DE69912577D1 - Vorrichtung und verfahren zur optischen inspektion - Google Patents

Vorrichtung und verfahren zur optischen inspektion

Info

Publication number
DE69912577D1
DE69912577D1 DE69912577T DE69912577T DE69912577D1 DE 69912577 D1 DE69912577 D1 DE 69912577D1 DE 69912577 T DE69912577 T DE 69912577T DE 69912577 T DE69912577 T DE 69912577T DE 69912577 D1 DE69912577 D1 DE 69912577D1
Authority
DE
Germany
Prior art keywords
optical inspection
inspection
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69912577T
Other languages
English (en)
Other versions
DE69912577T2 (de
Inventor
Emanuel Elyasaf
Ehud Tirosh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE69912577D1 publication Critical patent/DE69912577D1/de
Application granted granted Critical
Publication of DE69912577T2 publication Critical patent/DE69912577T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
DE69912577T 1998-01-22 1999-01-19 Vorrichtung und verfahren zur optischen inspektion Expired - Fee Related DE69912577T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/010,570 US6175645B1 (en) 1998-01-22 1998-01-22 Optical inspection method and apparatus
US10570 1998-01-22
PCT/US1999/001107 WO1999038002A1 (en) 1998-01-22 1999-01-19 Optical inspection method and apparatus

Publications (2)

Publication Number Publication Date
DE69912577D1 true DE69912577D1 (de) 2003-12-11
DE69912577T2 DE69912577T2 (de) 2004-09-30

Family

ID=21746364

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69912577T Expired - Fee Related DE69912577T2 (de) 1998-01-22 1999-01-19 Vorrichtung und verfahren zur optischen inspektion

Country Status (7)

