DE69903893D1 - Verfahren und Vorrichtung zur Abgabe von Poliermittel -Aufschlämmung im mechanischen Polieren von Substraten - Google Patents

Verfahren und Vorrichtung zur Abgabe von Poliermittel -Aufschlämmung im mechanischen Polieren von Substraten

Info

Publication number
DE69903893D1
DE69903893D1 DE69903893T DE69903893T DE69903893D1 DE 69903893 D1 DE69903893 D1 DE 69903893D1 DE 69903893 T DE69903893 T DE 69903893T DE 69903893 T DE69903893 T DE 69903893T DE 69903893 D1 DE69903893 D1 DE 69903893D1
Authority
DE
Germany
Prior art keywords
substrates
polishing
dispensing
mechanical polishing
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69903893T
Other languages
English (en)
Other versions
DE69903893T2 (de
Inventor
Thierry Laederich
Georges Guarneri
Herve Dulphy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Liquide Electronics Systems SA
Original Assignee
Air Liquide Electronics Systems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide Electronics Systems SA filed Critical Air Liquide Electronics Systems SA
Application granted granted Critical
Publication of DE69903893D1 publication Critical patent/DE69903893D1/de
Publication of DE69903893T2 publication Critical patent/DE69903893T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y10T137/469—Sequentially filled and emptied [e.g., holding type]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y10T137/4807—Tank type manifold [i.e., one tank supplies or receives from at least two others]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Air Transport Of Granular Materials (AREA)
DE69903893T 1998-08-18 1999-07-08 Verfahren und Vorrichtung zur Abgabe von Poliermittel -Aufschlämmung im mechanischen Polieren von Substraten Expired - Fee Related DE69903893T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9810508A FR2782506B1 (fr) 1998-08-18 1998-08-18 Dispositif et procede de distribution de suspension abrasive pour le polissage mecanique de substrat

Publications (2)

Publication Number Publication Date
DE69903893D1 true DE69903893D1 (de) 2002-12-19
DE69903893T2 DE69903893T2 (de) 2003-10-09

Family

ID=9529747

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69903893T Expired - Fee Related DE69903893T2 (de) 1998-08-18 1999-07-08 Verfahren und Vorrichtung zur Abgabe von Poliermittel -Aufschlämmung im mechanischen Polieren von Substraten

Country Status (9)

