DE69836167D1 - Verfahren zur Beurteilung der richtigen Schnittlage für laminierte Platinen und laminiertes keramisches Elektronikbauteil - Google Patents

Verfahren zur Beurteilung der richtigen Schnittlage für laminierte Platinen und laminiertes keramisches Elektronikbauteil

Info

Publication number
DE69836167D1
DE69836167D1 DE69836167T DE69836167T DE69836167D1 DE 69836167 D1 DE69836167 D1 DE 69836167D1 DE 69836167 T DE69836167 T DE 69836167T DE 69836167 T DE69836167 T DE 69836167T DE 69836167 D1 DE69836167 D1 DE 69836167D1
Authority
DE
Germany
Prior art keywords
laminated
evaluating
electronic component
cutting position
ceramic electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69836167T
Other languages
English (en)
Other versions
DE69836167T2 (de
Inventor
Ryo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of DE69836167D1 publication Critical patent/DE69836167D1/de
Application granted granted Critical
Publication of DE69836167T2 publication Critical patent/DE69836167T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/304—Stacked capacitors obtained from a another capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE69836167T 1997-03-28 1998-03-27 Verfahren zur Beurteilung der richtigen Schnittlage für laminierte Platinen und laminiertes keramisches Elektronikbauteil Expired - Lifetime DE69836167T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7773897 1997-03-28
JP9077738A JPH10275736A (ja) 1997-03-28 1997-03-28 積層基板の切断位置の良否判定方法と積層セラミック電子部品

Publications (2)

Publication Number Publication Date
DE69836167D1 true DE69836167D1 (de) 2006-11-30
DE69836167T2 DE69836167T2 (de) 2007-02-01

Family

ID=13642260

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69836167T Expired - Lifetime DE69836167T2 (de) 1997-03-28 1998-03-27 Verfahren zur Beurteilung der richtigen Schnittlage für laminierte Platinen und laminiertes keramisches Elektronikbauteil

Country Status (4)

Country Link
US (1) US6091598A (de)
EP (1) EP0876089B1 (de)
JP (1) JPH10275736A (de)
DE (1) DE69836167T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051423A (ja) * 2001-08-03 2003-02-21 Tdk Corp 電子部品
JP3365336B2 (ja) * 1999-04-15 2003-01-08 株式会社村田製作所 積層セラミック電子部品の製造方法
JP2001167908A (ja) * 1999-12-03 2001-06-22 Tdk Corp 半導体電子部品
US7345868B2 (en) * 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
JP4059181B2 (ja) * 2003-09-29 2008-03-12 株式会社村田製作所 多端子型積層セラミック電子部品の製造方法
JP4086812B2 (ja) 2004-05-31 2008-05-14 Ｔｄｋ株式会社 積層コンデンサ
KR100616687B1 (ko) 2005-06-17 2006-08-28 삼성전기주식회사 적층형 칩 커패시터
JP4637674B2 (ja) * 2005-07-26 2011-02-23 京セラ株式会社 積層コンデンサ
WO2007020757A1 (ja) * 2005-08-19 2007-02-22 Murata Manufacturing Co., Ltd. 積層セラミックコンデンサ
US7292429B2 (en) * 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
JP4378370B2 (ja) * 2006-09-25 2009-12-02 Ｔｄｋ株式会社 積層コンデンサ
JP4378371B2 (ja) * 2006-09-29 2009-12-02 Ｔｄｋ株式会社 積層コンデンサ
US20080165468A1 (en) * 2007-01-05 2008-07-10 Avx Corporation Very low profile multilayer components
CN101101815B (zh) * 2007-08-09 2010-09-15 威盛电子股份有限公司 电容器及具有其的电子组件
KR101079497B1 (ko) 2010-02-16 2011-11-03 삼성전기주식회사 전기 이중층 커패시터 셀과 전기 이중층 커패시터의 제조방법 및 전기 이중층 커패시터 셀의 제조장치
JP2015111654A (ja) * 2013-10-28 2015-06-18 株式会社村田製作所 積層電子部品の製造方法及び積層電子部品
CN105430943B (zh) * 2015-11-06 2018-06-19 高德（江苏）电子科技有限公司 监控印刷线路板多层板内层报废的方法
US10741328B2 (en) 2018-02-09 2020-08-11 Taiyo Yuden Co., Ltd. Multi-layer ceramic electronic component
JP7148343B2 (ja) * 2018-02-09 2022-10-05 太陽誘電株式会社 積層セラミック電子部品の製造方法及び積層セラミック電子部品
KR20200040429A (ko) 2018-10-10 2020-04-20 삼성전기주식회사 적층 세라믹 전자부품
KR102426209B1 (ko) * 2018-10-10 2022-07-28 삼성전기주식회사 적층 세라믹 전자부품
KR102527705B1 (ko) * 2018-10-10 2023-05-02 삼성전기주식회사 적층 세라믹 전자부품
CN110504104A (zh) * 2019-08-28 2019-11-26 广东风华高新科技股份有限公司 一种多层陶瓷电容器
CN110459402A (zh) * 2019-08-28 2019-11-15 广东风华高新科技股份有限公司 一种多层陶瓷电容器
CN113573484B (zh) * 2021-09-23 2022-03-25 西安宏星电子浆料科技股份有限公司 一种ltcc基板小批量快速制作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517406A (en) * 1984-05-14 1985-05-14 Eldre Components, Inc. Laminated bus bar containing multilayer ceramic capacitors
US4771520A (en) * 1985-04-25 1988-09-20 Murata Manufacturing Co., Ltd. Method of producing laminated ceramic capacitors
SE460827B (sv) * 1987-07-17 1989-11-27 Svenska Skatebox Ab Skridskoslipningsautomat
JP2504229B2 (ja) 1989-11-08 1996-06-05 株式会社村田製作所 積層電子部品の製造方法
JPH05182858A (ja) * 1991-12-27 1993-07-23 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサの製造方法
US5294360A (en) * 1992-01-31 1994-03-15 Lord Corporation Atomically polarizable electrorheological material
JP2976262B2 (ja) * 1992-09-25 1999-11-10 株式会社村田製作所 電子部品の製造方法
JPH0797537A (ja) * 1993-09-28 1995-04-11 Masaaki Fukuda 各種セラミック製ウイスカーを混入分散した 各種有機系樹脂塗料及び各種ゴム系塗料の製造方法
JP3092440B2 (ja) * 1994-02-22 2000-09-25 株式会社村田製作所 積層セラミック電子部品の製造方法
JPH07335479A (ja) * 1994-06-02 1995-12-22 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
JPH08306579A (ja) * 1995-05-08 1996-11-22 Murata Mfg Co Ltd 積層セラミックコンデンサの製造方法
JPH08321434A (ja) * 1995-05-25 1996-12-03 Murata Mfg Co Ltd 積層セラミック電子部品

Also Published As

Publication number Publication date
JPH10275736A (ja) 1998-10-13
US6091598A (en) 2000-07-18
EP0876089A3 (de) 1999-05-26
DE69836167T2 (de) 2007-02-01
EP0876089B1 (de) 2006-10-18
EP0876089A2 (de) 1998-11-04

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