EP0980741B1 - Verfahren und Vorrichtung zur Abgabe von Poliermittel -Aufschlämmung im mechanischen Polieren von Substraten - Google Patents

Verfahren und Vorrichtung zur Abgabe von Poliermittel -Aufschlämmung im mechanischen Polieren von Substraten Download PDF

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Publication number
EP0980741B1
EP0980741B1 EP99401715A EP99401715A EP0980741B1 EP 0980741 B1 EP0980741 B1 EP 0980741B1 EP 99401715 A EP99401715 A EP 99401715A EP 99401715 A EP99401715 A EP 99401715A EP 0980741 B1 EP0980741 B1 EP 0980741B1
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EP
European Patent Office
Prior art keywords
abrasive
distribution
loop
abrasive slurry
pipes
Prior art date
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Expired - Lifetime
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EP99401715A
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English (en)
French (fr)
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EP0980741A1 (de
Inventor
Thierry Laederich
Georges Guarneri
Hervé Dulphy
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Air Liquide Electronics Systems SA
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Air Liquide Electronics Systems SA
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y10T137/469—Sequentially filled and emptied [e.g., holding type]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y10T137/4807—Tank type manifold [i.e., one tank supplies or receives from at least two others]

Definitions

  • the present invention relates to a device distribution of abrasive suspension for the mechanical polishing of substrates (see for example US-A-5,722,447).
  • silica or alumina suspension for polishing the silicon wafers on the back side as well as the front side tends to generalize in the semiconductor, optoelectronics and optics. This naturally poses the problem of distribution of this product, from the delivery keg to several points of use.
  • Such suspensions may also be used to polish a metallic layer already deposited on the silicon wafer; in this cases, these suspensions may have characteristics physical or chemical different from the first.
  • a device which first comprises a measuring container in which are brought in turn the different chemicals used in the abrasive suspension, said chemicals being dosed in this container of measurement, each chemical compound then being, after measure, sent to a mixing container in which in situ mixing all the compounds of the suspension, this mixing container itself being connected to a mixing container negative pressure or vacuum so as to suck up the suspension which is in the container of mix and send it to the different delivery stations of the abrasive suspension.
  • the apparatus according to the invention includes the features of claim 1.
  • a distribution loop at the point of use consisting of a plurality of loops arranged in parallel with preferably each loop comprising at least one arm common to all loops, at one end of which are connected one ends of the plurality of loops.
  • this loop will have two common arms connected by their respective first ends to a pluralities of sub-loops connected in parallel, the first common arm being by its second end at abrasive suspension tank and the second common arm being connected by its second end to means of recovery of the abrasive suspension.
  • the length of each pipe (whatever the loop) between the tank and the point of distribution of the suspension will be roughly the same while the length of each pipe between the distribution point and means of recovery of the abrasive suspension will also preferably be much the same.
  • regulation means on the device according to the invention and these means of regulation will be preferably either means of regulating the pressure of the abrasive suspension in the pipes, i.e. means of adjusting the suspension flow abrasive in said pipes (or possibly two in combination).
  • We will preferably choose a minimum circulation speed in pipes of distribution to avoid deposit of abrasive suspension on the walls of the distribution pipes which would cause blockage of the pipes. It is indeed one of the important contributions of the invention than to avoid this way the plugging of the pipes which is a major problem in the facilities currently known.
  • the speed of circulation will be between approximately 0.5 m / s and approximately 2 m / s and more preferably between about 1 and 1.2 m / s.
  • each of the two pumps preferably only operating at approximately (and at plus) 50% of their power which allows in case one of the two pumps fails to continue normal operation of the device with a single pump which will then operate at 100% of its power.
  • an alarm which will indicate when one of the pumps is blocked, defective or when the material flow leaving one of the pumps is substantially zero.
