DE69809382T2 - Verfahren und Zusammensetzungen zur Herstellung von Kupferoberflächen mit verbesserter Haftung und damit hergestellte Gegenstände - Google Patents

Verfahren und Zusammensetzungen zur Herstellung von Kupferoberflächen mit verbesserter Haftung und damit hergestellte Gegenstände

Info

Publication number
DE69809382T2
DE69809382T2 DE1998609382 DE69809382T DE69809382T2 DE 69809382 T2 DE69809382 T2 DE 69809382T2 DE 1998609382 DE1998609382 DE 1998609382 DE 69809382 T DE69809382 T DE 69809382T DE 69809382 T2 DE69809382 T2 DE 69809382T2
Authority
DE
Germany
Prior art keywords
compositions
processes
production
improved adhesion
articles produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1998609382
Other languages
English (en)
Other versions
DE69809382D1 (de
Inventor
Craig V Bishop
George S Bokisa
Robert J Durante
John R Kochilla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of DE69809382D1 publication Critical patent/DE69809382D1/de
Publication of DE69809382T2 publication Critical patent/DE69809382T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12354—Nonplanar, uniform-thickness material having symmetrical channel shape or reverse fold [e.g., making acute angle, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
DE1998609382 1997-12-19 1998-12-17 Verfahren und Zusammensetzungen zur Herstellung von Kupferoberflächen mit verbesserter Haftung und damit hergestellte Gegenstände Expired - Lifetime DE69809382T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/994,184 US6284309B1 (en) 1997-12-19 1997-12-19 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom

Publications (2)

Publication Number Publication Date
DE69809382D1 DE69809382D1 (de) 2002-12-19
DE69809382T2 true DE69809382T2 (de) 2003-09-11

Family

ID=25540373

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1998609382 Expired - Lifetime DE69809382T2 (de) 1997-12-19 1998-12-17 Verfahren und Zusammensetzungen zur Herstellung von Kupferoberflächen mit verbesserter Haftung und damit hergestellte Gegenstände

Country Status (6)

Country Link
US (3) US6284309B1 (de)
EP (1) EP0926265B1 (de)
JP (1) JP4160190B2 (de)
KR (1) KR100454826B1 (de)
DE (1) DE69809382T2 (de)
TW (1) TW546412B (de)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19908144C1 (de) * 1999-02-25 2000-03-16 Herberts Gmbh & Co Kg Kathodisch abscheidbare Tauchlacke, deren Herstellung und Verwendung
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
IT1307040B1 (it) * 1999-05-31 2001-10-23 Alfachimici Spa Procedimento per promuovere l'aderenza tra un substrato inorganicoed un polimero organico.
JP2001181868A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk 銅及び銅合金用のマイクロエッチング剤
JP2001181867A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk マイクロエッチング剤
US7351353B1 (en) 2000-01-07 2008-04-01 Electrochemicals, Inc. Method for roughening copper surfaces for bonding to substrates
US6383272B1 (en) * 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
DE10066028C2 (de) 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen
DE10034022C2 (de) * 2000-07-07 2003-05-08 Atotech Deutschland Gmbh Saure Behandlungsflüssigkeit und deren Verwendung sowie Verfahren zum Behandeln von Kupferoberflächen
US6506314B1 (en) * 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
KR20030006809A (ko) * 2001-07-16 2003-01-23 (주)오알켐 연속적인 작업과 공급이 가능토록 에칭작업액을재생시키는 조성물 및 그 공급방법
US6652977B2 (en) * 2001-09-10 2003-11-25 Johnson Diversey, Inc. Primer composition
US20040164291A1 (en) * 2002-12-18 2004-08-26 Xingwu Wang Nanoelectrical compositions
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
US20040034612A1 (en) * 2002-03-22 2004-02-19 Nick Mathewson Support vector machines for prediction and classification in supply chain management and other applications
US6926922B2 (en) * 2002-04-09 2005-08-09 Shipley Company, L.L.C. PWB manufacture
EP1498511B1 (de) * 2002-04-23 2016-07-06 JX Nippon Mining & Metals Corporation Verfahren zur stromlosen metallabscheidung und halbleiterwafer mit darauf ausgebildeter metallabscheidungsschicht
DE10221503A1 (de) * 2002-05-14 2003-11-27 Infineon Technologies Ag Zur wenigstens teilweisen Beschichtung mit einer Substanz bestimmter Metallgegenstand
DE10227362A1 (de) * 2002-06-19 2004-01-08 Basf Ag Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen
JP2004068068A (ja) * 2002-08-05 2004-03-04 Nippon Parkerizing Co Ltd 複合材、その製造方法
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition
DE10313517B4 (de) * 2003-03-25 2006-03-30 Atotech Deutschland Gmbh Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens
JP4758614B2 (ja) * 2003-04-07 2011-08-31 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気めっき組成物および方法
JP3909035B2 (ja) * 2003-04-09 2007-04-25 三井金属鉱業株式会社 メッキ前処理液およびメッキ前処理方法
US7232478B2 (en) 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
US6896739B1 (en) * 2003-12-03 2005-05-24 For Your Ease Only, Inc. Anti-tarnish aqueous treatment
TWI261629B (en) * 2003-12-11 2006-09-11 Ind Tech Res Inst Surface treatment process for enhancing the release of metal ions from sacrificial electrode and sacrificial electrode prepared by said process
US7078809B2 (en) * 2003-12-31 2006-07-18 Dynacraft Industries Sdn. Bhd. Chemical leadframe roughening process and resulting leadframe and integrated circuit package
DE102004041701A1 (de) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Verfahren zur elektrolytischen Abscheidung von Metallen
JP4033237B2 (ja) 2005-03-11 2008-01-16 日立化成工業株式会社 銅の表面処理方法及び銅
US20060225605A1 (en) * 2005-04-11 2006-10-12 Kloeckener James R Aqueous coating compositions and process for treating metal plated substrates
CN101180789B (zh) * 2005-05-31 2012-09-05 三菱电机株式会社 电动机控制装置
US7393461B2 (en) * 2005-08-23 2008-07-01 Kesheng Feng Microetching solution
US20070111367A1 (en) * 2005-10-19 2007-05-17 Basol Bulent M Method and apparatus for converting precursor layers into photovoltaic absorbers
US20070093006A1 (en) * 2005-10-24 2007-04-26 Basol Bulent M Technique For Preparing Precursor Films And Compound Layers For Thin Film Solar Cell Fabrication And Apparatus Corresponding Thereto
JP4734637B2 (ja) * 2005-11-10 2011-07-27 国立大学法人岩手大学 表面反応性固体，表面反応性固体の製造方法，表面反応性固体を用いた配線基板及び配線基板の製造方法
US7875558B2 (en) * 2005-12-21 2011-01-25 Kesheng Feng Microetching composition and method of using the same
US7456114B2 (en) * 2005-12-21 2008-11-25 Kesheng Feng Microetching composition and method of using the same
CN100497751C (zh) * 2005-12-28 2009-06-10 无锡华润安盛科技有限公司 电子元器件外引线的微蚀剂
US20070278629A1 (en) * 2006-06-06 2007-12-06 International Business Machines Corporation Method and structure for improving the reliability of leadframe integrated circuit packages
US7892413B2 (en) * 2006-09-27 2011-02-22 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
US20090183675A1 (en) * 2006-10-13 2009-07-23 Mustafa Pinarbasi Reactor to form solar cell absorbers
US20080175993A1 (en) * 2006-10-13 2008-07-24 Jalal Ashjaee Reel-to-reel reaction of a precursor film to form solar cell absorber
US7838980B1 (en) 2007-09-27 2010-11-23 National Semiconductor Corporation TO263 device package having low moisture sensitivity
US8097934B1 (en) 2007-09-27 2012-01-17 National Semiconductor Corporation Delamination resistant device package having low moisture sensitivity
US8409418B2 (en) * 2009-02-06 2013-04-02 Solopower, Inc. Enhanced plating chemistries and methods for preparation of group IBIIIAVIA thin film solar cell absorbers
US8425753B2 (en) * 2008-05-19 2013-04-23 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
TW200927481A (en) * 2007-12-18 2009-07-01 Wen-Jung Jiang Method of producing ceramic-copper foil laminated board
US20100155260A1 (en) * 2008-12-22 2010-06-24 Kwan Yiu Fai Micro-blasting treatment for lead frames
JP5393214B2 (ja) * 2009-03-24 2014-01-22 新日鉄住金エンジニアリング株式会社 銅系素材の酸洗方法
KR101619380B1 (ko) * 2009-05-14 2016-05-11 삼성디스플레이 주식회사 식각액 조성물 및 이를 이용한 어레이 기판의 제조방법
CN101901882B (zh) * 2009-05-31 2012-12-12 比亚迪股份有限公司 一种金属积层板及其制备方法及采用该积层板的电池
CN101931060B (zh) * 2009-06-26 2012-12-12 比亚迪股份有限公司 一种金属积层板及其制备方法及采用该金属积层板的电池
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
JP6101421B2 (ja) * 2010-08-16 2017-03-22 インテグリス・インコーポレーテッド 銅または銅合金用エッチング液
CN110054820A (zh) 2010-10-13 2019-07-26 埃克森美孚化学专利公司 弹性体组合物用的硅烷官能化烃聚合物改性剂
KR20120044630A (ko) * 2010-10-28 2012-05-08 주식회사 동진쎄미켐 구리 함유 금속막 식각액 조성물 및 이를 이용한 식각 방법
EP2453041B1 (de) 2010-11-10 2014-02-12 Atotech Deutschland GmbH Lösung und Verfahren für die Vorbehandlung von Kupferoberflächen mit einer N-alkoxylierten haftungsfördernden Verbindung
WO2013004624A1 (en) * 2011-07-07 2013-01-10 Atotech Deutschland Gmbh Method for providing organic resist adhesion to a copper or copper alloy surface
WO2013028197A1 (en) 2011-08-25 2013-02-28 Corning Cable Systems Llc Systems, components, and methods for providing location services for mobile/wireless client devices in distributed antenna systems using additional signal propagation delay
JP5974013B2 (ja) * 2011-09-22 2016-08-23 株式会社カネカ 硬化性組成物およびその硬化物
TWI437931B (zh) * 2011-12-16 2014-05-11 Prologium Technology Co Ltd 電路板結構
US11089693B2 (en) 2011-12-16 2021-08-10 Prologium Technology Co., Ltd. PCB structure with a silicone layer as adhesive
EP2644744A1 (de) * 2012-03-29 2013-10-02 Atotech Deutschland GmbH Verfahren zur Förderung der Haftung zwischen dielektrischen Substraten und Metallschichten
US9338896B2 (en) * 2012-07-25 2016-05-10 Enthone, Inc. Adhesion promotion in printed circuit boards
EP2754732B1 (de) 2013-01-15 2015-03-11 ATOTECH Deutschland GmbH Wässrige Zusammensetzung zur Ätzung von Kupfer und Kupferlegierungen
JP6088999B2 (ja) * 2013-05-02 2017-03-01 富士フイルム株式会社 エッチング液およびエッチング液のキット、これをもちいたエッチング方法および半導体基板製品の製造方法
EP2853619A1 (de) * 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Verfahren zur Behandlung von vertieften Strukturen in dielektrischen Materialien für die Abstrichentfernung
KR101964901B1 (ko) 2013-12-06 2019-04-02 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 표면 잔류물 제거용 세정 제형
KR101590081B1 (ko) 2014-10-07 2016-02-02 한국생산기술연구원 인쇄회로기판 내층의 표면처리 방법
JP6578304B2 (ja) * 2015-01-07 2019-09-18 太陽インキ製造株式会社 金属基材用表面処理剤
JP6429079B2 (ja) * 2015-02-12 2018-11-28 メック株式会社 エッチング液及びエッチング方法
CN111902379B (zh) * 2018-03-28 2023-02-17 富士胶片电子材料美国有限公司 清洗组合物
JP7233320B2 (ja) * 2019-06-26 2023-03-06 新光電気工業株式会社 配線基板の製造方法
CN111809183B (zh) * 2020-07-14 2022-08-09 北京航空航天大学宁波创新研究院 一种铜镓合金的金相腐蚀液以及金相显示方法
CA3110357A1 (en) * 2021-02-25 2022-08-25 Sixring Inc. Modified sulfuric acid and uses thereof

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2649361A (en) 1949-05-13 1953-08-18 Enthone Method of dissolving metals and compostion therefor
US2698781A (en) 1953-04-27 1955-01-04 Enthone Accelerating action of acids on metals
US2937940A (en) 1957-07-01 1960-05-24 Eltex Chemical Corp Selective stripping of electroplated metals
US3136670A (en) 1961-09-14 1964-06-09 Photo Engravers Res Inc Powderless etching
US3668131A (en) 1968-08-09 1972-06-06 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions
US3930965A (en) 1974-03-18 1976-01-06 Mcgean Chemical Company, Inc. Zinc-copper alloy electroplating baths
DE2557269A1 (de) * 1975-12-19 1977-06-30 Licentia Gmbh Verfahren zum aetzen von kupfer oder kupferlegierungen
US4182784A (en) 1977-12-16 1980-01-08 Mcgean Chemical Company, Inc. Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid
US4334966A (en) 1981-05-19 1982-06-15 Mcgean Chemical Company, Inc. Method of copper plating gravure cylinders
US4871429A (en) 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4582576A (en) 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4657632A (en) 1985-08-29 1987-04-14 Techno Instruments Investments 1983 Ltd. Use of immersion tin coating as etch resist
US4882202A (en) 1985-08-29 1989-11-21 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4715894A (en) 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4689085A (en) 1986-06-30 1987-08-25 Dow Corning Corporation Coupling agent compositions
US4859281A (en) 1987-06-04 1989-08-22 Pennwalt Corporation Etching of copper and copper bearing alloys
US5326454A (en) * 1987-08-26 1994-07-05 Martin Marietta Corporation Method of forming electrodeposited anti-reflective surface coatings
JPH0713304B2 (ja) 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
EP0342669B1 (de) 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Schaltungsplatten
EP0364132A1 (de) 1988-09-29 1990-04-18 Shikoku Chemicals Corporation Verfahren zur Herstellung eines Konversionsüberzuges auf Oberflächen aus Kupfer oder Kupferlegierungen
US4895099A (en) 1988-11-03 1990-01-23 D.E.M. Controls Of Canada Device for sequential spray application of chemical solutions used in the preparation of circuit board inner layers
US5039576A (en) 1989-05-22 1991-08-13 Atochem North America, Inc. Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
US5160422A (en) 1989-05-29 1992-11-03 Shimizu Co., Ltd. Bath for immersion plating tin-lead alloys
US5073456A (en) 1989-12-05 1991-12-17 E. I. Du Pont De Nemours And Company Multilayer printed circuit board formation
US5217751A (en) 1991-11-27 1993-06-08 Mcgean-Rohco, Inc. Stabilized spray displacement plating process
US5196053A (en) 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
JP3387529B2 (ja) * 1992-10-06 2003-03-17 朝日化学工業株式会社 銅および銅合金の化学溶解液
JPH06287774A (ja) 1993-04-05 1994-10-11 Metsuku Kk 銅および銅合金の表面処理剤
TW270944B (de) 1993-05-10 1996-02-21 Shikoku Kakoki Co Ltd
US5391402A (en) 1993-12-03 1995-02-21 Motorola Immersion plating of tin-bismuth solder
JPH07314603A (ja) 1993-12-28 1995-12-05 Nippon Denkai Kk 銅張積層体、多層プリント回路板及びそれらの処理方法
JP2781954B2 (ja) * 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤
AUPM694694A0 (en) 1994-07-21 1994-08-11 M.I.M. Holdings Limited Prevention of cathode corrosion during electrowinning
JP3400558B2 (ja) 1994-08-12 2003-04-28 メック株式会社 銅および銅合金のエッチング液
GB9425090D0 (en) 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
US5643657A (en) 1995-04-28 1997-07-01 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
US5601695A (en) * 1995-06-07 1997-02-11 Atotech U.S.A., Inc. Etchant for aluminum alloys
US5614324A (en) 1995-07-24 1997-03-25 Gould Electronics Inc. Multi-layer structures containing a silane adhesion promoting layer
JP2923524B2 (ja) 1995-08-01 1999-07-26 メック株式会社 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US5554211A (en) 1995-11-15 1996-09-10 Mcgean-Rohco, Inc. Aqueous electroless plating solutions
US5679444A (en) 1996-07-15 1997-10-21 International Business Machines Corporation Method for producing multi-layer circuit board and resulting article of manufacture
TW374802B (en) * 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
US6051117A (en) * 1996-12-12 2000-04-18 Eltech Systems, Corp. Reticulated metal article combining small pores with large apertures
US5869130A (en) 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6063172A (en) * 1998-10-13 2000-05-16 Mcgean-Rohco, Inc. Aqueous immersion plating bath and method for plating

Also Published As

Publication number Publication date
US6579591B2 (en) 2003-06-17
KR100454826B1 (ko) 2005-01-24
JPH11261215A (ja) 1999-09-24
JP4160190B2 (ja) 2008-10-01
EP0926265A1 (de) 1999-06-30
KR19990062521A (ko) 1999-07-26
US6602440B2 (en) 2003-08-05
US20020056702A1 (en) 2002-05-16
TW546412B (en) 2003-08-11
US6284309B1 (en) 2001-09-04
DE69809382D1 (de) 2002-12-19
EP0926265B1 (de) 2002-11-13
US20020048685A1 (en) 2002-04-25

Similar Documents

Publication Publication Date Title
DE69809382T2 (de) Verfahren und Zusammensetzungen zur Herstellung von Kupferoberflächen mit verbesserter Haftung und damit hergestellte Gegenstände
DE69841885D1 (de) Verfahren zur herstellung von kompositsolen, überzugkomposition und optischem element
DE69816884D1 (de) Kontinuierliches Verfahren zur Herstellung von Copolymeren mit veränderlicher Zusammensetzung
DE69521009D1 (de) Verbesserte Verfahren zur Herstellung von Polymere
DE69506496D1 (de) Verfahren zur Herstellung von modifizierten Harzen und ihre Verwendungen
DE69823823D1 (de) Verfahren zur Herstellung von beschichtete structurelle Gegenstände
DE69330603D1 (de) Verfahren zur Metallisierung und Verbindung bei der Herstellung von Leistungshalbleiterbauelementen
DE69835139D1 (de) Fäulnisverhindernde emulsionsbeschichtungszusammensetzung, verfahren zur herstellung und mit dieser fäulnisverhindernden zusammensetzung beschichteter gegenstand
DE69428583D1 (de) Verfahren zur kontinuierlichen Herstellung von Laktidcopolymer
DE69822827D1 (de) Verfahren zur herstellung von mehrkomponentigen und mehrlagigen vliesstoffen
DE59301959D1 (de) Verfahren zur Herstellung von Bauteilen- oder Substraten mit Verbundbeschichtungen
DE69014483T2 (de) Elektrolumineszentes Wechselstrom-Pulvertyppaneel und Verfahren zur Herstellung desselben.
DE69808569T2 (de) Verfahren zur Herstellung von keramischen Pulvern
DE69429243D1 (de) Elektrode zur herstellung von plasma und verfahren zur herstellung der elektrode
DE59707046D1 (de) Kontinuierliches Verfahren zur Herstellung von 4-Aminopiperidinen
DE59404875D1 (de) Verfahren zur Herstellung von Verbundgegenständen aus Polyestern und Elastomeren
DE69712157T2 (de) Verfahren zur Herstellung von Acrylnitril
DE69717556T2 (de) Verfahren zur Herstellung von Lacküberzug mit Metallglanzeffekt
DE69806832T2 (de) Verfahren zur Herstellung von Octaphenylcyclotetrasiloxan und Sym-Tetramethyltetraphenylcyclotetrasiloxan
DE59900154D1 (de) Verfahren zur Herstellung von Klebemitteln mit verbesserter Adhäsion
DE59801380D1 (de) Verfahren zur kontunierlichen Herstellung von mit Feuchtigkeit vernetzbaren Organopolysiloxanmassen
DE59802293D1 (de) Verfahren zur Herstellung von Metall-Kunststoff-Verbundelementen
DE69508151D1 (de) Verfahren zur Herstellung von Verbundfolie und Verbundfolie
DE69613190T2 (de) Kompositionen mit antiviralen wirkungen und verfahren zur herstellung
DE59700246D1 (de) Verfahren zur galvanotechnischen Metallisierung von Kunststoffoberflächen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition