DE69839189D1 - Vorrichtung zur oberflächenmodifizierung von polymer-, metall- und keramikmaterialien unter verwendung eines ionenstrahls - Google Patents
Vorrichtung zur oberflächenmodifizierung von polymer-, metall- und keramikmaterialien unter verwendung eines ionenstrahlsInfo
- Publication number
- DE69839189D1 DE69839189D1 DE69839189T DE69839189T DE69839189D1 DE 69839189 D1 DE69839189 D1 DE 69839189D1 DE 69839189 T DE69839189 T DE 69839189T DE 69839189 T DE69839189 T DE 69839189T DE 69839189 D1 DE69839189 D1 DE 69839189D1
- Authority
- DE
- Germany
- Prior art keywords
- ion
- chamber
- ion beam
- surface modification
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4417—Methods specially adapted for coating powder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using ion beam radiation
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06B—TREATING TEXTILE MATERIALS USING LIQUIDS, GASES OR VAPOURS
- D06B19/00—Treatment of textile materials by liquids, gases or vapours, not provided for in groups D06B1/00 - D06B17/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/338—Changing chemical properties of treated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Textile Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemical Vapour Deposition (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR9766184 | 1997-12-05 | ||
KR1019970066184A KR19990047679A (ko) | 1997-12-05 | 1997-12-05 | 이온 빔을 이용한 재료의 표면 처리 장치 |
PCT/KR1998/000403 WO1999029922A1 (en) | 1997-12-05 | 1998-12-04 | Apparatus for surface modification of polymer, metal and ceramic materials using ion beam |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69839189D1 true DE69839189D1 (de) | 2008-04-10 |
DE69839189T2 DE69839189T2 (de) | 2009-03-26 |
Family
ID=19526515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69839189T Expired - Fee Related DE69839189T2 (de) | 1997-12-05 | 1998-12-04 | Vorrichtung zur oberflächenmodifizierung von polymer-, metall- und keramikmaterialien unter verwendung eines ionenstrahls |
Country Status (9)
Country | Link |
---|---|
US (2) | US6319326B1 (de) |
EP (2) | EP1296353A3 (de) |
JP (1) | JP2001526323A (de) |
KR (2) | KR19990047679A (de) |
CN (2) | CN100351422C (de) |
AT (1) | ATE387520T1 (de) |
AU (1) | AU1509499A (de) |
DE (1) | DE69839189T2 (de) |
WO (1) | WO1999029922A1 (de) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4682387B2 (ja) * | 1999-05-31 | 2011-05-11 | ソニー株式会社 | 絶縁物の表面処理方法 |
KR100372851B1 (ko) * | 2000-08-04 | 2003-02-19 | 주식회사 피앤아이 | 이온빔보조반응을 이용한 튜브 내벽의 친수성 표면처리방법 및 장치 |
AUPR515301A0 (en) * | 2001-05-22 | 2001-06-14 | Commonwealth Scientific And Industrial Research Organisation | Process and apparatus for producing crystalline thin film buffer layers and structures having biaxial texture |
US6439108B1 (en) * | 2002-03-25 | 2002-08-27 | Eupa International Corporation | Grill device having a space adjusting unit to adjust a space between an upper grill unit and a lower grill unit |
US7198699B2 (en) * | 2002-05-06 | 2007-04-03 | Guardian Industries Corp. | Sputter coating apparatus including ion beam source(s), and corresponding method |
DE10234614B3 (de) * | 2002-07-24 | 2004-03-04 | Fractal Ag | Verfahren zur Bearbeitung von Trägermaterial durch Schwerionenbestrahlung und nachfolgenden Ätzprozess |
DE10248507A1 (de) * | 2002-10-11 | 2004-04-22 | IHP GmbH - Innovations for High Performance Microelectronics/Institut für innovative Mikroelektronik | Verfahren und Vorrichtung zur Fehlerkorrektur von Multiplex-Signalen |
US6988463B2 (en) * | 2002-10-18 | 2006-01-24 | Guardian Industries Corp. | Ion beam source with gas introduced directly into deposition/vacuum chamber |
KR20040046571A (ko) * | 2002-11-27 | 2004-06-05 | 주식회사 피앤아이 | 이온빔을 이용한 재료의 표면 처리 장치 |
KR100514952B1 (ko) * | 2003-01-15 | 2005-09-14 | 주식회사 피앤아이 | 씨앗층과 벌크층의 성막 시퀀스 방법을 이용한 인듐 주석산화물 박막 형성 방법 |
US7531205B2 (en) * | 2003-06-23 | 2009-05-12 | Superpower, Inc. | High throughput ion beam assisted deposition (IBAD) |
US7748344B2 (en) * | 2003-11-06 | 2010-07-06 | Axcelis Technologies, Inc. | Segmented resonant antenna for radio frequency inductively coupled plasmas |
US7421973B2 (en) * | 2003-11-06 | 2008-09-09 | Axcelis Technologies, Inc. | System and method for performing SIMOX implants using an ion shower |
JP2008505842A (ja) | 2004-07-12 | 2008-02-28 | 日本板硝子株式会社 | 低保守コーティング |
TWI287816B (en) * | 2004-07-22 | 2007-10-01 | Asia Optical Co Inc | Improved ion source with particular grid assembly |
JP5090911B2 (ja) * | 2004-09-03 | 2012-12-05 | カーディナル・シージー・カンパニー | 断続的コンベヤシステムを有するコータ |
US7842435B2 (en) * | 2004-11-01 | 2010-11-30 | Gm Global Technology Operations, Inc. | Fuel cell water management enhancement method |
WO2006080968A2 (en) * | 2004-11-15 | 2006-08-03 | Cardinal Cg Company | Methods and equipment for depositing coatings having sequenced structures |
US8092660B2 (en) | 2004-12-03 | 2012-01-10 | Cardinal Cg Company | Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films |
US7923114B2 (en) | 2004-12-03 | 2011-04-12 | Cardinal Cg Company | Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films |
KR100732883B1 (ko) * | 2005-07-12 | 2007-06-29 | 주식회사 모젬 | 고경도 코팅층을 가진 무선단말기용 외장부품 제조방법 |
KR100727695B1 (ko) * | 2005-11-30 | 2007-06-13 | 동부일렉트로닉스 주식회사 | 이온주입공정의 감광제 차단능력 모니터링 방법 |
US7781377B2 (en) * | 2005-12-28 | 2010-08-24 | Superpower, Inc. | Anti-epitaxial film in a superconducting article and related articles, devices and systems |
US7445808B2 (en) * | 2005-12-28 | 2008-11-04 | Superpower, Inc. | Method of forming a superconducting article |
WO2007121215A1 (en) | 2006-04-11 | 2007-10-25 | Cardinal Cg Company | Photocatalytic coatings having improved low-maintenance properties |
WO2007124291A2 (en) | 2006-04-19 | 2007-11-01 | Cardinal Cg Company | Opposed functional coatings having comparable single surface reflectances |