  • circulation of the suspension will be provided by pressurized gas, preferably an inert gas such as nitrogen and / or argon and / or pressurized helium. It was found in this case however, there may still be a blockage of pipes. The Applicant has demonstrated that these blockages, in the case of circulation using gas under pressure, could be avoided by ensuring hygrometry minimum pressure gas used for circulation.
  • pressurized gas preferably an inert gas such as nitrogen and / or argon and / or pressurized helium.
  • a tank 1 contains a suspension abrasive 2 removed by a pipe 3 which crosses the tank wall 1 at point 4 and extends to two pumps 5 and 6 placed in parallel on this pipeline whose outputs are reconnected again together on the pipe 7 connected to the filter 8 which leads to line 9.
  • the pipes 20 are respectively connected, 21, ... 22, of which the other ends respectively 30, 31, ... 32, are interconnected with line 40 of abrasive suspension return to tank 1, this pipe 40 crossing at 41 the wall of said tank to enter suspension 2 contained in this tank 1.
  • a filling tank 42 is arranged in parallel with the tank 1 and connected to it by a line 43 so as to maintain, in all circumstances, a level always above a certain predetermined minimum in tank 1. This tank appendix 42 allows in particular to adjust the viscosity of the abrasive suspension.
  • pressurized gas 44 such as an inert gas, preferably nitrogen, of a purity compatible with the desired application, in particular a purity of the N50 type or better.
  • pressurized gas 44 such as an inert gas, preferably nitrogen
  • B, C, ... D distributions, respectively B, C, ... D, of abrasive suspension at the points of use, respectively 60, 61, .. .62 via valves 70, 71, ... 72 respectively.
  • the apparatus also comprises, between point 32 and point 41 of line 40, a pressure detector 80 electrically connected to a PID type regulation system (proportional / integral / differential) which is itself electrically connected, respectively by the lines 83 and 84 at the pumps, respectively 5 and 6.
  • PID type regulation system proportional / integral / differential
  • the pressure must be maintained at a pressure equal to the set pressure set in the PID, and when the pressure detected by 80 is lower than the pressure displayed, an electrical signal is generated by PID 81 so as to increase the pumping pressure of pumps 5 and 6.
  • the pressure measured by the pressure detector 80 becomes equal to or greater than the pressure displayed in PID 81, the latter corrects the signal sent by the lines 83 and 84 to pumps 5 and 6 so as to reduce the pumping pressure of pumps 5 and 6 to the value corresponding to the pressure setpoint.
  • the PID decreases the pumping pressure of the pumps by sending an adequate electrical signal to pumps 5 and 6 if the pressure detectors detect a pressure higher than the set pressure displayed in the PID 81.
  • the apparatus may also include a regulation of flow either alone (without the pressure detection system with the PID), or in addition to the detection system pressure.
  • This flow control system consists of in particular to measure the flow rate of the solution of the abrasive suspension and compare the measured value to a setpoint then increase or decrease the flow pumps 5 and 6 by sending an electrical signal corresponding to the said pumps after comparing the flow measured and the displayed flow rate.
  • FIG 2 is shown an alternative embodiment of the device of the Figure 1 in which in particular at least two are used abrasive suspension storage tanks connected in parallel and which are used alternately as well when a tank is empty and this state is detected by a level detector, for example, we can automatically start the second tank without having need to interrupt abrasive suspension circulation which avoids clotting and clogging problems pipes, which therefore reduces the maintenance of the device. (In this figure 2, the same devices as those of Figure 1 have the same references).
  • the two pipes 101 meet and 119 respectively connected to the suspension tanks abrasive 112 and 115 by means of the controlled opening 103 and 102 respectively, pipes 113 and 118.
  • the tank 112 is under pressure from inert gas, for example nitrogen (ultra pure, of “electronic” purity for use suspension for polishing silicon wafers ("Wafer”)) under a pressure for example of around 3 bar in the space 114 above the suspension 127.
  • the suspended supply when 112 is empty is done via valve 111 (open for filling, then closed in use - see below) and the pipeline 128 which plunges into 129 in the reserve 130 in the tank back 131.
  • the lower part of the tank 115 is connected via line 117, valve 116 and the line 120 to line 128 so as to fill 115 when it is empty (valve 116 open and 111 closed) and fill in 112 when 111 is open 116 is closed (or fill in neither when 111 and 116 are closed).