Country Link
US (1) US6175645B1 (de)
EP (1) EP1049925B1 (de)
JP (1) JP2002501194A (de)
KR (1) KR100571439B1 (de)
DE (1) DE69912577T2 (de)
TW (1) TW402686B (de)
WO (1) WO1999038002A1 (de)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1780503A3 (de) * 1998-09-14 2007-05-16 Betriebsforschungsinstitut VDEh Institut für angewandte Forschung GmbH Vorrichtung zum Messen der Geometrie und Planheit von Metallband
US6608920B1 (en) * 1998-10-29 2003-08-19 Applied Materials, Inc. Target acquisition technique for CD measurement machine
US6587193B1 (en) * 1999-05-11 2003-07-01 Applied Materials, Inc. Inspection systems performing two-dimensional imaging with line light spot
JP2000330228A (ja) * 1999-05-20 2000-11-30 Fuji Photo Film Co Ltd 放射線画像情報読取装置
US6526164B1 (en) * 1999-05-27 2003-02-25 International Business Machines Corporation Intelligent photomask disposition
US6636301B1 (en) 2000-08-10 2003-10-21 Kla-Tencor Corporation Multiple beam inspection apparatus and method
US6879390B1 (en) 2000-08-10 2005-04-12 Kla-Tencor Technologies Corporation Multiple beam inspection apparatus and method
US7136159B2 (en) * 2000-09-12 2006-11-14 Kla-Tencor Technologies Corporation Excimer laser inspection system
US6782337B2 (en) * 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US7139083B2 (en) * 2000-09-20 2006-11-21 Kla-Tencor Technologies Corp. Methods and systems for determining a composition and a thickness of a specimen
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
JP3266602B1 (ja) * 2000-10-30 2002-03-18 洋一 奥寺 アドレス照会システム、コンピュータプログラム製品及びその方法
US7231080B2 (en) * 2001-02-13 2007-06-12 Orbotech Ltd. Multiple optical input inspection system
US6873720B2 (en) 2001-03-20 2005-03-29 Synopsys, Inc. System and method of providing mask defect printability analysis
US6925202B2 (en) 2001-03-20 2005-08-02 Synopsys, Inc. System and method of providing mask quality control
KR100421219B1 (ko) * 2001-06-14 2004-03-02 삼성전자주식회사 β-디케톤 리간드를 갖는 유기 금속 착물을 이용한 원자층증착방법
US6560766B2 (en) 2001-07-26 2003-05-06 Numerical Technologies, Inc. Method and apparatus for analyzing a layout using an instance-based representation
US6721928B2 (en) 2001-07-26 2004-04-13 Numerical Technologies, Inc. Verification utilizing instance-based hierarchy management
US7014955B2 (en) 2001-08-28 2006-03-21 Synopsys, Inc. System and method for indentifying dummy features on a mask layer
US6976240B2 (en) 2001-11-14 2005-12-13 Synopsys Inc. Simulation using design geometry information
US7236847B2 (en) * 2002-01-16 2007-06-26 Kla-Tencor Technologies Corp. Systems and methods for closed loop defect reduction
US6795054B1 (en) * 2002-02-27 2004-09-21 Raytheon Company Optical filter measurement system
US6930770B2 (en) * 2002-08-08 2005-08-16 Applied Materials, Israel, Ltd. High throughput inspection system and method for generating transmitted and/or reflected images
US7043071B2 (en) 2002-09-13 2006-05-09 Synopsys, Inc. Soft defect printability simulation and analysis for masks
KR100514896B1 (ko) * 2002-10-09 2005-09-14 주식회사 디쌤 김 이물질 선별 장치
US7379175B1 (en) 2002-10-15 2008-05-27 Kla-Tencor Technologies Corp. Methods and systems for reticle inspection and defect review using aerial imaging
US7123356B1 (en) 2002-10-15 2006-10-17 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging and die-to-database detection
US7027143B1 (en) 2002-10-15 2006-04-11 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging at off-stepper wavelengths
US7638228B2 (en) 2002-11-27 2009-12-29 Saint Louis University Enzyme immobilization for use in biofuel cells and sensors
US7133119B1 (en) 2002-12-17 2006-11-07 Kla-Tencor Technologies Corp. Systems for simulating high NA and polarization effects in aerial images
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
US7486861B2 (en) * 2003-01-15 2009-02-03 Negevtech Ltd. Fiber optical illumination system
US6892013B2 (en) * 2003-01-15 2005-05-10 Negevtech Ltd. Fiber optical illumination system
JP4220287B2 (ja) 2003-03-31 2009-02-04 株式会社東芝 パターン欠陥検査装置
JP2004354088A (ja) * 2003-05-27 2004-12-16 Toshiba Corp 検査装置及びマスク製造方法
JP4758358B2 (ja) * 2004-01-29 2011-08-24 ケーエルエー−テンカー コーポレイション レチクル設計データにおける欠陥を検出するためのコンピュータに実装される方法
JP4596801B2 (ja) * 2004-03-22 2010-12-15 株式会社東芝 マスク欠陥検査装置
JP2005265736A (ja) * 2004-03-22 2005-09-29 Toshiba Corp マスク欠陥検査装置
WO2006006148A2 (en) * 2004-07-12 2006-01-19 Negevtech Ltd. Multi mode inspection method and apparatus
US20060012781A1 (en) * 2004-07-14 2006-01-19 Negevtech Ltd. Programmable spatial filter for wafer inspection
JP4904034B2 (ja) * 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
JP4012189B2 (ja) * 2004-10-26 2007-11-21 Ｔｄｋ株式会社 ウエハ検出装置
JP4896394B2 (ja) * 2004-11-22 2012-03-14 株式会社トプコン マスク検査装置
DE102005032601A1 (de) * 2005-01-07 2006-07-20 Heidelberger Druckmaschinen Ag Druckmaschine
US7804993B2 (en) * 2005-02-28 2010-09-28 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
US7813541B2 (en) * 2005-02-28 2010-10-12 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers
KR100642500B1 (ko) * 2005-03-02 2006-11-06 (주)쎄미시스코 유리기판의 에지 결함 및 디스컬러 검사장치
US7769225B2 (en) 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
JP4708904B2 (ja) * 2005-08-05 2011-06-22 株式会社名南製作所 木材の検査方法及び装置及びプログラム
JP4181159B2 (ja) * 2005-09-29 2008-11-12 株式会社東芝 欠陥検査装置
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8031931B2 (en) * 2006-04-24 2011-10-04 Applied Materials South East Asia Pte. Ltd. Printed fourier filtering in optical inspection tools
GB0611156D0 (en) * 2006-06-07 2006-07-19 Qinetiq Ltd Optical inspection
CN101236164B (zh) * 2006-07-31 2012-09-05 以色列商·应用材料以色列公司 用于缺陷检测的方法及系统
JP5221858B2 (ja) * 2006-08-30 2013-06-26 株式会社日立ハイテクノロジーズ 欠陥検査装置、及び欠陥検査方法
US7714998B2 (en) * 2006-11-28 2010-05-11 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
US7719674B2 (en) * 2006-11-28 2010-05-18 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
US7877722B2 (en) 2006-12-19 2011-01-25 Kla-Tencor Corp. Systems and methods for creating inspection recipes
WO2008086282A2 (en) * 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
JP4224863B2 (ja) * 2007-02-02 2009-02-18 レーザーテック株式会社 検査装置及び検査方法、並びにパターン基板の製造方法
JP5132982B2 (ja) * 2007-05-02 2013-01-30 株式会社日立ハイテクノロジーズ パターン欠陥検査装置および方法
US7738093B2 (en) 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US7962863B2 (en) * 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US8213704B2 (en) * 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7796804B2 (en) 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) * 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
JP5425779B2 (ja) * 2007-08-20 2014-02-26 ケーエルエー−テンカー・コーポレーション 実際の欠陥が潜在的にシステム的な欠陥であるか、または潜在的にランダムな欠陥であるかを判断する、コンピューターに実装された方法
JP4537467B2 (ja) * 2008-03-18 2010-09-01 アドバンスド・マスク・インスペクション・テクノロジー株式会社 試料検査装置及び試料検査方法
US8139844B2 (en) * 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
WO2010014609A2 (en) 2008-07-28 2010-02-04 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
JP4734394B2 (ja) * 2008-10-20 2011-07-27 株式会社東芝 パターン欠陥検査装置
US7972552B1 (en) * 2008-11-12 2011-07-05 Hrl Laboratories, Llc Method to locate and eliminate manufacturing defects in a quartz resonator gyro
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) * 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
JP4715955B2 (ja) * 2009-10-23 2011-07-06 レーザーテック株式会社 マスク検査方法、マスク検査装置
DE102010024784B4 (de) 2010-06-23 2022-03-31 Baumer Inspection Gmbh Multisensorielle Anordnung für die optische Inspektion und Sortierung von Schüttgütern
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
JP2011017714A (ja) * 2010-08-31 2011-01-27 Toshiba Corp マスク欠陥検査装置
JP5342537B2 (ja) * 2010-11-09 2013-11-13 株式会社ニューフレアテクノロジー マスク検査装置
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
CN103620392B (zh) * 2011-04-28 2017-05-17 皇家飞利浦有限公司 具有光学不均匀性的测定的评估方法及装置
KR101246958B1 (ko) * 2011-05-20 2013-03-25 주식회사 에이치비테크놀러지 멀티라인센서 카메라와 다중조명을 사용한 시편 고속검사장치
JP5024842B1 (ja) * 2011-07-22 2012-09-12 レーザーテック株式会社 検査装置、及び検査方法
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9830523B2 (en) * 2012-05-31 2017-11-28 Korea Institute Of Science And Technology Method and apparatus for recognizing object material using spatial image and spatial radar information
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
TWI477766B (zh) 2012-12-18 2015-03-21 Ind Tech Res Inst 檢測裝置以及檢測方法
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
WO2014149197A1 (en) 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
JP2014157086A (ja) * 2013-02-15 2014-08-28 Dainippon Screen Mfg Co Ltd パターン検査装置
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US10887500B2 (en) * 2017-01-24 2021-01-05 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Optical inspection system
KR102118789B1 (ko) * 2018-04-27 2020-06-04 스텍 코 엘티디 광학적 검사 기계의 경계 검출기
US11138722B2 (en) * 2018-12-21 2021-10-05 Kla-Tencor Corporation Differential imaging for single-path optical wafer inspection
DE102021101150A1 (de) 2021-01-20 2022-07-21 Lippert Gmbh & Co. Kg Verfahren zur optischen Detektion von Fehlern in keramischen Artikeln
DE102021101155A1 (de) 2021-01-20 2022-07-21 Lippert Gmbh & Co. Kg Verfahren zur optischen Detektion von Fehlern in keramischen Artikeln