GB2438241A (en) * | 2006-05-16 | 2007-11-21 | Secretary Trade Ind Brit | Machining of microstructures |
US20080011599A1 (en) | 2006-07-12 | 2008-01-17 | Brabender Dennis M | Sputtering apparatus including novel target mounting and/or control |
US20080026329A1 (en) * | 2006-07-26 | 2008-01-31 | Ashkan Vaziri | Surface modification of polymer surface using ion beam irradiation |
JP2009010079A (ja) * | 2007-06-27 | 2009-01-15 | Canon Inc | 露光装置 |
WO2009036263A2 (en) | 2007-09-14 | 2009-03-19 | Cardinal Cg Company | Low-maintenance coating technology |
CN101994087B (zh) * | 2009-08-14 | 2013-04-24 | 鸿富锦精密工业(深圳)有限公司 | 蒸镀装置 |
WO2011049477A1 (en) * | 2009-10-23 | 2011-04-28 | Inano Limited | Method for modifying surface characteristics of materials and apparatus |
US10285112B2 (en) * | 2010-07-08 | 2019-05-07 | Peking University | Data transmission in mobile ad-hoc network |
TWI477646B (zh) * | 2010-08-09 | 2015-03-21 | Hon Hai Prec Ind Co Ltd | 化學氣相沉積設備 |
KR101915753B1 (ko) * | 2010-10-21 | 2018-11-07 | 삼성디스플레이 주식회사 | 이온 주입 시스템 및 이를 이용한 이온 주입 방법 |
FR2973811A1 (fr) * | 2011-04-08 | 2012-10-12 | Valeo Systemes Dessuyage | Installation pour le traitement par bombardement ionique de deux surfaces opposees |
CN104955651B (zh) * | 2013-01-30 | 2017-05-24 | 柯尼卡美能达株式会社 | 液滴排出头基板以及液滴排出头的制造方法 |
JP5753308B1 (ja) * | 2014-10-31 | 2015-07-22 | 株式会社ジーエル・マテリアルズホールディングス | イオンビームを用いた高分子表面改質法及びその装置 |
EP3541762B1 (de) | 2016-11-17 | 2022-03-02 | Cardinal CG Company | Statisch-dissipative beschichtungstechnologie |
EP3366804B1 (de) * | 2017-02-22 | 2022-05-11 | Satisloh AG | Vakuumbeschichtungsvorrichtung zur vakuumbeschichtung von substraten, insbesondere von brillenlinsen |
CN109957752B (zh) * | 2017-12-26 | 2022-10-28 | 佳能特机株式会社 | 基板处理装置及其控制方法、成膜装置、电子零件的制造方法 |
JP6567119B1 (ja) * | 2018-03-27 | 2019-08-28 | キヤノントッキ株式会社 | 基板処理装置及びその制御方法、成膜装置、電子部品の製造方法 |
CN111684101B (zh) | 2018-02-06 | 2023-02-17 | 佳能安内华股份有限公司 | 基板处理装置以及基板处理方法 |
CN113196453A (zh) * | 2018-12-17 | 2021-07-30 | 应用材料公司 | 在基板上形成装置的方法 |
KR20210094116A (ko) | 2018-12-17 | 2021-07-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 광학 디바이스 제작을 위한 전자 빔 장치 |
JP6858473B2 (ja) * | 2019-02-28 | 2021-04-14 | 東芝三菱電機産業システム株式会社 | 成膜装置 |
CN111421144B (zh) * | 2020-03-27 | 2021-11-19 | 西安交通大学 | 一种抗水腐蚀的难熔金属钼表面处理方法 |
JP7111380B2 (ja) * | 2020-04-01 | 2022-08-02 | 株式会社シンクロン | スパッタ装置及びこれを用いた成膜方法 |
CN113073437B (zh) * | 2021-04-06 | 2023-10-13 | 武汉纺织大学 | 功能纱线的界面涂覆改性装置及涂覆改性方法 |
CN114684642B (zh) * | 2022-03-30 | 2024-06-25 | 中国科学院近代物理研究所 | 一种用于高真空环境下的薄膜材料辐照实验装置 |
KR20240022110A (ko) * | 2022-08-11 | 2024-02-20 | (주)라드피온 | 고분자 재료의 표면 전기전도도 향상 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466258A (en) * | 1982-01-06 | 1984-08-21 | Sando Iron Works Co., Ltd. | Apparatus for low-temperature plasma treatment of a textile product |
KR890002747B1 (ko) * | 1983-11-07 | 1989-07-26 | 가부시기가이샤 히다찌세이사꾸쇼 | 이온 빔에 의한 성막방법 및 그 장치 |
JPS61163270A (ja) | 1985-01-12 | 1986-07-23 | Nissin Electric Co Ltd | イオン蒸着薄膜形成装置 |
JPS62287068A (ja) * | 1986-06-06 | 1987-12-12 | Nissin Electric Co Ltd | イオンビ−ム蒸着装置 |
JPH01195274A (ja) * | 1988-01-29 | 1989-08-07 | Nippon Steel Corp | 薄膜の連続形成装置 |
JPH06104900B2 (ja) * | 1988-03-10 | 1994-12-21 | 松下電工株式会社 | 真空蒸着方法及び装置 |
US4889609A (en) * | 1988-09-06 | 1989-12-26 | Ovonic Imaging Systems, Inc. | Continuous dry etching system |
JPH0686657B2 (ja) * | 1989-09-11 | 1994-11-02 | 松下電工株式会社 | 薄膜形成装置 |
JP2811820B2 (ja) * | 1989-10-30 | 1998-10-15 | 株式会社ブリヂストン | シート状物の連続表面処理方法及び装置 |
JPH0499173A (ja) * | 1990-08-07 | 1992-03-31 | Nec Corp | スパッタリング装置 |
US5783641A (en) * | 1995-04-19 | 1998-07-21 | Korea Institute Of Science And Technology | Process for modifying surfaces of polymers, and polymers having surfaces modified by such process |
JPH0991667A (ja) * | 1995-09-28 | 1997-04-04 | Kao Corp | 磁気記録媒体 |
-
1997
- 1997-12-05 KR KR1019970066184A patent/KR19990047679A/ko not_active Application Discontinuation
-
1998
- 1998-12-04 US US09/555,832 patent/US6319326B1/en not_active Expired - Fee Related
- 1998-12-04 WO PCT/KR1998/000403 patent/WO1999029922A1/en active IP Right Grant
- 1998-12-04 AU AU15094/99A patent/AU1509499A/en not_active Abandoned
- 1998-12-04 KR KR1020007005975A patent/KR100329810B1/ko not_active IP Right Cessation
- 1998-12-04 AT AT98959256T patent/ATE387520T1/de not_active IP Right Cessation
- 1998-12-04 EP EP02079309A patent/EP1296353A3/de not_active Withdrawn
- 1998-12-04 EP EP98959256A patent/EP1036210B1/de not_active Expired - Lifetime
- 1998-12-04 CN CNB2004100749755A patent/CN100351422C/zh not_active Expired - Fee Related
- 1998-12-04 DE DE69839189T patent/DE69839189T2/de not_active Expired - Fee Related
- 1998-12-04 JP JP2000524490A patent/JP2001526323A/ja active Pending
- 1998-12-04 CN CNB988117762A patent/CN1227385C/zh not_active Expired - Fee Related
-
2001
- 2001-09-21 US US09/957,896 patent/US6841789B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1036210A1 (de) | 2000-09-20 |
EP1296353A3 (de) | 2008-05-07 |
WO1999029922A8 (en) | 1999-09-30 |
CN1227385C (zh) | 2005-11-16 |
WO1999029922A1 (en) | 1999-06-17 |
EP1036210B1 (de) | 2008-02-27 |
CN1280631A (zh) | 2001-01-17 |
JP2001526323A (ja) | 2001-12-18 |
KR19990047679A (ko) | 1999-07-05 |
DE69839189T2 (de) | 2009-03-26 |
US6841789B2 (en) | 2005-01-11 |
US6319326B1 (en) | 2001-11-20 |
ATE387520T1 (de) | 2008-03-15 |
AU1509499A (en) | 1999-06-28 |
CN100351422C (zh) | 2007-11-28 |
EP1296353A2 (de) | 2003-03-26 |
CN1619008A (zh) | 2005-05-25 |
US20020014597A1 (en) | 2002-02-07 |
KR100329810B1 (ko) | 2002-03-25 |
KR20010032692A (ko) | 2001-04-25 |
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Legal Events
Date | Code | Title | Description |
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8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |