DE69738298D1 - Anisotropische, leitende folie und ihr herstellungsverfahren - Google Patents
Anisotropische, leitende folie und ihr herstellungsverfahrenInfo
- Publication number
- DE69738298D1 DE69738298D1 DE69738298T DE69738298T DE69738298D1 DE 69738298 D1 DE69738298 D1 DE 69738298D1 DE 69738298 T DE69738298 T DE 69738298T DE 69738298 T DE69738298 T DE 69738298T DE 69738298 D1 DE69738298 D1 DE 69738298D1
- Authority
- DE
- Germany
- Prior art keywords
- anisotropic
- manufacturing
- leading film
- leading
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20954296 | 1996-08-08 | ||
JP20954296 | 1996-08-08 | ||
JP11724497 | 1997-05-07 | ||
JP11724497 | 1997-05-07 | ||
PCT/JP1997/002750 WO1998007216A1 (fr) | 1996-08-08 | 1997-08-06 | Film conducteur anisotrope et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69738298D1 true DE69738298D1 (de) | 2007-12-27 |
DE69738298T2 DE69738298T2 (de) | 2008-09-18 |
Family
ID=26455389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69738298T Expired - Lifetime DE69738298T2 (de) | 1996-08-08 | 1997-08-06 | Anisotropische, leitende folie und ihr herstellungsverfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US6245175B1 (de) |
EP (1) | EP0918371B1 (de) |
JP (1) | JP3179503B2 (de) |
KR (1) | KR100478060B1 (de) |
CN (1) | CN1111926C (de) |
DE (1) | DE69738298T2 (de) |
WO (1) | WO1998007216A1 (de) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3737899B2 (ja) * | 1999-01-29 | 2006-01-25 | 日東電工株式会社 | 半導体素子の検査方法およびそのための異方導電性フィルム |
JP2000331538A (ja) | 1999-05-17 | 2000-11-30 | Nitto Denko Corp | 異方導電性フィルムおよびその製造方法 |
WO2001020661A1 (fr) * | 1999-09-10 | 2001-03-22 | Nitto Denko Corporation | Plaquette semi-conductrice dotee d'un film anisotrope et procede de fabrication correspondant |
WO2001051580A1 (fr) * | 2000-01-13 | 2001-07-19 | Nitto Denko Corporation | Feuille adhesive poreuse, plaquette a semi-conducteurs munie de la feuille adhesive poreuse, et procede de fabrication associe |
JP2001223240A (ja) | 2000-02-10 | 2001-08-17 | Nitto Denko Corp | 半導体装置 |
JP3427086B2 (ja) * | 2000-02-23 | 2003-07-14 | Necエレクトロニクス株式会社 | Icソケット |
JP3491595B2 (ja) * | 2000-02-25 | 2004-01-26 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
US6759098B2 (en) * | 2000-03-20 | 2004-07-06 | Axcelis Technologies, Inc. | Plasma curing of MSQ-based porous low-k film materials |
DE10118816A1 (de) | 2000-04-18 | 2001-10-31 | Nitto Denko Corp | Herstellungsverfahren für eine anisotrope leitfähige Folie und nach diesem Verfahren hergestellte anisotrope leitfähige Folie |
US6774315B1 (en) * | 2000-05-24 | 2004-08-10 | International Business Machines Corporation | Floating interposer |
JP4663158B2 (ja) * | 2000-06-14 | 2011-03-30 | 積水化学工業株式会社 | 微粒子配置フィルム、導電接続フィルム、導電接続構造体及び微粒子の配置方法 |
ATE284083T1 (de) * | 2000-09-25 | 2004-12-15 | Jsr Corp | Anisotropisches leitfähiges verbindungsblatt, herstellungsverfahren dafür und produkt davon |
JP4522604B2 (ja) | 2001-03-19 | 2010-08-11 | 日東電工株式会社 | 異方導電性フィルム |
US20030127727A1 (en) * | 2002-01-09 | 2003-07-10 | Nitto Denko Corporation | Thermally conductive sheet and semiconductor device using same |
CN1241174C (zh) * | 2002-01-26 | 2006-02-08 | 新科实业有限公司 | 将含有各向异性导电胶(acp)的硬盘驱动器磁头稳定在磁头-万向节组件(hga)上防止静电放电(esd)的方法和装置 |
CN100550519C (zh) * | 2002-03-20 | 2009-10-14 | 日本压着端子制造株式会社 | 柔软性良导电层、各向异性导电片及其制造方法 |
US20030178221A1 (en) * | 2002-03-21 | 2003-09-25 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
JP4054861B2 (ja) * | 2002-08-08 | 2008-03-05 | 三菱電機株式会社 | 表示装置および表示装置の製造方法 |
JP2004146210A (ja) * | 2002-10-24 | 2004-05-20 | Fuji Polymer Industries Co Ltd | 異方導電性エラスチックコネクタ |
US20040079474A1 (en) * | 2002-10-24 | 2004-04-29 | Nitto Denko Corporation | Production method of anisotropic conductive connector |
EP1612891B1 (de) * | 2003-03-31 | 2011-11-30 | Sumitomo Electric Industries, Ltd. | Anisotroper elektrisch leitender film und verfahren zu seiner herstellung |
TWI239684B (en) * | 2003-04-16 | 2005-09-11 | Jsr Corp | Anisotropic conductive connector and electric inspection device for circuit device |
ATE419661T1 (de) * | 2003-09-09 | 2009-01-15 | Nitto Denko Corp | Anisotrop-leitender film , herstellungs- und gebrauchsverfahren |
JP2005135772A (ja) * | 2003-10-30 | 2005-05-26 | Nitto Denko Corp | 異方導電性フィルムの製造方法 |
JP2005150263A (ja) * | 2003-11-13 | 2005-06-09 | Nitto Denko Corp | 両面配線回路基板 |
KR20050065038A (ko) * | 2003-12-24 | 2005-06-29 | 삼성전기주식회사 | 비수직 비아가 구비된 인쇄회로기판 및 패키지 |
EP1718125B9 (de) | 2004-02-18 | 2013-08-21 | Shin-Etsu Polymer Co., Ltd. | Elektrolumineszenz-folie und- element zum beleuchten eines drucktastenschalters |
JP4405307B2 (ja) * | 2004-04-01 | 2010-01-27 | ソニーケミカル&インフォメーションデバイス株式会社 | 接着フィルムの切断方法及び切断装置 |
DE102004027887B4 (de) * | 2004-05-28 | 2010-07-29 | Feinmetall Gmbh | Prüfeinrichtung zur elektrischen Prüfung eines Prüflings |
US7633764B2 (en) * | 2005-04-27 | 2009-12-15 | Broadcom Corporation | Ball grid array configuration for reducing path distances |
CN100460090C (zh) * | 2005-11-03 | 2009-02-11 | 湖北省化学研究院 | 利用液滴喷射装置制备各向异性导电胶膜的方法及装置 |
US20070238324A1 (en) * | 2006-04-07 | 2007-10-11 | Lotes Co., Ltd. | Electrical connector |
US20070245556A1 (en) * | 2006-04-19 | 2007-10-25 | Eiichi Hosomi | A method and system for plated thru hole placement in a substrate |
CN101212085B (zh) * | 2006-12-29 | 2012-01-18 | 鸿富锦精密工业(深圳)有限公司 | 导电元件之粘合结构组合 |
TWI354846B (en) * | 2007-01-26 | 2011-12-21 | Au Optronics Corp | Adhesive structure and method for manufacturing th |
US8017873B2 (en) * | 2008-03-03 | 2011-09-13 | Himax Technologies Limited | Built-in method of thermal dissipation layer for driver IC substrate and structure thereof |
JP2011029501A (ja) * | 2009-07-28 | 2011-02-10 | Akira Technology Co Ltd | 導電コロイド構造の改良方法およびその完成品 |
KR101127449B1 (ko) * | 2009-10-07 | 2012-03-26 | 이성규 | 이방성 도전필름의 제조방법 및 그에 의해 제조되는 이방성 도전필름 |
JP5318840B2 (ja) * | 2010-11-08 | 2013-10-16 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体 |
US9333337B2 (en) * | 2011-05-16 | 2016-05-10 | Lawrence Livermore National Security, Llc | Method of fabricating high-density hermetic electrical feedthroughs using insulated wire bundles |
US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
US20140141195A1 (en) * | 2012-11-16 | 2014-05-22 | Rong-Chang Liang | FIXED ARRAY ACFs WITH MULTI-TIER PARTIALLY EMBEDDED PARTICLE MORPHOLOGY AND THEIR MANUFACTURING PROCESSES |
TWI462244B (zh) * | 2011-10-17 | 2014-11-21 | Ind Tech Res Inst | 異方向性導電膜片及其製作方法 |
KR101215375B1 (ko) * | 2011-11-25 | 2012-12-26 | (주)기가레인 | 컨택트 필름, 상기 컨택트 필름의 제조방법, 프로브 유닛 및 lcd 패널 검사장치 |
JP6645730B2 (ja) * | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
CN107689332B (zh) * | 2014-10-15 | 2019-07-26 | 申宇慈 | 导线柱体集成体、功能性柱体及其集成体、以及功能性基板 |
CN106909006A (zh) * | 2017-04-25 | 2017-06-30 | 昆山龙腾光电有限公司 | 黏贴结构及采用该黏贴结构的导电构造和液晶显示装置 |
JP7080879B2 (ja) * | 2017-05-18 | 2022-06-06 | 信越ポリマー株式会社 | 電気コネクターおよびその製造方法 |
CN108538792A (zh) * | 2018-05-16 | 2018-09-14 | 武汉华星光电半导体显示技术有限公司 | 导电物质分布状态可控的异方性导电胶及其制备方法 |
JP2020091982A (ja) * | 2018-12-04 | 2020-06-11 | 東京特殊電線株式会社 | 異方性導電シート |
WO2020175685A1 (ja) * | 2019-02-28 | 2020-09-03 | 三井化学株式会社 | 異方導電性シート、電気検査装置および電気検査方法 |
CN109979646B (zh) * | 2019-04-26 | 2020-10-02 | 中国电子科技集团公司第二十九研究所 | 各向异性导电丝网、块材和膜片的制备方法及制品 |
WO2021102925A1 (zh) * | 2019-11-29 | 2021-06-03 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
JP7342270B2 (ja) * | 2020-07-10 | 2023-09-11 | 三井化学株式会社 | 異方導電性シート、異方導電性シートの製造方法、電気検査装置および電気検査方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE794428A (fr) * | 1972-01-29 | 1973-07-23 | Amp Inc | Connecteur electrique et son procede de fabrication |
CA1056031A (en) * | 1974-05-10 | 1979-06-05 | Leonard S. Buchoff | Layered strip connector |
JPS6188407A (ja) * | 1984-10-05 | 1986-05-06 | 柴田 喜一 | 異方性導電シ−トの製造方法 |
JPS61292866A (ja) * | 1985-06-21 | 1986-12-23 | 株式会社日立製作所 | 電子部品の接合方法 |
JPS63502786A (ja) * | 1986-01-15 | 1988-10-13 | サーキュイット・コンポーネンツ・インコーポレーテッド | 電気回路板相互接続器 |
JPS63266783A (ja) * | 1987-04-10 | 1988-11-02 | アンプ インコ−ポレ−テツド | 熱圧着コネクタ |
JP2536676B2 (ja) * | 1990-07-30 | 1996-09-18 | 日本電気株式会社 | マイクロピン集合体及びその製造方法 |
JPH05152021A (ja) * | 1991-11-28 | 1993-06-18 | Nitto Denko Corp | 異方導電コネクター |
JPH079773B2 (ja) * | 1992-12-25 | 1995-02-01 | 第二しなのポリマー株式会社 | 配線シ−トの製造方法 |
JPH07312246A (ja) * | 1994-05-13 | 1995-11-28 | Shinano Polymer Kk | 異方電気コネクタ |
-
1997
- 1997-08-06 WO PCT/JP1997/002750 patent/WO1998007216A1/ja active IP Right Grant
- 1997-08-06 CN CN97198652A patent/CN1111926C/zh not_active Expired - Fee Related
- 1997-08-06 JP JP50958098A patent/JP3179503B2/ja not_active Expired - Fee Related
- 1997-08-06 EP EP97934721A patent/EP0918371B1/de not_active Expired - Lifetime
- 1997-08-06 US US09/230,865 patent/US6245175B1/en not_active Expired - Fee Related
- 1997-08-06 DE DE69738298T patent/DE69738298T2/de not_active Expired - Lifetime
- 1997-08-06 KR KR10-1999-7001044A patent/KR100478060B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1233350A (zh) | 1999-10-27 |
EP0918371A4 (de) | 2000-01-19 |
KR20000029876A (ko) | 2000-05-25 |
WO1998007216A1 (fr) | 1998-02-19 |
DE69738298T2 (de) | 2008-09-18 |
KR100478060B1 (ko) | 2005-03-23 |
US6245175B1 (en) | 2001-06-12 |
EP0918371A1 (de) | 1999-05-26 |
EP0918371B1 (de) | 2007-11-14 |
CN1111926C (zh) | 2003-06-18 |
JP3179503B2 (ja) | 2001-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8381 | Inventor (new situation) |
Inventor name: HOTTA, YUJI, NITTO DENKO CORPORATION, OSAKA 56, JP Inventor name: MOCHIZUKI, AMANE, NITTO DENKO CORPORATION, OSA, JP |
|
8364 | No opposition during term of opposition |