DE69737281D1 - Vorrichtung und Verfahren zum Drucken von Lötpaste - Google Patents

Vorrichtung und Verfahren zum Drucken von Lötpaste

Info

Publication number
DE69737281D1
DE69737281D1 DE69737281T DE69737281T DE69737281D1 DE 69737281 D1 DE69737281 D1 DE 69737281D1 DE 69737281 T DE69737281 T DE 69737281T DE 69737281 T DE69737281 T DE 69737281T DE 69737281 D1 DE69737281 D1 DE 69737281D1
Authority
DE
Germany
Prior art keywords
solder paste
printing solder
printing
paste
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69737281T
Other languages
English (en)
Other versions
DE69737281T2 (de
Inventor
Hiroaki Onishi
Shoji Sato
Takao Naito
Takaaki Higashida
Akira Kabeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69737281D1 publication Critical patent/DE69737281D1/de
Publication of DE69737281T2 publication Critical patent/DE69737281T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
DE69737281T 1996-12-10 1997-12-09 Vorrichtung und Verfahren zum Drucken von Lötpaste Expired - Fee Related DE69737281T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP32975896 1996-12-10
JP32975896 1996-12-10
JP13477897 1997-05-26
JP13477897 1997-05-26

Publications (2)

Publication Number Publication Date
DE69737281D1 true DE69737281D1 (de) 2007-03-15
DE69737281T2 DE69737281T2 (de) 2007-12-20

Family

ID=26468788

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69737281T Expired - Fee Related DE69737281T2 (de) 1996-12-10 1997-12-09 Vorrichtung und Verfahren zum Drucken von Lötpaste

Country Status (4)

Country Link
US (2) US6395335B2 (de)
EP (1) EP0848586B1 (de)
DE (1) DE69737281T2 (de)
SG (1) SG63785A1 (de)

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US6609652B2 (en) * 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US6491204B1 (en) * 1999-11-30 2002-12-10 Gunter Erdmann Stencil wiping device
EP1331094A1 (de) * 2000-11-02 2003-07-30 The Furukawa Electric Co., Ltd. Druckrakel und sruckvorrichtung für weichlotpaste
US6638363B2 (en) * 2000-11-22 2003-10-28 Gunter Erdmann Method of cleaning solder paste
JP3721982B2 (ja) * 2000-12-04 2005-11-30 松下電器産業株式会社 回路形成基板の製造方法および回路形成基板の製造装置
JP2002362003A (ja) * 2001-06-01 2002-12-18 Nec Corp はんだペースト印刷方法およびはんだペースト印刷装置
JP3685097B2 (ja) * 2001-07-12 2005-08-17 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP4118659B2 (ja) * 2001-12-03 2008-07-16 東京応化工業株式会社 基板用トレイ
US20040049874A1 (en) * 2002-09-13 2004-03-18 Velasquez Eric P. Screen printing squeegee for applying solder paste
US7964237B2 (en) * 2003-08-21 2011-06-21 International Business Machines Corporation Fully automated paste dispense process for dispensing small dots and lines
JP3972902B2 (ja) * 2003-12-26 2007-09-05 松下電器産業株式会社 回路基板の製造方法および製造装置
US7614341B1 (en) * 2004-03-12 2009-11-10 General Dynamics Advanced Information Systems, Inc. Apparatus and method for a segmented squeegee for stenciling
US7291226B2 (en) * 2004-09-30 2007-11-06 Lexmark International, Inc. Progressive stencil printing
FR2881077B1 (fr) 2005-01-27 2007-06-29 Novatec Sa Sa Soc Dispositif de transfert par serigraphie
US20090095176A1 (en) * 2007-10-11 2009-04-16 Printar Ltd. Method and apparatus for PCB finishing processes
JP2009154304A (ja) * 2007-12-25 2009-07-16 Fujitsu Ltd スクリーン印刷装置及びスクリーン印刷方法
JP4643719B2 (ja) * 2009-02-09 2011-03-02 ヤマハ発動機株式会社 はんだ供給装置、印刷装置および印刷方法
CN103157578B (zh) * 2011-12-12 2016-04-20 赛恩倍吉科技顾问（深圳）有限公司 涂抹装置
KR101940237B1 (ko) * 2012-06-14 2019-01-18 한국전자통신연구원 미세 피치 ｐｃｂ 기판에 솔더 범프 형성 방법 및 이를 이용한 반도체 소자의 플립 칩 본딩 방법
JP2014011231A (ja) * 2012-06-28 2014-01-20 Hitachi Ltd ハンダボール印刷搭載装置
JP5129898B1 (ja) * 2012-08-02 2013-01-30 株式会社谷黒組 電極溶食防止層を有する部品及びその製造方法
IN2013MU01209A (de) * 2013-03-28 2015-04-10 Tata Consultancy Services Ltd
JP6123076B2 (ja) 2013-11-12 2017-05-10 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及び電子部品実装システム
JP2015093465A (ja) * 2013-11-14 2015-05-18 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及び電子部品実装システム並びにスクリーン印刷方法
CN105172346B (zh) * 2015-08-14 2018-02-06 浙江艾能聚光伏科技股份有限公司 一种印刷刮刀
CN114701244A (zh) * 2017-04-28 2022-07-05 应用材料意大利有限公司 用于丝网印刷基板的设备和方法、和太阳能电池生产设备
WO2018197007A1 (en) * 2017-04-28 2018-11-01 Applied Materials Italia S.R.L. Apparatus for use in the manufacture of a solar cell, system for deposition of a material on a substrate used in the manufacture of a solar cell, and method for processing of a deposition material used in the manufacture of a solar cell
CN109196664B (zh) * 2017-04-28 2022-10-28 应用材料意大利有限公司 用于将材料丝网印刷于用于太阳能电池制造中的基板上的设备及方法
DE102018124754B4 (de) * 2018-10-08 2022-03-24 Koenig & Bauer Ag Siebdruckvorrichtung mit einer Siebdruckschablone und mit mindestens zwei am Druckprozess beteiligten Rakelsystemen
CN110978756A (zh) * 2019-12-29 2020-04-10 苏州辰锦智能科技有限公司 一种双刮刀式丝网印刷组件以及丝网印刷机
GB2610652A (en) * 2021-09-14 2023-03-15 Asmpt Smt Singapore Pte Ltd Angled printing
CN114938580B (zh) * 2022-05-26 2023-09-08 深圳市实益达工业有限公司 一种smt贴片生产用的锡膏印刷工装

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0071014A1 (de) * 1981-07-02 1983-02-09 Fritz Buser Ag Maschinenfabrik Verfahren und Farbübertragungselement zum Uebertragen von Druckfarbe auf ein Substrat im Siebdruck
JPS5890981A (ja) * 1981-11-27 1983-05-30 Dantani Plywood Co Ltd スクリ−ン印刷法
US4893556A (en) * 1987-02-23 1990-01-16 Tdk Corporation Screen printer with double doctor/squeegee, printing pressure sensor and aligning mechanism
US4937097A (en) * 1987-11-19 1990-06-26 Toshin Kogyo Co., Ltd. Apparatus for and method of screen printing on boards
US5047262A (en) * 1987-12-11 1991-09-10 Automate-Tech Apparatus and method for selectively coating printed circuit panels
JPH01171944A (ja) 1987-12-28 1989-07-06 Kyocera Corp スクリーン印刷機
US5232651A (en) * 1989-12-11 1993-08-03 Japan Rec Co., Ltd. Method of sealing electric parts mounted on electric wiring board with resin composition
JPH03233994A (ja) * 1990-02-08 1991-10-17 Matsushita Electric Ind Co Ltd 表面実装部品の実装方法
US5044306A (en) * 1990-06-11 1991-09-03 Gunter Erdmann Solder applying mechanism
JPH04185340A (ja) * 1990-11-16 1992-07-02 Matsushita Electric Ind Co Ltd 印刷剤切れを防止する印刷機
US5309837A (en) * 1991-06-24 1994-05-10 Tani Denkikogyo Co., Ltd. Method for screen printing of paste
JPH05175646A (ja) * 1991-12-24 1993-07-13 Matsushita Electric Ind Co Ltd クリーム半田供給方法
JPH05337425A (ja) * 1992-06-04 1993-12-21 Ibiden Co Ltd 高粘度ペーストの充填方法及び充填装置
JPH06155708A (ja) 1992-11-19 1994-06-03 Fujitsu Ltd プリント基板の導体パターン印刷装置
JP3282869B2 (ja) * 1993-02-15 2002-05-20 松下電器産業株式会社 導体印刷方法及び導体印刷機
TW288254B (de) * 1993-05-19 1996-10-11 Tani Denki Kogyo Kk
US5553540A (en) * 1993-05-19 1996-09-10 Tani Denkikogyo Co., Ltd. Method for screen printing of viscous materials
JPH07164614A (ja) * 1993-12-16 1995-06-27 Matsushita Electric Ind Co Ltd スクリーン印刷装置
US5478700A (en) * 1993-12-21 1995-12-26 International Business Machines Corporation Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head
JPH07205396A (ja) * 1994-01-20 1995-08-08 Matsushita Electric Ind Co Ltd スクリーン印刷機およびスクリーン印刷方法
JP3344829B2 (ja) * 1994-07-19 2002-11-18 松下電器産業株式会社 印刷装置
US5483884A (en) * 1994-10-31 1996-01-16 At&T Corp. Method and apparatus for setting up a stencil printer
JPH08132588A (ja) * 1994-11-10 1996-05-28 Fujitsu Ten Ltd スキージ
JP3507166B2 (ja) * 1995-01-23 2004-03-15 松下電器産業株式会社 クリームはんだ供給方法及びクリームはんだ供給用スキージ
US5553538A (en) * 1995-01-30 1996-09-10 Motorola, Inc. Method and apparatus for stencil printing printed circuit boards
US5871807A (en) * 1995-08-14 1999-02-16 Micron Display Technology, Inc. Multiple level printing in a single pass
US5868302A (en) * 1995-09-06 1999-02-09 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic component
US5746127A (en) * 1996-05-03 1998-05-05 Amtx, Inc. Electroformed squeegee blade for surface mount screen printing

Also Published As

Publication number Publication date
SG63785A1 (en) 1999-03-30
DE69737281T2 (de) 2007-12-20
US20010038882A1 (en) 2001-11-08
US6395335B2 (en) 2002-05-28
US20020108513A1 (en) 2002-08-15
EP0848586A1 (de) 1998-06-17
US6814804B2 (en) 2004-11-09
EP0848586B1 (de) 2007-01-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee