DE69918663D1 - Verfahren zum Verbinden von einer Spule mit einer Mikroschaltung oder einer kleinen elektronischen Einheit durch Schweissen - Google Patents

Verfahren zum Verbinden von einer Spule mit einer Mikroschaltung oder einer kleinen elektronischen Einheit durch Schweissen

Info

Publication number
DE69918663D1
DE69918663D1 DE69918663T DE69918663T DE69918663D1 DE 69918663 D1 DE69918663 D1 DE 69918663D1 DE 69918663 T DE69918663 T DE 69918663T DE 69918663 T DE69918663 T DE 69918663T DE 69918663 D1 DE69918663 D1 DE 69918663D1
Authority
DE
Germany
Prior art keywords
welding
coil
tracks
electrical contact
insulating sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918663T
Other languages
English (en)
Other versions
DE69918663T2 (de
Inventor
Elko Doering
Pascal Cattin
Uwe Thiemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EM Microelectronic Marin SA
Original Assignee
EM Microelectronic Marin SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EM Microelectronic Marin SA filed Critical EM Microelectronic Marin SA
Application granted granted Critical
Publication of DE69918663D1 publication Critical patent/DE69918663D1/de
Publication of DE69918663T2 publication Critical patent/DE69918663T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69918663T 1999-03-31 1999-03-31 Verfahren zum Verbinden von einer Spule mit einer Mikroschaltung oder einer kleinen elektronischen Einheit durch Schweissen Expired - Lifetime DE69918663T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP99106603A EP1043109B1 (de) 1999-03-31 1999-03-31 Verfahren zum Verbinden von einer Spule mit einer Mikroschaltung oder einer kleinen elektronischen Einheit durch Schweissen

Publications (2)

Publication Number Publication Date
DE69918663D1 true DE69918663D1 (de) 2004-08-19
DE69918663T2 DE69918663T2 (de) 2005-07-28

Family

ID=8237898

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69918663T Expired - Lifetime DE69918663T2 (de) 1999-03-31 1999-03-31 Verfahren zum Verbinden von einer Spule mit einer Mikroschaltung oder einer kleinen elektronischen Einheit durch Schweissen

Country Status (7)

Country Link
US (1) US6409071B1 (de)
EP (1) EP1043109B1 (de)
KR (1) KR20010006894A (de)
CN (1) CN1275047A (de)
AT (1) ATE270941T1 (de)
DE (1) DE69918663T2 (de)
TW (1) TW506241B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100446639C (zh) * 2005-03-30 2008-12-24 华泰电子股份有限公司 擦拭机构
CN104010451B (zh) * 2013-02-21 2017-07-14 东莞立德精密工业有限公司 磁性线圈的焊接方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3832517A (en) * 1972-11-02 1974-08-27 Beckman Instruments Inc Method of welding coated wires to electrical conductors
FR2511907A1 (fr) * 1981-09-01 1983-03-04 Muchkin Vadim Procede d'assemblage de pieces par soudage et brasage et assemblages obtenus par ledit procede
US4712723A (en) * 1985-04-15 1987-12-15 Siemens Aktiengesellschaft Method for bonding an insulated wire element on a contact
US4759120A (en) * 1986-05-30 1988-07-26 Bel Fuse Inc. Method for surface mounting a coil
US5057661A (en) * 1989-10-26 1991-10-15 Globe Products Inc. Process for terminating insulated conductor wires
US5186378A (en) * 1991-09-30 1993-02-16 Texas Instruments Incorporated Method and apparatus for transducer heating in low temperature bonding
US5298715A (en) * 1992-04-27 1994-03-29 International Business Machines Corporation Lasersonic soldering of fine insulated wires to heat-sensitive substrates
US5493069A (en) * 1994-08-31 1996-02-20 Heraeus Sensor Gmbh Method of ultrasonically welding together two conductors
US5896644A (en) * 1997-02-28 1999-04-27 Molex Incorporated Wire end preparation apparatus and method
TW373197B (en) * 1997-05-14 1999-11-01 Murata Manufacturing Co Electronic device having electric wires and the manufacturing method thereof
US6119924A (en) * 1998-05-12 2000-09-19 Murata Manufacturing Co., Ltd. Electronic device having electric wires and method of producing same

Also Published As

Publication number Publication date
EP1043109B1 (de) 2004-07-14
ATE270941T1 (de) 2004-07-15
EP1043109A1 (de) 2000-10-11
CN1275047A (zh) 2000-11-29
DE69918663T2 (de) 2005-07-28
US6409071B1 (en) 2002-06-25
TW506241B (en) 2002-10-11
KR20010006894A (ko) 2001-01-26

Similar Documents

Publication Publication Date Title
KR860003756A (ko) 전자회로 장치와 그 제조방법
DE59501508D1 (de) Verfahren zur kontaktierung von starkstrom-anschlusselementen eines elektrischen bauelementes und unter anwendung dieses verfahrens hergestellte baugruppe
DE69918663D1 (de) Verfahren zum Verbinden von einer Spule mit einer Mikroschaltung oder einer kleinen elektronischen Einheit durch Schweissen
US2803731A (en) Induction soldering machine
DE50207975D1 (de) Verfahren und Vorrichtung zum Verlöten von elektrischen Bauteilen auf einer Kunststofffolie
US2455560A (en) Method of arranging and brazing superposed commutator leads
SE8302679D0 (sv) Lodningsforfarande
KR100319967B1 (ko) 스폿용접에 의한 박판부저의 코일 접속방법
JPS595494Y2 (ja) プリント基板予備加熱装置
JPS60257587A (ja) 半田付方法
JP2533438B2 (ja) 直接通電用コイル
JPH10215064A (ja) 弱耐熱性電子部品の実装方法
US3178548A (en) High frequency heating method and apparatus
SU1147527A1 (ru) Способ монтажа и пайки проводников печатной платы
JP3860634B2 (ja) ラックバーの高周波直接通電焼入装置
JP2003347721A (ja) 半田コテ
JPH1022625A (ja) 電子部品取り外し方法および取り外し装置
KR200142996Y1 (ko) 회로기판의 동박 단부 접속구조
JPH09174236A (ja) 接合装置と被接合部の接合方法
JPS6348625B2 (de)
JPS6332129Y2 (de)
JPH01113172A (ja) 半田付け装置
SU1648656A1 (ru) Способ пайки блоков на печатном монтаже
JPS58108681A (ja) 半田付装置
JPS609421B2 (ja) 整流子と電機子コイルのろう付け方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition