DE69731740D1 - Elektrisches heizelement und mit diesem versehehe spannnvorrichtung - Google Patents
Elektrisches heizelement und mit diesem versehehe spannnvorrichtungInfo
- Publication number
- DE69731740D1 DE69731740D1 DE69731740T DE69731740T DE69731740D1 DE 69731740 D1 DE69731740 D1 DE 69731740D1 DE 69731740 T DE69731740 T DE 69731740T DE 69731740 T DE69731740 T DE 69731740T DE 69731740 D1 DE69731740 D1 DE 69731740D1
- Authority
- DE
- Germany
- Prior art keywords
- tensioner
- provider
- heating element
- electric heating
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/148—Silicon, e.g. silicon carbide, magnesium silicide, heating transistors or diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14640896 | 1996-05-05 | ||
JP14640896 | 1996-05-05 | ||
JP15282396 | 1996-05-09 | ||
JP15282396 | 1996-05-09 | ||
JP16357796 | 1996-05-20 | ||
JP16357796 | 1996-05-20 | ||
JP20408896 | 1996-06-29 | ||
JP20408896 | 1996-06-29 | ||
JP27983296 | 1996-09-12 | ||
JP27983296 | 1996-09-12 | ||
JP9433097 | 1997-03-08 | ||
JP9433097A JPH10256359A (ja) | 1997-03-08 | 1997-03-08 | 静電チャック |
PCT/JP1997/001529 WO1997042792A1 (fr) | 1996-05-05 | 1997-05-06 | Element chauffant electrique et mandrin electrostatique pourvu d'un tel element |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69731740D1 true DE69731740D1 (de) | 2004-12-30 |
DE69731740T2 DE69731740T2 (de) | 2005-12-15 |
Family
ID=27551927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69731740T Expired - Fee Related DE69731740T2 (de) | 1996-05-05 | 1997-05-06 | Elektrisches heizelement und mit diesem versehehe spannnvorrichtung |
Country Status (5)
Country | Link |
---|---|
US (2) | US6448538B1 (de) |
EP (1) | EP0899986B1 (de) |
KR (1) | KR100280634B1 (de) |
DE (1) | DE69731740T2 (de) |
WO (1) | WO1997042792A1 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE301916T1 (de) * | 1999-11-19 | 2005-08-15 | Ibiden Co Ltd | Keramisches heizgerät |
JP2002057207A (ja) * | 2000-01-20 | 2002-02-22 | Sumitomo Electric Ind Ltd | 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置 |
US7081602B1 (en) * | 2000-02-01 | 2006-07-25 | Trebor International, Inc. | Fail-safe, resistive-film, immersion heater |
WO2001059833A1 (fr) * | 2000-02-08 | 2001-08-16 | Ibiden Co., Ltd. | Carte en ceramique destinee a la production de semi-conducteurs et a des dispositifs de controle |
JP2001244320A (ja) * | 2000-02-25 | 2001-09-07 | Ibiden Co Ltd | セラミック基板およびその製造方法 |
DE10025588A1 (de) * | 2000-05-24 | 2001-11-29 | Mold Masters Ltd | Einrichtung zur Verarbeitung von geschmolzenem Material, Verfahren und Vorrichtung zur Herstellung derselben |
US6756568B1 (en) * | 2000-06-02 | 2004-06-29 | Ibiden Co., Ltd. | Hot plate unit |
US20030000938A1 (en) * | 2000-12-01 | 2003-01-02 | Yanling Zhou | Ceramic heater, and ceramic heater resistor paste |
DE10112234C1 (de) * | 2001-03-06 | 2002-07-25 | Schott Glas | Keramik-Kochfeld |
US20050211385A1 (en) * | 2001-04-30 | 2005-09-29 | Lam Research Corporation, A Delaware Corporation | Method and apparatus for controlling spatial temperature distribution |
JP3856293B2 (ja) * | 2001-10-17 | 2006-12-13 | 日本碍子株式会社 | 加熱装置 |
DE10162276C5 (de) * | 2001-12-19 | 2019-03-14 | Watlow Electric Manufacturing Co. | Rohrförmiger Durchlauferhitzer und Heizplatte sowie Verfahren zu deren Herstellung |
US7067775B2 (en) * | 2002-03-20 | 2006-06-27 | Micropyretics Heaters International, Inc. | Treatment for improving the stability of silicon carbide heating elements |
US6960741B2 (en) * | 2002-08-26 | 2005-11-01 | Lexmark International, Inc. | Large area alumina ceramic heater |
JP4026759B2 (ja) * | 2002-11-18 | 2007-12-26 | 日本碍子株式会社 | 加熱装置 |
US7372001B2 (en) * | 2002-12-17 | 2008-05-13 | Nhk Spring Co., Ltd. | Ceramics heater |
JP3829935B2 (ja) * | 2002-12-27 | 2006-10-04 | 信越化学工業株式会社 | 高耐電圧性部材 |
KR20050115940A (ko) * | 2003-04-18 | 2005-12-08 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 제조 장치 및 반도체 장치의 제조 방법 |
US20040222210A1 (en) * | 2003-05-08 | 2004-11-11 | Hongy Lin | Multi-zone ceramic heating system and method of manufacture thereof |
KR20050031785A (ko) * | 2003-09-30 | 2005-04-06 | 삼성전자주식회사 | 전기조리기 |
WO2005051042A1 (en) * | 2003-11-20 | 2005-06-02 | Koninklijke Philips Electronics N.V. | Thin- film heating element |
US7196295B2 (en) * | 2003-11-21 | 2007-03-27 | Watlow Electric Manufacturing Company | Two-wire layered heater system |
US7164104B2 (en) * | 2004-06-14 | 2007-01-16 | Watlow Electric Manufacturing Company | In-line heater for use in semiconductor wet chemical processing and method of manufacturing the same |
US20060076343A1 (en) * | 2004-10-13 | 2006-04-13 | Cheng-Ping Lin | Film heating element having automatic temperature control function |
US7875832B2 (en) * | 2004-12-20 | 2011-01-25 | Ngk Spark Plug Co., Ltd. | Ceramic heater, heat exchange unit, and warm water washing toilet seat |
CN2933108Y (zh) * | 2005-11-25 | 2007-08-15 | 壁基国际有限公司 | 电热卷发器 |
CN100521835C (zh) * | 2005-12-29 | 2009-07-29 | 梁敏玲 | 电阻膜加热装置的制造方法及所形成的电阻膜加热装置 |
US8226769B2 (en) * | 2006-04-27 | 2012-07-24 | Applied Materials, Inc. | Substrate support with electrostatic chuck having dual temperature zones |
US20080142755A1 (en) * | 2006-12-13 | 2008-06-19 | General Electric Company | Heater apparatus and associated method |
US20080295795A1 (en) * | 2007-05-29 | 2008-12-04 | Ted Hollinger | Laminated Internal Combustion Engine and Fabrication Technique |
DE102008032509A1 (de) * | 2008-07-10 | 2010-01-14 | Epcos Ag | Heizungsvorrichtung und Verfahren zur Herstellung der Heizungsvorrichtung |
KR100995250B1 (ko) * | 2008-09-09 | 2010-11-18 | 주식회사 코미코 | 열 응력 감소를 위한 버퍼층을 포함하는 정전 척 |
JP5416570B2 (ja) * | 2009-12-15 | 2014-02-12 | 住友電気工業株式会社 | 加熱冷却デバイスおよびそれを搭載した装置 |
US8395093B1 (en) * | 2010-04-06 | 2013-03-12 | Cornerstone Research Group, Inc. | Conductive elastomeric heater with expandable core |
US9224626B2 (en) * | 2012-07-03 | 2015-12-29 | Watlow Electric Manufacturing Company | Composite substrate for layered heaters |
US9673077B2 (en) | 2012-07-03 | 2017-06-06 | Watlow Electric Manufacturing Company | Pedestal construction with low coefficient of thermal expansion top |
CN102946652A (zh) * | 2012-10-31 | 2013-02-27 | 宁波市万泓电器科技有限公司 | 带发热膜的加热管及其制造工艺 |
US10966287B2 (en) * | 2013-04-09 | 2021-03-30 | Novair, Inc. | High-temperature nanocomposite emitting film, method for fabricating the same and its application |
US20140356985A1 (en) | 2013-06-03 | 2014-12-04 | Lam Research Corporation | Temperature controlled substrate support assembly |
DE102013014030B4 (de) | 2013-08-26 | 2023-06-29 | QSIL Ingenieurkeramik GmbH | Keramisches Heizelement und Umformwerkzeug sowie Verfahren zur Herstellung eines keramischen Heizelements |
JP6219229B2 (ja) * | 2014-05-19 | 2017-10-25 | 東京エレクトロン株式会社 | ヒータ給電機構 |
BR112017004306B1 (pt) * | 2014-09-18 | 2020-12-15 | Oerlikon Metco (Us) Inc. | Composição pulverizada adaptada para uso em processos de revestimento deespargimento térmico de suspensão |
US11457513B2 (en) * | 2017-04-13 | 2022-09-27 | Bradford White Corporation | Ceramic heating element |
EP3447304A1 (de) * | 2017-08-25 | 2019-02-27 | Sanhua AWECO Appliance Systems GmbH | Dünnschichtiges heizelement für eine flüssigkeitspumpe |
US20200305238A1 (en) * | 2017-09-28 | 2020-09-24 | Kyocera Corporation | Structure |
CN108411296A (zh) * | 2018-02-13 | 2018-08-17 | 上海楚越机械设备有限公司 | 一种电阻加热元件的制备方法 |
CN108934090A (zh) * | 2018-07-06 | 2018-12-04 | 三责(上海)新材料科技有限公司 | 一种高功率节能电热管元件及其制造方法 |
US11945755B2 (en) * | 2018-11-30 | 2024-04-02 | Kyocera Corporation | Ceramic structure and structure with terminal |
WO2020163434A1 (en) * | 2019-02-08 | 2020-08-13 | Lexmark International, Inc. | Aluminum nitride heater and methods of making same |
US20210231345A1 (en) * | 2020-01-27 | 2021-07-29 | Lexmark International, Inc. | Thin-walled tube heater for fluid |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1021691A (en) * | 1961-10-19 | 1966-03-09 | Kanthal Ab | Improvements in heat-resistant and oxidation-proof materials containing molybdenum disilicide |
US4071880A (en) * | 1974-06-10 | 1978-01-31 | N L Industries, Inc. | Ceramic bodies with end termination electrodes |
JPS55126989A (en) * | 1979-03-24 | 1980-10-01 | Kyoto Ceramic | Ceramic heater |
JPS5767297A (en) * | 1980-10-15 | 1982-04-23 | Kyoto Ceramic | Ceramic heater |
US4486651A (en) * | 1982-01-27 | 1984-12-04 | Nippon Soken, Inc. | Ceramic heater |
JPS599887A (ja) * | 1982-07-07 | 1984-01-19 | 日本特殊陶業株式会社 | セラミツク発熱体 |
US4714570A (en) * | 1984-07-17 | 1987-12-22 | Matsushita Electric Industrial Co., Ltd. | Conductor paste and method of manufacturing a multilayered ceramic body using the paste |
JPS62264588A (ja) * | 1986-05-12 | 1987-11-17 | 株式会社東芝 | 赤外線ヒ−タ |
US4882203A (en) * | 1988-11-04 | 1989-11-21 | Cvd Systems & Services | Heating element |
DE3843863A1 (de) | 1988-12-24 | 1990-06-28 | Bosch Gmbh Robert | Hochtemperatur-heizelement, verfahren zu seiner herstellung und verwendung desselben |
US5151871A (en) * | 1989-06-16 | 1992-09-29 | Tokyo Electron Limited | Method for heat-processing semiconductor device and apparatus for the same |
EP0493089B1 (de) * | 1990-12-25 | 1998-09-16 | Ngk Insulators, Ltd. | Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben |
JP2804393B2 (ja) * | 1991-07-31 | 1998-09-24 | 京セラ株式会社 | セラミックヒータ |
KR100290748B1 (ko) * | 1993-01-29 | 2001-06-01 | 히가시 데쓰로 | 플라즈마 처리장치 |
JP2828575B2 (ja) * | 1993-11-12 | 1998-11-25 | 京セラ株式会社 | 窒化珪素質セラミックヒータ |
JP2813148B2 (ja) * | 1994-03-02 | 1998-10-22 | 日本碍子株式会社 | セラミックス製品 |
JPH0870036A (ja) * | 1994-08-29 | 1996-03-12 | Souzou Kagaku:Kk | 静電チャック |
TW444922U (en) * | 1994-09-29 | 2001-07-01 | Tokyo Electron Ltd | Heating device and the processing device using the same |
JP3138393B2 (ja) * | 1994-09-30 | 2001-02-26 | シャープ株式会社 | 薄膜導電層の形成方法 |
JPH09213781A (ja) * | 1996-02-01 | 1997-08-15 | Tokyo Electron Ltd | 載置台構造及びそれを用いた処理装置 |
US5787578A (en) * | 1996-07-09 | 1998-08-04 | International Business Machines Corporation | Method of selectively depositing a metallic layer on a ceramic substrate |
-
1997
- 1997-05-06 EP EP97918374A patent/EP0899986B1/de not_active Expired - Lifetime
- 1997-05-06 DE DE69731740T patent/DE69731740T2/de not_active Expired - Fee Related
- 1997-05-06 WO PCT/JP1997/001529 patent/WO1997042792A1/ja active IP Right Grant
- 1997-05-06 KR KR1019980708902A patent/KR100280634B1/ko not_active IP Right Cessation
- 1997-05-06 US US09/180,348 patent/US6448538B1/en not_active Expired - Fee Related
-
2001
- 2001-07-26 US US09/915,647 patent/US6486447B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6486447B2 (en) | 2002-11-26 |
KR100280634B1 (ko) | 2001-02-01 |
WO1997042792A1 (fr) | 1997-11-13 |
KR20000010776A (ko) | 2000-02-25 |
EP0899986B1 (de) | 2004-11-24 |
EP0899986A4 (de) | 2000-04-12 |
US20020027130A1 (en) | 2002-03-07 |
US6448538B1 (en) | 2002-09-10 |
EP0899986A1 (de) | 1999-03-03 |
DE69731740T2 (de) | 2005-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |