DE69905743T2 - Einen flüssigkristall-polymer enthaltendes aufhängungssystem für ein plattenlaufwerk - Google Patents
Einen flüssigkristall-polymer enthaltendes aufhängungssystem für ein plattenlaufwerkInfo
- Publication number
- DE69905743T2 DE69905743T2 DE69905743T DE69905743T DE69905743T2 DE 69905743 T2 DE69905743 T2 DE 69905743T2 DE 69905743 T DE69905743 T DE 69905743T DE 69905743 T DE69905743 T DE 69905743T DE 69905743 T2 DE69905743 T2 DE 69905743T2
- Authority
- DE
- Germany
- Prior art keywords
- liquid crystal
- disk drive
- suspension system
- drive suspension
- crystal material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000725 suspension Substances 0.000 title claims abstract description 49
- 229920000106 Liquid crystal polymer Polymers 0.000 title claims abstract description 37
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims abstract description 37
- 239000004973 liquid crystal related substance Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000005264 High molar mass liquid crystal Substances 0.000 claims description 3
- 230000001464 adherent effect Effects 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 abstract description 18
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 16
- 230000000712 assembly Effects 0.000 abstract description 8
- 238000000429 assembly Methods 0.000 abstract description 8
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 45
- 230000009975 flexible effect Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012799 electrically-conductive coating Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 230000002535 lyotropic effect Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
Landscapes
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Liquid Crystal Substances (AREA)
- Laminated Bodies (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10521298P | 1998-10-22 | 1998-10-22 | |
| PCT/US1999/023374 WO2000023987A1 (en) | 1998-10-22 | 1999-10-07 | Liquid crystal polymer disk drive suspension assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69905743D1 DE69905743D1 (de) | 2003-04-10 |
| DE69905743T2 true DE69905743T2 (de) | 2003-12-24 |
Family
ID=22304638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69905743T Expired - Fee Related DE69905743T2 (de) | 1998-10-22 | 1999-10-07 | Einen flüssigkristall-polymer enthaltendes aufhängungssystem für ein plattenlaufwerk |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6356414B1 (enExample) |
| EP (1) | EP1125289B1 (enExample) |
| JP (1) | JP2002528833A (enExample) |
| CN (1) | CN1324562C (enExample) |
| AT (1) | ATE233936T1 (enExample) |
| AU (1) | AU6510599A (enExample) |
| DE (1) | DE69905743T2 (enExample) |
| WO (1) | WO2000023987A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6867948B1 (en) * | 1999-01-22 | 2005-03-15 | Seagate Technology Llc | Disc drives having flexible circuits with liquid crystal polymer dielectric |
| US6480359B1 (en) | 2000-05-09 | 2002-11-12 | 3M Innovative Properties Company | Hard disk drive suspension with integral flexible circuit |
| JP4156203B2 (ja) * | 2000-05-22 | 2008-09-24 | 株式会社日立グローバルストレージテクノロジーズ | ディスク装置用サスペンション |
| US6696163B2 (en) | 2000-07-18 | 2004-02-24 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
| JP3915735B2 (ja) * | 2003-05-15 | 2007-05-16 | Ｔｄｋ株式会社 | サスペンション、該サスペンションを備えたヘッドジンバルアセンブリ及び該ヘッドジンバルアセンブリを備えたディスクドライブ装置 |
| US8395865B2 (en) * | 2006-01-10 | 2013-03-12 | Seagate Technology Llc | Thermally insulated suspension load beam |
| US8213120B2 (en) * | 2007-09-10 | 2012-07-03 | International Business Machines Corporation | Flexible cable comprising liquid crystal polymer |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4543295A (en) | 1980-09-22 | 1985-09-24 | The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration | High temperature polyimide film laminates and process for preparation thereof |
| US4624872A (en) | 1984-08-13 | 1986-11-25 | Celanese Corporation | Liquid crystalline polymer substrates with orthogonal molecular orientation |
| JPS6190343A (ja) | 1984-10-09 | 1986-05-08 | Polyplastics Co | 光ディスク |
| JPS61285249A (ja) | 1985-06-12 | 1986-12-16 | Polyplastics Co | 歯車用樹脂組成物 |
| JPH0623349B2 (ja) | 1986-01-30 | 1994-03-30 | 富士高分子工業株式会社 | 異方導電性接着剤 |
| US5833877A (en) | 1987-07-27 | 1998-11-10 | Elliott; Stanley B. | Reaction products of lyotropic liquid crystal salt complexes |
| US5443753A (en) | 1987-07-27 | 1995-08-22 | Elliott; Stanley B. | Reaction products of lyotropic liquid crystal salt complexes |
| JPS6431835A (en) | 1987-07-28 | 1989-02-02 | Kuraray Co | Fiber-reinforced polymer molded article |
| JPH01193388A (ja) | 1987-10-09 | 1989-08-03 | Agency Of Ind Science & Technol | リオトロピック液晶セル |
| US4991045A (en) * | 1987-12-21 | 1991-02-05 | Hutchinson Technology, Inc. | Suspension assembly |
| JPH0759635B2 (ja) | 1988-04-12 | 1995-06-28 | 日本石油株式会社 | サーモトロピック・コレステリック液晶性ポリペプチド |
| JP2621921B2 (ja) | 1988-05-10 | 1997-06-18 | 旭化成工業株式会社 | フイルムの製造方法 |
| JPH0663448B2 (ja) | 1988-07-15 | 1994-08-22 | 日本石油化学株式会社 | 消音器 |
| JPH02136292A (ja) | 1988-11-16 | 1990-05-24 | Ricoh Co Ltd | 感熱転写記録媒体 |
| GB8902581D0 (en) | 1989-02-06 | 1989-03-22 | Telephone Cables Ltd | Optical fibre cable core |
| US5142390A (en) | 1989-02-23 | 1992-08-25 | Ricoh Company, Ltd. | MIM element with a doped hard carbon film |
| DE69033139T2 (de) | 1990-09-28 | 1999-10-28 | Daicel Chemical Industries, Ltd. | Verbund-metallplatte |
| JPH04293787A (ja) | 1991-03-20 | 1992-10-19 | Toray Ind Inc | 表面金属化液晶ポリマ樹脂成形品の製造方法 |
| JP3024235B2 (ja) | 1991-03-20 | 2000-03-21 | 東レ株式会社 | 表面金属化液晶性ポリマ樹脂成形品の製造方法 |
| US5145553A (en) | 1991-05-06 | 1992-09-08 | International Business Machines Corporation | Method of making a flexible circuit member |
| US5427848A (en) | 1991-05-06 | 1995-06-27 | International Business Machines Corporation | Stress balanced composite laminate material |
| JP3108793B2 (ja) | 1991-11-08 | 2000-11-13 | 日本石油化学株式会社 | サーモトロピック液晶ポリマー粒子混合物およびそれを用いる成形方法 |
| JP2501289B2 (ja) | 1993-07-16 | 1996-05-29 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ヘッド・サスペンション・アセンブリおよびその製造方法 |
| JPH08180353A (ja) | 1994-05-25 | 1996-07-12 | Hutchinson Technol Inc | ディスク駆動サスペンションアセンブリのための積層構造体の製造方法及びその積層構造体、並びにサスペンションアセンブリ |
| US5771135A (en) | 1994-06-13 | 1998-06-23 | International Business Machines Corporation | Vibration damping system for head suspension assemblies |
| JP3375217B2 (ja) | 1994-10-14 | 2003-02-10 | 新日本石油化学株式会社 | 電気電子部品用封止材 |
| US5771568A (en) | 1995-03-02 | 1998-06-30 | Hutchinson Technology Incorporated | Method for manufacturing a head suspension having electrical trace interconnects with reduced capacitance |
| JPH08315532A (ja) | 1995-03-08 | 1996-11-29 | Hutchinson Technol Inc | 溶接応力の分離構造体を備えるヘッドサスペンションアセンブリ |
| US5666241A (en) | 1995-07-10 | 1997-09-09 | Magnecomp Corp. | Double dimple disk drive suspension |
| JP2986084B2 (ja) | 1995-10-12 | 1999-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | デイスク装置におけるサスペンション・アセンブリ構成及びその組立て方法 |
| JP3620751B2 (ja) | 1995-10-30 | 2005-02-16 | 住友ベークライト株式会社 | 異方導電フィルム |
| US5627704A (en) | 1996-02-12 | 1997-05-06 | Read-Rite Corporation | Thin film giant magnetoresistive CPP transducer with flux guide yoke structure |
| US5668684A (en) | 1996-08-06 | 1997-09-16 | International Business Machines Corporation | Electrical interconnect for a head/arm assembly of computer disk drives |
| GB9617885D0 (en) | 1996-08-28 | 1996-10-09 | Philips Electronics Nv | Electronic device manufacture |
| US5731401A (en) | 1996-09-30 | 1998-03-24 | Hoechst Celanese Corp. | Process for the preparation of thermotropic aromatic polyesters directly from dialkyl aromatic esters |
| US6046886A (en) | 1997-10-09 | 2000-04-04 | Seagate Technology, Inc. | Flex circuit head interconnect with insulating spacer |
-
1999
- 1999-10-05 US US09/413,221 patent/US6356414B1/en not_active Expired - Lifetime
- 1999-10-07 DE DE69905743T patent/DE69905743T2/de not_active Expired - Fee Related
- 1999-10-07 WO PCT/US1999/023374 patent/WO2000023987A1/en not_active Ceased
- 1999-10-07 JP JP2000577654A patent/JP2002528833A/ja active Pending
- 1999-10-07 CN CNB998123315A patent/CN1324562C/zh not_active Expired - Fee Related
- 1999-10-07 AU AU65105/99A patent/AU6510599A/en not_active Abandoned
- 1999-10-07 AT AT99953087T patent/ATE233936T1/de not_active IP Right Cessation
- 1999-10-07 EP EP99953087A patent/EP1125289B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| ATE233936T1 (de) | 2003-03-15 |
| WO2000023987A1 (en) | 2000-04-27 |
| CN1324562C (zh) | 2007-07-04 |
| WO2000023987A9 (en) | 2002-08-22 |
| EP1125289A1 (en) | 2001-08-22 |
| JP2002528833A (ja) | 2002-09-03 |
| DE69905743D1 (de) | 2003-04-10 |
| EP1125289B1 (en) | 2003-03-05 |
| CN1324479A (zh) | 2001-11-28 |
| AU6510599A (en) | 2000-05-08 |
| US6356414B1 (en) | 2002-03-12 |
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