DE69927118D1 - Verfahren zur Herstellung eines Halbleitersensors für eine dynamische Grösse - Google Patents

Verfahren zur Herstellung eines Halbleitersensors für eine dynamische Grösse

Info

Publication number
DE69927118D1
DE69927118D1 DE69927118T DE69927118T DE69927118D1 DE 69927118 D1 DE69927118 D1 DE 69927118D1 DE 69927118 T DE69927118 T DE 69927118T DE 69927118 T DE69927118 T DE 69927118T DE 69927118 D1 DE69927118 D1 DE 69927118D1
Authority
DE
Germany
Prior art keywords
producing
semiconductor sensor
dynamic quantity
dynamic
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69927118T
Other languages
English (en)
Other versions
DE69927118T2 (de
Inventor
Katsumichi Ueyanagi
Mitsuo Sasaki
Mutsuo Nishikawa
Shiho Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Application granted granted Critical
Publication of DE69927118D1 publication Critical patent/DE69927118D1/de
Publication of DE69927118T2 publication Critical patent/DE69927118T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00928—Eliminating or avoiding remaining moisture after the wet etch release of the movable structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0005—Anti-stiction coatings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
DE69927118T 1998-12-24 1999-12-09 Verfahren zur Herstellung eines Halbleitersensors für eine dynamische Grösse Expired - Lifetime DE69927118T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36631498A JP3527117B2 (ja) 1998-12-24 1998-12-24 半導体力学量センサの製造方法およびその製造装置
JP36631498 1998-12-24

Publications (2)

Publication Number Publication Date
DE69927118D1 true DE69927118D1 (de) 2005-10-13
DE69927118T2 DE69927118T2 (de) 2006-01-19

Family

ID=18486477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69927118T Expired - Lifetime DE69927118T2 (de) 1998-12-24 1999-12-09 Verfahren zur Herstellung eines Halbleitersensors für eine dynamische Grösse

Country Status (4)

Country Link
US (2) US6281033B1 (de)
EP (1) EP1014095B1 (de)
JP (1) JP3527117B2 (de)
DE (1) DE69927118T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6790699B2 (en) 2002-07-10 2004-09-14 Robert Bosch Gmbh Method for manufacturing a semiconductor device
JP2007071805A (ja) * 2005-09-09 2007-03-22 Denso Corp 力学量センサの製造方法
JP2007109718A (ja) 2005-10-11 2007-04-26 Toshiba Corp 半導体装置の製造方法
US7712370B2 (en) * 2006-12-22 2010-05-11 Asm Japan K.K. Method of detecting occurrence of sticking of substrate
JP2008227121A (ja) * 2007-03-13 2008-09-25 Oki Electric Ind Co Ltd 半導体デバイスの製造方法
US8654215B2 (en) * 2009-02-23 2014-02-18 Gary Edwin Sutton Mobile communicator with curved sensor camera
CN102139854B (zh) * 2010-01-28 2013-07-24 钜晶电子股份有限公司 微机电系统结构及其制造方法
US9714988B2 (en) * 2013-10-16 2017-07-25 Infineon Technologies Ag Hall effect sensor with graphene detection layer
JP6581849B2 (ja) 2015-09-01 2019-09-25 アズビル株式会社 微細機械装置
JP6587870B2 (ja) 2015-09-01 2019-10-09 アズビル株式会社 微細機械装置およびその製造方法
JP6511368B2 (ja) 2015-09-01 2019-05-15 アズビル株式会社 微細機械装置
JP6588773B2 (ja) 2015-09-01 2019-10-09 アズビル株式会社 微細機械装置およびその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727620A (en) * 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US4982753A (en) * 1983-07-26 1991-01-08 National Semiconductor Corporation Wafer etching, cleaning and stripping apparatus
US4740410A (en) * 1987-05-28 1988-04-26 The Regents Of The University Of California Micromechanical elements and methods for their fabrication
US5043043A (en) * 1990-06-22 1991-08-27 Massachusetts Institute Of Technology Method for fabricating side drive electrostatic micromotor
US5314572A (en) 1990-08-17 1994-05-24 Analog Devices, Inc. Method for fabricating microstructures
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
JP3612723B2 (ja) 1994-01-18 2005-01-19 株式会社デンソー 半導体力学量センサの製造方法
JP3395325B2 (ja) 1994-03-07 2003-04-14 株式会社デンソー 半導体加速度センサの製造方法
US5482564A (en) * 1994-06-21 1996-01-09 Texas Instruments Incorporated Method of unsticking components of micro-mechanical devices
JP3435850B2 (ja) * 1994-10-28 2003-08-11 株式会社デンソー 半導体力学量センサ及びその製造方法
US5629918A (en) * 1995-01-20 1997-05-13 The Regents Of The University Of California Electromagnetically actuated micromachined flap
US5677785A (en) * 1995-04-21 1997-10-14 Daewoo Electronics Co., Ltd. Method for forming an array of thin film actuated mirrors
US5706122A (en) * 1995-08-22 1998-01-06 Daewoo Electronics Co., Ltd. Method for the formation of a thin film actuated mirror array
US5766369A (en) * 1995-10-05 1998-06-16 Texas Instruments Incorporated Method to reduce particulates in device manufacture
DE19646802A1 (de) 1996-11-13 1998-05-14 Messer Griesheim Gmbh Verfahren und Vorrichtung zum Betreiben eines Schachtofens
US5933902A (en) * 1997-11-18 1999-08-10 Frey; Bernhard M. Wafer cleaning system
JP2000114219A (ja) * 1998-10-06 2000-04-21 Toshiba Corp 基板処理装置
US6286534B1 (en) * 2000-01-11 2001-09-11 Anderson, Greenwood Lp Pressure relief valve system including a pilot valve having a radial damper mechanism

Also Published As

Publication number Publication date
EP1014095A3 (de) 2004-05-19
DE69927118T2 (de) 2006-01-19
EP1014095A2 (de) 2000-06-28
US6281033B1 (en) 2001-08-28
US20010018260A1 (en) 2001-08-30
US6483283B2 (en) 2002-11-19
JP3527117B2 (ja) 2004-05-17
EP1014095B1 (de) 2005-09-07
JP2000196106A (ja) 2000-07-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FUJI ELECTRIC SYSTEMS CO., LTD., TOKYO/TOKIO, JP