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3587582D1 (de) * 1985-03-14 1993-10-21 Beltronics Inc Gerät und Verfahren zum selbsttätigen Inspizieren von Objekten und zum Identifizieren oder Erkennen bekannter und unbekannter Teile davon, einschliesslich Fehler und dergleichen.
US5386112A (en) 1990-06-29 1995-01-31 Dixon; Arthur E. Apparatus and method for transmitted-light and reflected-light imaging
KR960002145B1 (ko) * 1991-07-30 1996-02-13 가부시기가이샤 히다찌세이사구쇼 박막트랜지스터 액정기판의 검사방법 및 그 장치
DE69208413T2 (de) 1991-08-22 1996-11-14 Kla Instr Corp Gerät zur automatischen Prüfung von Photomaske
US5563702A (en) * 1991-08-22 1996-10-08 Kla Instruments Corporation Automated photomask inspection apparatus and method
US5764363A (en) * 1995-06-30 1998-06-09 Nikon Corporation Apparatus for observing a surface using polarized light
IL118872A (en) * 1996-07-16 2000-06-01 Orbot Instr Ltd Optical inspection method and apparatus
US6381356B1 (en) 1996-10-23 2002-04-30 Nec Corporation Method and apparatus for inspecting high-precision patterns

Also Published As

Publication number Publication date
JP2002501194A (ja) 2002-01-15
KR20010034323A (ko) 2001-04-25
WO1999038002A1 (en) 1999-07-29
EP1049925A1 (de) 2000-11-08
TW402686B (en) 2000-08-21
EP1049925B1 (de) 2003-11-05
US6175645B1 (en) 2001-01-16
KR100571439B1 (ko) 2006-04-17
DE69912577T2 (de) 2004-09-30

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