DE69819298D1 - Verfahren zur Herstellung einer dünnen Schicht und Vorrichung zur Durchführung dieses Verfahrens - Google Patents

Verfahren zur Herstellung einer dünnen Schicht und Vorrichung zur Durchführung dieses Verfahrens

Info

Publication number
DE69819298D1
DE69819298D1 DE69819298T DE69819298T DE69819298D1 DE 69819298 D1 DE69819298 D1 DE 69819298D1 DE 69819298 T DE69819298 T DE 69819298T DE 69819298 T DE69819298 T DE 69819298T DE 69819298 D1 DE69819298 D1 DE 69819298D1
Authority
DE
Germany
Prior art keywords
producing
carrying
thin layer
thin
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69819298T
Other languages
English (en)
Other versions
DE69819298T2 (de
Inventor
Matsumoto Shigeharu
Kikuchi Kazuo
Yamasaki Masafumi
Tang Qi
Ogura Shigetaro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shincron Co Ltd
Original Assignee
Shincron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shincron Co Ltd filed Critical Shincron Co Ltd
Publication of DE69819298D1 publication Critical patent/DE69819298D1/de
Application granted granted Critical
Publication of DE69819298T2 publication Critical patent/DE69819298T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/12—Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0073—Reactive sputtering by exposing the substrates to reactive gases intermittently
    • C23C14/0078—Reactive sputtering by exposing the substrates to reactive gases intermittently by moving the substrates between spatially separate sputtering and reaction stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S118/00—Coating apparatus
    • Y10S118/90—Semiconductor vapor doping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Chemical Vapour Deposition (AREA)
DE69819298T 1998-03-27 1998-08-19 Verfahren zur Herstellung einer dünnen Schicht und Vorrichung zur Durchführung dieses Verfahrens Expired - Lifetime DE69819298T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9824698 1998-03-27
JP09824698A JP3735461B2 (ja) 1998-03-27 1998-03-27 複合金属の化合物薄膜形成方法及びその薄膜形成装置

Publications (2)

Publication Number Publication Date
DE69819298D1 true DE69819298D1 (de) 2003-12-04
DE69819298T2 DE69819298T2 (de) 2004-05-13

Family

ID=14214609

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69819298T Expired - Lifetime DE69819298T2 (de) 1998-03-27 1998-08-19 Verfahren zur Herstellung einer dünnen Schicht und Vorrichung zur Durchführung dieses Verfahrens
DE69838039T Expired - Lifetime DE69838039T2 (de) 1998-03-27 1998-08-19 Verfahren zur Herstellung einer dünnen Schicht und Vorrichtung zur Durchführung dieses Verfahrens

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69838039T Expired - Lifetime DE69838039T2 (de) 1998-03-27 1998-08-19 Verfahren zur Herstellung einer dünnen Schicht und Vorrichtung zur Durchführung dieses Verfahrens

Country Status (4)

Country Link
US (2) US6207536B1 (de)
EP (2) EP0945523B1 (de)
JP (1) JP3735461B2 (de)
DE (2) DE69819298T2 (de)

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US7767561B2 (en) * 2004-07-20 2010-08-03 Applied Materials, Inc. Plasma immersion ion implantation reactor having an ion shower grid
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US7498592B2 (en) * 2006-06-28 2009-03-03 Wisconsin Alumni Research Foundation Non-ambipolar radio-frequency plasma electron source and systems and methods for generating electron beams
EP2188411B1 (de) * 2007-08-30 2011-10-26 Koninklijke Philips Electronics N.V. Sputtersystem
KR100995700B1 (ko) * 2008-07-14 2010-11-22 한국전기연구원 3차원 표면형상을 갖는 원통형 가공물을 위한 유도 결합형플라즈마 공정 챔버 및 방법
US8728563B2 (en) 2011-05-03 2014-05-20 Palmaz Scientific, Inc. Endoluminal implantable surfaces, stents, and grafts and method of making same
US9232686B2 (en) * 2014-03-27 2016-01-05 Intel Corporation Thin film based electromagnetic interference shielding with BBUL/coreless packages
CN107532290B (zh) * 2015-03-31 2022-04-01 布勒阿尔策瑙股份有限公司 用于生产涂覆的基板的方法
EP3575437B1 (de) 2018-04-20 2023-09-06 Shincron Co., Ltd. Reaktive sputtervorrichtung und filmbildungsverfahren für zusammengesetzte metallverbundffolie oder mischfolie damit
CN111593309A (zh) * 2019-02-21 2020-08-28 株式会社新柯隆 溅射成膜装置及其溅射成膜方法、化合物薄膜
CN113336450A (zh) * 2021-06-30 2021-09-03 蓝思科技（长沙）有限公司 增透膜及其制备方法和光学元件
WO2023018758A1 (en) * 2021-08-10 2023-02-16 Virginia Commonwealth University Sputtering machines, substrate holders, and sputtering processes with magnetic biasing

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Also Published As

Publication number Publication date
US20010015173A1 (en) 2001-08-23
EP0945523B1 (de) 2003-10-29
US6328865B2 (en) 2001-12-11
DE69838039D1 (de) 2007-08-16
EP0945523A1 (de) 1999-09-29
EP1350864B1 (de) 2007-07-04
US6207536B1 (en) 2001-03-27
DE69819298T2 (de) 2004-05-13
JP3735461B2 (ja) 2006-01-18
DE69838039T2 (de) 2007-10-11
EP1350864A3 (de) 2003-11-26
EP1350864A2 (de) 2003-10-08
JPH11279757A (ja) 1999-10-12

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