1 (en) Coating method utilizing a polymer film, coated product and method of making metal-polymer laminates
GB2350365B (en) Thermosetting water-borne coating composition,method of forming a coating film using same,and method of forming a multilayer coating film
AU9660598A (en) A method of providing a substrate with a biocompatible coating
AU7498096A (en) Sugar-free material for forming a hard coating, and method for applying same
AU7435896A (en) Coated plastic substrate
NO20002703L (no) FremgangsmÕte for fremstilling av et termoplastisk overtrekk, og gjenstander fremstilt av dette
GB9920903D0 (en) Method for coating a resist film and rsist coater
AU4645496A (en) Multiple layer coating method
AU2561399A (en) A method of forming a coating onto a non-random monolayer of particles, and products formed thereby
SG90265A1 (en) A leaf coater and method for producing leaf type coated substrates
AU4458796A (en) Curable resin composition, coating composition and method for forming coated film
AU1944597A (en) Thermoplastic resin coated aluminum alloy sheet, and method and apparatus for production thereof
AU1087500A (en) Method for producing a coating made of powdered materials and device for realising the same
PL324846A1 (en) Aqueous coating composition, katalyst for such aqueous coating composition, method of obtaining such catalyst and method of coating surface of a product with a polymer and method of coating metallic substrate with a polymer
AU2225095A (en) Curable resin composition, coating composition, coating method and coated article
GB0016567D0 (en) Multicolor coating composition, coating film forming method and coated article
AU6118098A (en) Coating composition, coated object, and coating method
GB9903410D0 (en) Curable resin composition,coating.multilayer film-forming method and coated material
AU7429096A (en) A coating medium, a method of producing multi-layer coatings and the use of the coating medium
PL336898A1 (en) Method of depositing a thermoplastic plastic coating on a metal substrate
AU2084495A (en) Curable resin composition, coating composition, coating method and coated article
AU8138498A (en) Coated part, coating and method of coating
AU7508000A (en) Method and apparatus for coating a product
AU4758196A (en) Thermoplastic spray and coating and method therefor
AU1861095A (en) Coating composition, process for forming cured film and coated article

Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20190405