Country Link
US (1) US6125876A (de)
EP (1) EP0980741B1 (de)
JP (1) JP4970635B2 (de)
KR (1) KR100601812B1 (de)
CN (1) CN1139106C (de)
DE (1) DE69903893T2 (de)
FR (1) FR2782506B1 (de)
SG (1) SG75972A1 (de)
TW (1) TW411289B (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6561381B1 (en) * 2000-11-20 2003-05-13 Applied Materials, Inc. Closed loop control over delivery of liquid material to semiconductor processing tool
US6736154B2 (en) * 2001-01-26 2004-05-18 American Air Liquide, Inc. Pressure vessel systems and methods for dispensing liquid chemical compositions
US7334708B2 (en) * 2001-07-16 2008-02-26 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Integral blocks, chemical delivery systems and methods for delivering an ultrapure chemical
DE50203258D1 (de) * 2001-12-04 2005-07-07 Levitronix Llc Waltham Abgabevorrichtung für ein Fluid
EP1318306B1 (de) * 2001-12-04 2005-06-01 Levitronix LLC Abgabevorrichtung für ein Fluid
US20040197731A1 (en) * 2003-03-27 2004-10-07 Swan Keith Daniel Dental abrasive system using helium gas
JP4852323B2 (ja) 2006-03-07 2012-01-11 株式会社荏原製作所 液供給方法、液供給装置、基板研磨装置、液供給流量測定方法
AU2008335308A1 (en) * 2007-12-06 2009-06-18 Foresight Processing, Llc Systems and methods for delivery of fluid-containing process material combinations
CN102248489B (zh) * 2010-05-21 2013-05-29 中芯国际集成电路制造(上海)有限公司 一种脉动缓冲器及研磨液供应系统
CN102806526A (zh) * 2011-05-31 2012-12-05 无锡华润上华半导体有限公司 研磨液供应系统
CN103522171B (zh) * 2012-07-05 2016-04-06 上海华虹宏力半导体制造有限公司 一种用于抛光垫研磨盘的氮气输送装置
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
US9841010B2 (en) * 2014-02-14 2017-12-12 Stephen B. Maguire Method and apparatus for closed loop automatic refill of liquid color
JP6450650B2 (ja) * 2015-06-16 2019-01-09 東京エレクトロン株式会社 処理装置、処理方法および記憶媒体
JP6562396B2 (ja) * 2015-07-17 2019-08-21 大成建設株式会社 電池電極スラリー分配装置、電池電極スラリー処理装置、電池電極スラリー分配方法、懸濁液分配装置、および懸濁液分配方法
CN108274396B (zh) * 2017-12-26 2020-06-12 中国科学院长春光学精密机械与物理研究所 一种用于光学研抛浆料供给的低速液流控制装置及方法
JP7064979B2 (ja) * 2018-06-25 2022-05-11 株式会社荏原製作所 流体の漏洩を確認する方法、および研磨装置
JP6538954B1 (ja) * 2018-12-11 2019-07-03 株式会社西村ケミテック 研磨液供給装置
JP6538952B1 (ja) * 2018-12-11 2019-07-03 株式会社西村ケミテック 研磨液供給装置
CN109696802B (zh) * 2019-01-16 2024-05-07 宁波南大光电材料有限公司 一种溶剂生产设备、溶剂制备及取用方法
JP6887693B2 (ja) * 2019-07-16 2021-06-16 エリーパワー株式会社 循環装置、処理装置および電池電極スラリーの循環方法
CN114102439B (zh) * 2021-11-23 2024-01-09 大连大学 智能芯片化学研磨液供给方法
JP2022176057A (ja) * 2022-01-11 2022-11-25 株式会社西村ケミテック 薬液供給装置及び薬液供給方法
KR102431849B1 (ko) * 2022-01-21 2022-08-12 웨스글로벌 주식회사 씨엠피 슬러리 혼합 및 공급 제어 시스템

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317649Y2 (de) * 1985-04-24 1988-05-18
US5148945B1 (en) * 1990-09-17 1996-07-02 Applied Chemical Solutions Apparatus and method for the transfer and delivery of high purity chemicals
US5503139A (en) * 1994-02-02 1996-04-02 Mcmahon; Michael D. Continuous flow adaptor for a nebulizer
US5722447A (en) * 1994-04-29 1998-03-03 Texas Instruments Incorporated Continuous recirculation fluid delivery system and method
KR100377304B1 (ko) * 1994-07-19 2003-06-09 어플라이드 케미컬 솔루션즈, 인크. 화학-기계적연마공정에서사용되는장치및방법
KR19980064179A (ko) * 1996-12-19 1998-10-07 윌리엄비.켐플러 웨이퍼 연마 공정시 실리콘 제거율을 안정화하는 방법

Also Published As

Publication number Publication date
KR100601812B1 (ko) 2006-07-19
SG75972A1 (en) 2000-10-24
JP2000071173A (ja) 2000-03-07
EP0980741A1 (de) 2000-02-23
CN1247381A (zh) 2000-03-15
DE69903893T2 (de) 2003-10-09
CN1139106C (zh) 2004-02-18
EP0980741B1 (de) 2002-11-13
KR20000017362A (ko) 2000-03-25
FR2782506B1 (fr) 2000-09-22
TW411289B (en) 2000-11-11
US6125876A (en) 2000-10-03
FR2782506A1 (fr) 2000-02-25
JP4970635B2 (ja) 2012-07-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee