JP7233320B2 - 配線基板の製造方法 - Google Patents
配線基板の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000011248 coating agent Substances 0.000 claims description 77
- 238000000576 coating method Methods 0.000 claims description 77
- 230000002708 enhancing effect Effects 0.000 claims description 46
- 239000010408 film Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 22
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 13
- 239000003929 acidic solution Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 6
- 238000007788 roughening Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 150
- 239000007788 liquid Substances 0.000 description 32
- 239000000243 solution Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- -1 silane compound Chemical class 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical group C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00539—Wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Description
図1は、第1実施形態に係る配線基板を例示する断面図であり、図1(a)は配線層と絶縁層が交互に複数積層された配線基板の一部を示した図、図1(b)は図1(a)のA部の部分拡大図である。
次に、第1実施形態に係る配線基板の製造方法について説明する。図2~図4は、第1実施形態に係る配線基板の製造工程を例示する図である。なお、本実施形態では、単品の配線基板を形成する工程を示すが、配線基板となる複数の部分を作製後、個片化して各配線基板とする工程としてもよい。
第2実施形態では、第1実施形態とは異なる手法で密着増強被膜22の厚さの均一性を高める例を示す。なお、第2実施形態において、既に説明した実施形態と同一構成部についての説明は省略する場合がある。
10 絶縁層
20 配線層
21 凹凸
22 密着増強被膜
30 絶縁層
30x ビアホール
40 配線層
300 除去処理液
Claims (5)
- 第1絶縁層上に配線層を形成する工程と、
前記配線層の前記第1絶縁層と接していない表面を粗化して凹凸を形成する工程と、
前記凹凸上に密着増強被膜を形成する工程と、
酸性の溶液を用いて前記密着増強被膜を部分的に除去する工程と、
前記第1絶縁層上に前記配線層を被覆する第2絶縁層を形成する工程と、を有し、
前記密着増強被膜を形成する工程では、前記密着増強被膜は、前記凹凸に沿って形成され、前記凹凸の凹部の底部にも形成され、
前記密着増強被膜は、前記底部側に形成された薄膜部と、前記底部とは反対側に形成された厚膜部と、を含み、
前記密着増強被膜を部分的に除去する工程では、前記薄膜部と前記厚膜部との厚さの差を縮小し、前記密着増強被膜の厚さの均一性を向上させる配線基板の製造方法。 - 前記密着増強被膜を部分的に除去する工程では、前記酸性の溶液は、前記底部に達する粘度に調整されている請求項1に記載の配線基板の製造方法。
- 前記密着増強被膜を部分的に除去する工程では、前記酸性の溶液は、前記底部に達しない粘度に調整されている請求項1に記載の配線基板の製造方法。
- 前記密着増強被膜は、シランカップリング剤を用いて形成される請求項1乃至3の何れか一項に記載の配線基板の製造方法。
- 前記凹凸の粗度は、Ra=50~200nmである請求項1乃至4の何れか一項に記載の配線基板の製造方法。
Priority Applications (3)
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JP2019118956A JP7233320B2 (ja) | 2019-06-26 | 2019-06-26 | 配線基板の製造方法 |
US16/905,096 US11001930B2 (en) | 2019-06-26 | 2020-06-18 | Method of manufacturing wiring board |
TW109120983A TWI842913B (zh) | 2019-06-26 | 2020-06-20 | 佈線基板的製造方法 |
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JP2019118956A JP7233320B2 (ja) | 2019-06-26 | 2019-06-26 | 配線基板の製造方法 |
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JP2021005646A JP2021005646A (ja) | 2021-01-14 |
JP7233320B2 true JP7233320B2 (ja) | 2023-03-06 |
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US (1) | US11001930B2 (ja) |
JP (1) | JP7233320B2 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003298230A (ja) | 2002-03-28 | 2003-10-17 | Tokai Rubber Ind Ltd | フレキシブルプリント配線板用基材 |
JP2004343004A (ja) | 2003-05-19 | 2004-12-02 | Asahi Kasei Corp | プリント回路形成等に使用される銅箔を備えた複合体、プリント回路形成用積層体およびその製造方法 |
JP2011228632A (ja) | 2010-03-29 | 2011-11-10 | Ngk Spark Plug Co Ltd | 多層配線基板 |
JP2013119240A (ja) | 2011-12-08 | 2013-06-17 | Furukawa Electric Co Ltd:The | 高周波基板用銅張り積層板及びそれに用いる表面処理銅箔 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6284309B1 (en) * | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
JP3752161B2 (ja) * | 2001-06-13 | 2006-03-08 | インターナショナル・ビジネス・マシーンズ・コーポレーション | プリント配線基板の銅表面粗化方法ならびにプリント配線基板およびその製造方法 |
JP2008109111A (ja) | 2006-09-27 | 2008-05-08 | Mec Kk | 対樹脂接着層及びこれを用いた積層体の製造方法 |
DE102007045794A1 (de) | 2006-09-27 | 2008-04-17 | MEC Co., Ltd., Amagasaki | Haftvermittler für Harz und Verfahren zur Erzeugung eines Laminates, umfassend den Haftvermittler |
WO2009116484A1 (ja) * | 2008-03-17 | 2009-09-24 | 大成プラス株式会社 | 亜鉛系鍍金鋼板と被着材の接合体及びその製造方法 |
KR20140060767A (ko) * | 2012-11-12 | 2014-05-21 | 삼성전기주식회사 | 회로 기판 및 그 제조 방법 |
-
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- 2019-06-26 JP JP2019118956A patent/JP7233320B2/ja active Active
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- 2020-06-18 US US16/905,096 patent/US11001930B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003298230A (ja) | 2002-03-28 | 2003-10-17 | Tokai Rubber Ind Ltd | フレキシブルプリント配線板用基材 |
JP2004343004A (ja) | 2003-05-19 | 2004-12-02 | Asahi Kasei Corp | プリント回路形成等に使用される銅箔を備えた複合体、プリント回路形成用積層体およびその製造方法 |
JP2011228632A (ja) | 2010-03-29 | 2011-11-10 | Ngk Spark Plug Co Ltd | 多層配線基板 |
JP2013119240A (ja) | 2011-12-08 | 2013-06-17 | Furukawa Electric Co Ltd:The | 高周波基板用銅張り積層板及びそれに用いる表面処理銅箔 |
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Publication number | Publication date |
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TW202102079A (zh) | 2021-01-01 |
JP2021005646A (ja) | 2021-01-14 |
US11001930B2 (en) | 2021-05-11 |
US20200413545A1 (en) | 2020-12-31 |
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