DE69836322D1 - Integrierte schaltungsanordung für photoelektrische umwandlung - Google Patents

Integrierte schaltungsanordung für photoelektrische umwandlung

Info

Publication number
DE69836322D1
DE69836322D1 DE69836322T DE69836322T DE69836322D1 DE 69836322 D1 DE69836322 D1 DE 69836322D1 DE 69836322 T DE69836322 T DE 69836322T DE 69836322 T DE69836322 T DE 69836322T DE 69836322 D1 DE69836322 D1 DE 69836322D1
Authority
DE
Germany
Prior art keywords
integrated circuit
photoelectric conversion
photoelectric
conversion
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69836322T
Other languages
English (en)
Other versions
DE69836322T2 (de
Inventor
Nobutoshi Shimamura
Kenzo Shodo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE69836322D1 publication Critical patent/DE69836322D1/de
Application granted granted Critical
Publication of DE69836322T2 publication Critical patent/DE69836322T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/68—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to defects
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Amplifiers (AREA)
DE69836322T 1997-04-03 1998-04-02 Integrierte schaltungsanordung für photoelektrische umwandlung Expired - Lifetime DE69836322T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8476197 1997-04-03
JP08476197A JP4739467B2 (ja) 1997-04-03 1997-04-03 光電気変換ｉｃ
PCT/JP1998/001550 WO1998044563A1 (fr) 1997-04-03 1998-04-02 Dispositif a circuit integre de conversion photoelectrique

Publications (2)

Publication Number Publication Date
DE69836322D1 true DE69836322D1 (de) 2006-12-14
DE69836322T2 DE69836322T2 (de) 2007-06-28

Family

ID=13839675

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69836322T Expired - Lifetime DE69836322T2 (de) 1997-04-03 1998-04-02 Integrierte schaltungsanordung für photoelektrische umwandlung

Country Status (7)

Country Link
US (1) US6316955B1 (de)
EP (1) EP0975025B1 (de)
JP (1) JP4739467B2 (de)
KR (1) KR100502057B1 (de)
CN (1) CN1159767C (de)
DE (1) DE69836322T2 (de)
WO (1) WO1998044563A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030011425A1 (en) * 2001-07-12 2003-01-16 Em Microelectronics - Us Inc. Injection current test circuit
DE10220306C1 (de) * 2002-05-07 2003-12-11 Kostal Leopold Gmbh & Co Kg Elektrische Schaltungsanordnung sowie Verfahren zur Überprüfung der Intaktheit eines Photodiodenarrays
CN100347858C (zh) * 2002-10-31 2007-11-07 上海华虹集成电路有限责任公司 光检测电路
JP5066791B2 (ja) * 2005-06-30 2012-11-07 ミツミ電機株式会社 受光装置及び受光装置の検査方法
JP4159582B2 (ja) 2006-04-26 2008-10-01 松下電器産業株式会社 受光増幅回路のテスト回路およびテスト方法
JP2008070277A (ja) * 2006-09-15 2008-03-27 Matsushita Electric Ind Co Ltd 電流−電圧変換アンプの検査回路及びそれを用いた光ピックアップ装置
EP2149914B1 (de) * 2007-05-18 2013-07-10 Sharp Kabushiki Kaisha Anzeigevorrichtung
EP2148236A4 (de) * 2007-05-18 2011-02-02 Sharp Kk Anzeigevorrichtung
JP5073742B2 (ja) * 2007-05-18 2012-11-14 シャープ株式会社 表示装置
JP4380732B2 (ja) 2007-06-04 2009-12-09 セイコーエプソン株式会社 検出回路、振動型ジャイロセンサ回路、振動型ジャイロセンサおよび電子機器
JP5248396B2 (ja) 2009-04-01 2013-07-31 浜松ホトニクス株式会社 固体撮像素子及びその製造方法、放射線撮像装置及びその製造方法、並びに固体撮像素子の検査方法
US20100283474A1 (en) * 2009-05-11 2010-11-11 Panasonic Corporation Test circuit and optical pickup device
CN110519534B (zh) * 2018-11-08 2021-05-28 神盾股份有限公司 电流驱动的像素电路以及相关的图像传感器
CN112433172A (zh) * 2019-08-08 2021-03-02 鸿富锦精密工业(武汉)有限公司 电源故障侦测装置
JP2022173796A (ja) * 2021-05-10 2022-11-22 ソニーセミコンダクタソリューションズ株式会社 撮像素子、撮像装置及び撮像素子の制御方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA997481A (en) * 1972-12-29 1976-09-21 International Business Machines Corporation Dc testing of integrated circuits and a novel integrated circuit structure to facilitate such testing
US4241358A (en) * 1979-03-26 1980-12-23 Trw Inc. Radiation sensitive device with lateral current
JPS6313368A (ja) 1986-07-04 1988-01-20 Canon Inc 半導体センサ装置
JP2793085B2 (ja) * 1992-06-25 1998-09-03 三洋電機株式会社 光半導体装置とその製造方法
JP3203996B2 (ja) * 1994-11-01 2001-09-04 三菱電機株式会社 電流−電圧変換アンプのテスト回路
US5592124A (en) * 1995-06-26 1997-01-07 Burr-Brown Corporation Integrated photodiode/transimpedance amplifier

Also Published As

Publication number Publication date
US6316955B1 (en) 2001-11-13
CN1251208A (zh) 2000-04-19
CN1159767C (zh) 2004-07-28
JP4739467B2 (ja) 2011-08-03
JPH10284707A (ja) 1998-10-23
EP0975025A4 (de) 2001-06-20
KR100502057B1 (ko) 2005-07-25
KR20010005773A (ko) 2001-01-15
EP0975025A1 (de) 2000-01-26
EP0975025B1 (de) 2006-11-02
WO1998044563A1 (fr) 1998-10-08
DE69836322T2 (de) 2007-06-28

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Legal Events

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