  • the pressurized nitrogen source 121 makes it possible to adjust gas pressures above the suspension via respectively the valves controlled (by a device of control well known to those skilled in the art "Proportional” (P), “Integral” (I), “Differential” (D) or “PID” 81) 108 and 110 allowing set pressures at for example 3 bar (relative) at above 127 (to push the suspension in 113) and at 0 bar (relative) in 115 to allow filling of 115 in suspension.
  • 121 is also connected via the pipeline 131 and the controlled valve 122 (also controlled or not by PID 81) which maintains nitrogen pressure by example of 0.5 bar (relative) above the suspension 130.
  • a large capacity tank 132 is provided which supplies 131 via line 124.
  • This reservoir 132 can be raised to feed others gravity tanks (possibly you can also inject ultra-pure nitrogen pressure at the top through line 125). This mode of transport without pump but by gas pressure avoids the problem of seizure of pumps.
  • the tank 2 is of sufficient volume to preferably provide autonomy to the equipment of the order of 2.5 / 3 days; it is preferably mechanically agitated continuously and maintained at slight overpressure (1 to 3 mbar) so as to avoid the action of atmospheric CO 2 on the ammonia contained in certain abrasive suspensions.
  • the tank is made of a plastic material on which the solidifying silica or alumina are not likely to adhere.
  • the withdrawal of the tank is preferably carried out by a bottom valve; the loop is returned by a valve descending below the minimum level of the tank.
  • the tank is filled using a positive displacement pump from shuttle drums. If necessary, a water dilution must be carried out by injecting water and a silica suspension continuously into a static mixer. After each unloading of the shuttle drum 42, the silica supply circuit of the storage tank, pumps and pipe included is purged with deionized water.
  • each pump preferably being connected to a variable frequency power supply 0-100 Hz controllable by a current (for example, from 4 to 20 mA); the 2 power supplies variable frequency are controlled by a PID 81 regulator at the pressure at the end of the loop just before the valve setting.
  • the shaft of each pump should preferably be fitted with 2 seals, the space (bell) between the seals being kept at overpressure relative to the silica by injection of deionized water.
  • the deionized water supply circuit will have at its inlet an orifice calibrated at 100-200 l / h and 10-20 l / h at the outlet.
  • the pressure prevailing in the bell must be constant, if there is no leakage on the interior lining in contact with the silica. On the other hand, if there is a leak, the pressure in the bell between the 2 linings will gradually decrease and a pressure sensor will transmit alarm signals and organize a curative action.
  • an automatic purge of the pumps with deionized water will also be provided in the event of a stop.
  • the loop (in its common arm 7, 9) is equipped with a filter 8 preferably of “polypropylene” type preferably fixing at least 90% of the materials of size greater than about 100 micrometers. Given the character of this suspension, we will have to oversize this filter in order to work with a reduced differential pressure, from 0.1 to 0.2 bar.
  • the diameter of the calibrated orifices is a function of number of parameters, such as the flow of the loop, loop pressure, number of devices to be serve, the viscosity of the suspension to be distributed, elements that the skilled person will be able to choose without difficulties in ensuring flow velocities, preferably between 0.2 and 0.5 m / s to minimize abrasion of the pipes.
  • the distribution loop preferably includes a non-controlled control valve (not shown on the figure) resistant to abrasion and upstream of it, a flow meter 90 and a pressure sensor 80.
  • the flow rate is adjusted using the control valve not subject to the selected value.
  • the pressure setpoint is displayed on the PID 81 controller whose parameters are adjusted to obtain satisfactory operation of the loop, especially during small variations in pressure during withdrawal, start-up, and / or start-up operating on 1 pump.
  • the system described above can also work in particular with pneumatic pumps membranes or bellows, commonly used in industry semiconductors, provided that the working gas is injected by a pilot-operated valve or a device of the type mass flow controller, controlled by a setpoint pressure given by a pressure regulator. In this case, operation with 2 pumps parallel to half flow nominal will be maintained so as to obtain a rate of high availability.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Air Transport Of Granular Materials (AREA)

Claims (16)

  1. Vorrichtung zur Abgabe von Poliermittel-Aufschlämmungen umfassend:
    einen Vorratsbehälter (1), der eine Poliermittel-Aufschlämmung (2) enthält,
    eine Ringleitung (3, 7, 9, 40) für die Poliermittel-Aufschlämmung (2), wobei diese an den Vorratsbehälter (1) angeschlossen ist,
    Mittel zur Zirkulation (5, 6), um die Poliermittel-Aufschlämmung (2) in der Ringleitung zirkulieren zu lassen und ihren Rücklauf in den Vorratsbehälter sicherzustellen,
    Mittel zur Aufarbeitung (1), um die Poliermittel-Aufschlämmung nach der Zirkulation in der Ringleitung aufzuarbeiten,
    Mittel zur Regulierung (81) der Mittel zur Zirkulation, und zwar in solcher Form, dass eine kontinuierliche Zirkulation der Aufschlämmung aufrechterhalten wird,
    dadurch gekennzeichnet, dass die Ringleitung zur Abgabe am Nutzungspunkt aus einer Vielzahl von Ringleitungen (20, 21, 22 usw.) besteht, die parallel miteinander verbunden sind und im Wesentlichen den gleichen Druckverlust aufweisen.
  2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Ringleitung wenigstens einen gemeinsamen Leitungsstrang (3, 7, 9) für alle Ringleitungen umfasst, an dessen einem Ende jeweils eines der Enden der Vielzahl von Ringleitungen angeschlossen ist.
  3. Vorrichtung nach Anspruch 2, dadurch gekennzeichnet, dass die Ringleitung zwei gemeinsame Leitungsstränge umfasst, wobei ein erster Leitungsstrang (3, 7, 9) mit einem ersten Ende an den Vorratsbehälter (1) angeschlossen ist und ein zweiter Leitungsstrang (40) mit einem ersten Ende an die Mittel zur Aufarbeitung (1) angeschlossen ist.
  4. Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die Länge jeder Rohrleitung zwischen dem Vorratsbehälter (1) und dem Abgabepunkt der Poliermittel-Aufschlämmung im Wesentlichen gleich ist.
  5. Vorrichtung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass die Längen jeder Rohrleitung zwischen dem Abgabepunkt (60, 61, 62) und den Mitteln zur Aufarbeitung (9) im Wesentlichen gleich sind.
  6. Vorrichtung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass sie Mittel zur Regulierung (80, 81) der Zirkulation der Poliermittel-Aufschlämmung in der Ringleitung durch eine Steuerung des Drucks in den Rohrleitungen zur Abgabe der Aufschlämmung enthält.
  7. Vorrichtung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass sie Mittel zur Regulierung der Durchflussmenge der Poliermittel-Aufschlämmung in den verschiedenen Leitungssträngen der Abgaberingleitung enthält.
  8. Vorrichtung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Poliermittel-Aufschlämmung eine minimale Zirkulationsgeschwindigkeit in den verschiedenen Abgaberohrleitungen hat, um Ablagerungen der Aufschlämmung an den Wänden der Abgaberohrleitungen zu vermeiden.
  9. Vorrichtung nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die Abgabegeschwindigkeit der Aufschlämmung in den Rohrleitungen größer oder gleich ungefähr 0,2 m/s ist.
  10. Vorrichtung nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die Zirkulationsgeschwindigkeit der Poliermittel-Aufschlämmung in den Rohrleitungen kleiner oder gleich ungefähr 10 m/s ist.
  11. Vorrichtung nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass die Abgabegeschwindigkeit von Poliermittel-Aufschlämmungen vorzugsweise zwischen 0,5 und 2 m/s liegt.
  12. Vorrichtung nach Anspruch 11, dadurch gekennzeichnet, dass die Abgabegeschwindigkeit von Poliermittel-Aufschlämmungen zwischen ungefähr 1 m/s und 1,2 m/s liegt.
  13. Vorrichtung nach Anspruch 11, dadurch gekennzeichnet, dass die Mittel zur Zirkulation von Poliermittel-Aufschlämmungen aus wenigstens einer Pumpe (5, 6) bestehen.
  14. Vorrichtung nach einem der Ansprüche 1 bis 13, dadurch gekennzeichnet, dass die Mittel zur Zirkulation von Poliermittel-Aufschlämmungen aus zwei Pumpen (5, 6) bestehen, die parallel geschaltet sind, wobei jede davon mit höchstens 50 % ihrer Leistung arbeitet, um einen normalen Betrieb zur Abgabe von Poliermittel-Aufschlämmungen zu ermöglichen, wenn eine der zwei Pumpen ausfällt.
  15. Vorrichtung nach einem der Ansprüche 1 bis 14, dadurch gekennzeichnet, dass die Mittel zur Zirkulation (44) aus einem unter Druck stehenden Gas und insbesondere aus einem Inertgas wie beispielsweise Stickstoff bestehen.
  16. Vorrichtung nach Anspruch 15, in der die Mittel zur Zirkulation aus einem unter Druck stehenden Gas bestehen, dadurch gekennzeichnet, dass die Vorrichtung ebenfalls Mittel enthält, um in dem unter Druck stehenden Gas eine Vernebelung von deionisiertem Wasser zu erzeugen und die Verstopfung von Filtern in dem System zur Abgabe der Poliermittel-Aufschlämmung zu vermeiden.
EP99401715A 1998-08-18 1999-07-08 Verfahren und Vorrichtung zur Abgabe von Poliermittel -Aufschlämmung im mechanischen Polieren von Substraten Expired - Lifetime EP0980741B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9810508 1998-08-18
FR9810508A FR2782506B1 (fr) 1998-08-18 1998-08-18 Dispositif et procede de distribution de suspension abrasive pour le polissage mecanique de substrat

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Publication Number Publication Date
EP0980741A1 EP0980741A1 (de) 2000-02-23
EP0980741B1 true EP0980741B1 (de) 2002-11-13

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US (1) US6125876A (de)
EP (1) EP0980741B1 (de)
JP (1) JP4970635B2 (de)
KR (1) KR100601812B1 (de)
CN (1) CN1139106C (de)
DE (1) DE69903893T2 (de)
FR (1) FR2782506B1 (de)
SG (1) SG75972A1 (de)
TW (1) TW411289B (de)

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CN108274396B (zh) * 2017-12-26 2020-06-12 中国科学院长春光学精密机械与物理研究所 一种用于光学研抛浆料供给的低速液流控制装置及方法
JP7064979B2 (ja) * 2018-06-25 2022-05-11 株式会社荏原製作所 流体の漏洩を確認する方法、および研磨装置
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FR2782506B1 (fr) 2000-09-22
US6125876A (en) 2000-10-03
TW411289B (en) 2000-11-11
SG75972A1 (en) 2000-10-24
KR20000017362A (ko) 2000-03-25
CN1139106C (zh) 2004-02-18
DE69903893T2 (de) 2003-10-09
CN1247381A (zh) 2000-03-15
DE69903893D1 (de) 2002-12-19
JP2000071173A (ja) 2000-03-07
JP4970635B2 (ja) 2012-07-11
FR2782506A1 (fr) 2000-02-25
KR100601812B1 (ko) 2006-07-19
EP0980741A1 (de) 2000-02-23

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