DE69732157D1 - Transportroboter mit Tropfwasserschutz - Google Patents

Transportroboter mit Tropfwasserschutz

Info

Publication number
DE69732157D1
DE69732157D1 DE69732157T DE69732157T DE69732157D1 DE 69732157 D1 DE69732157 D1 DE 69732157D1 DE 69732157 T DE69732157 T DE 69732157T DE 69732157 T DE69732157 T DE 69732157T DE 69732157 D1 DE69732157 D1 DE 69732157D1
Authority
DE
Germany
Prior art keywords
transport robot
water protection
drip water
drip
protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69732157T
Other languages
English (en)
Other versions
DE69732157T2 (de
Inventor
Tetsuji Togawa
Kuniaki Yamaguchi
Kunihiko Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6926096A external-priority patent/JP3616832B2/ja
Priority claimed from JP2435797A external-priority patent/JPH10177999A/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69732157D1 publication Critical patent/DE69732157D1/de
Publication of DE69732157T2 publication Critical patent/DE69732157T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/914—Supporting, positioning, or feeding work

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69732157T 1996-02-28 1997-02-28 Transportroboter mit Tropfwasserschutz Expired - Lifetime DE69732157T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP6926096 1996-02-28
JP6926096A JP3616832B2 (ja) 1996-02-28 1996-02-28 ワーク搬送ロボットの防水機構
JP29454396 1996-10-15
JP29454396 1996-10-15
JP2435797 1997-01-22
JP2435797A JPH10177999A (ja) 1996-10-15 1997-01-22 基板搬送用ハンド及びポリッシング装置

Publications (2)

Publication Number Publication Date
DE69732157D1 true DE69732157D1 (de) 2005-02-10
DE69732157T2 DE69732157T2 (de) 2005-12-29

Family

ID=27284619

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69732157T Expired - Lifetime DE69732157T2 (de) 1996-02-28 1997-02-28 Transportroboter mit Tropfwasserschutz

Country Status (3)

Country Link
US (2) US5893794A (de)
EP (2) EP1498934A3 (de)
DE (1) DE69732157T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6221171B1 (en) 1996-06-04 2001-04-24 Ebara Corporation Method and apparatus for conveying a workpiece
JP3679871B2 (ja) * 1996-09-04 2005-08-03 株式会社荏原製作所 ポリッシング装置及び搬送ロボット
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
JPH11204615A (ja) * 1998-01-19 1999-07-30 Speedfam Co Ltd ローディングロボットのウェーハローディング、アンローディング機構
JP4156039B2 (ja) * 1998-03-09 2008-09-24 株式会社荏原製作所 ポリッシング装置
SG97860A1 (en) * 1999-03-05 2003-08-20 Ebara Corp Polishing apparatus
US6358128B1 (en) 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US6244931B1 (en) * 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
TW394125U (en) * 1999-04-13 2000-06-11 Uconn Technology Inc Fiberglass grinder
US6406359B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Apparatus for transferring semiconductor substrates using an input module
US6361422B1 (en) * 1999-06-15 2002-03-26 Applied Materials, Inc. Method and apparatus for transferring semiconductor substrates using an input module
US6156124A (en) * 1999-06-18 2000-12-05 Applied Materials, Inc. Wafer transfer station for a chemical mechanical polisher
JP4230642B2 (ja) 1999-07-08 2009-02-25 株式会社荏原製作所 基板搬送治具及び基板搬送装置
TW513337B (en) * 1999-12-09 2002-12-11 Applied Materials Inc Chemical mechanical planarization system
WO2001064391A2 (en) * 2000-02-29 2001-09-07 Applied Materials, Inc. Planarization system with a wafer transfer corridor and multiple polishing modules
JP2002110647A (ja) * 2000-09-29 2002-04-12 Hitachi Ltd 半導体集積回路装置の製造方法
JP4025096B2 (ja) * 2002-03-08 2007-12-19 株式会社荏原製作所 基板処理方法
US7314808B2 (en) * 2004-12-23 2008-01-01 Applied Materials, Inc. Method for sequencing substrates
SG146547A1 (en) 2007-03-09 2008-10-30 Applied Materials Inc High temperature anti-droop end effector for substrate transfer
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
US9530676B2 (en) 2011-06-01 2016-12-27 Ebara Corporation Substrate processing apparatus, substrate transfer method and substrate transfer device
JP6239893B2 (ja) * 2013-08-07 2017-11-29 株式会社荏原製作所 ウェット処理装置及びこれを備えた基板処理装置
US9827677B1 (en) * 2016-05-16 2017-11-28 X Development Llc Robotic device with coordinated sweeping tool and shovel tool
US9827678B1 (en) * 2016-05-16 2017-11-28 X Development Llc Kinematic design for robotic arm
JP6224780B2 (ja) * 2016-07-22 2017-11-01 東京エレクトロン株式会社 基板処理システム
US10403539B2 (en) * 2017-08-04 2019-09-03 Kawasaki Jukogyo Kabushiki Kaisha Robot diagnosing method
CN109333335A (zh) * 2018-11-28 2019-02-15 长江存储科技有限责任公司 移动手臂、化学机械研磨修整器和研磨设备
US11633848B2 (en) 2019-07-31 2023-04-25 X Development Llc Independent pan of coaxial robotic arm and perception housing

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841028A (en) * 1972-08-24 1974-10-15 Crane Packing Co Apparatus for handling workpieces to be polished
DE2451549A1 (de) * 1974-10-30 1976-08-12 Mueller Georg Kugellager Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien
JPS63123688A (ja) * 1986-11-13 1988-05-27 フアナツク株式会社 産業用ロボツトの旋回軸防水装置
US5095661A (en) * 1988-06-20 1992-03-17 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
US4850382A (en) * 1988-09-14 1989-07-25 Barnes Drill Co. Work booth for a robot
JPH0352248A (ja) * 1989-07-20 1991-03-06 Tokyo Electron Ltd 搬送アーム
JPH0463643A (ja) * 1990-06-30 1992-02-28 Mazda Motor Corp 自動車の蓋部材自動取付方法
US5174067A (en) * 1990-10-19 1992-12-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
US5240546A (en) * 1991-04-26 1993-08-31 Sumitomo Electric Industries, Ltd. Apparatus for peeling semiconductor substrate
US5445486A (en) * 1992-03-29 1995-08-29 Tokyo Electron Sagami Limited Substrate transferring apparatus
JP3172778B2 (ja) * 1992-06-17 2001-06-04 明治機械株式会社 半導体ウエハの全自動ポリッシング装置
JPH06236913A (ja) * 1993-02-09 1994-08-23 Toshiba Corp ウェハーフォーク
JPH0722502A (ja) * 1993-06-30 1995-01-24 Hitachi Ltd 半導体ウエハのハンドリング装置
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
KR100390293B1 (ko) * 1993-09-21 2003-09-02 가부시끼가이샤 도시바 폴리싱장치
US5643366A (en) * 1994-01-31 1997-07-01 Applied Materials, Inc. Wafer handling within a vacuum chamber using vacuum
JPH0855814A (ja) * 1994-08-09 1996-02-27 Nissin High Voltage Co Ltd イオン注入装置用エンドステーション
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
JPH08252765A (ja) * 1995-03-16 1996-10-01 Fujitsu Ltd 研磨装置、研磨布搬送装置、研磨布貼付装置、及び研磨布
US5653624A (en) * 1995-09-13 1997-08-05 Ebara Corporation Polishing apparatus with swinging structures
US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system

Also Published As

Publication number Publication date
EP0793261B1 (de) 2005-01-05
DE69732157T2 (de) 2005-12-29
EP0793261A3 (de) 2002-07-31
EP0793261A2 (de) 1997-09-03
US5893794A (en) 1999-04-13
EP1498934A3 (de) 2005-12-21
EP1498934A2 (de) 2005-01-19
US5961380A (en) 1999-10-05

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Legal Events

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