DE69730822D1 - Verfahren zur herstellung eines thermionischen elements - Google Patents

Verfahren zur herstellung eines thermionischen elements

Info

Publication number
DE69730822D1
DE69730822D1 DE69730822T DE69730822T DE69730822D1 DE 69730822 D1 DE69730822 D1 DE 69730822D1 DE 69730822 T DE69730822 T DE 69730822T DE 69730822 T DE69730822 T DE 69730822T DE 69730822 D1 DE69730822 D1 DE 69730822D1
Authority
DE
Germany
Prior art keywords
producing
thermionic element
thermionic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69730822T
Other languages
English (en)
Other versions
DE69730822T2 (de
Inventor
Hisato Hiraishi
Shigeru Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Application granted granted Critical
Publication of DE69730822D1 publication Critical patent/DE69730822D1/de
Publication of DE69730822T2 publication Critical patent/DE69730822T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
DE69730822T 1996-11-15 1997-11-12 Verfahren zur herstellung eines thermionischen elements Expired - Lifetime DE69730822T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP30484696 1996-11-15
JP30484696 1996-11-15
PCT/JP1997/004115 WO1998022984A1 (fr) 1996-11-15 1997-11-12 Procede de fabrication d'un element thermoionique

Publications (2)

Publication Number Publication Date
DE69730822D1 true DE69730822D1 (de) 2004-10-28
DE69730822T2 DE69730822T2 (de) 2005-09-29

Family

ID=17937982

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69730822T Expired - Lifetime DE69730822T2 (de) 1996-11-15 1997-11-12 Verfahren zur herstellung eines thermionischen elements

Country Status (9)

Country Link
US (3) US6232542B1 (de)
EP (1) EP0887869B9 (de)
JP (1) JP3225049B2 (de)
KR (1) KR100300919B1 (de)
CN (1) CN1163978C (de)
AU (1) AU4964397A (de)
DE (1) DE69730822T2 (de)
RU (1) RU2151451C1 (de)
WO (1) WO1998022984A1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001023637A1 (fr) * 1999-09-27 2001-04-05 Citizen Watch Co., Ltd. Procede de depot autocatalytique
US20040251539A1 (en) * 2001-09-12 2004-12-16 Faris Sadeg M. Thermoelectric cooler array
EP1331674A1 (de) * 2002-01-24 2003-07-30 PX Tech S.A. Thermoelektrischer Minikonverter mit hoher Integration
US20040244383A1 (en) * 2002-07-31 2004-12-09 Richard Strnad High efficiency cooling device
JP2004221504A (ja) 2003-01-17 2004-08-05 Aisin Seiki Co Ltd 熱電変換装置およびその製造方法
US20050060884A1 (en) * 2003-09-19 2005-03-24 Canon Kabushiki Kaisha Fabrication of nanoscale thermoelectric devices
US6969679B2 (en) * 2003-11-25 2005-11-29 Canon Kabushiki Kaisha Fabrication of nanoscale thermoelectric devices
US8426720B2 (en) * 2004-01-09 2013-04-23 Industrial Technology Research Institute Micro thermoelectric device and manufacturing method thereof
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
US20050150535A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a thin-film thermoelectric device including a phonon-blocking thermal conductor
US20050150536A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150539A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Monolithic thin-film thermoelectric device including complementary thermoelectric materials
US8013235B2 (en) * 2004-06-22 2011-09-06 Universal Entertainment Corporation Thermoelectric device
US20060107989A1 (en) * 2004-11-24 2006-05-25 Marlow Industries, Inc. High watt density thermoelectrics
KR101066576B1 (ko) * 2004-12-23 2011-09-22 재단법인 포항산업과학연구원 레이저를 이용한 열전 반도체의 접합방법
US8541678B2 (en) * 2005-03-14 2013-09-24 Borealis Technical Limited Thermionic/thermotunneling thermo-electrical converter
US7514013B2 (en) * 2005-09-12 2009-04-07 Mark Logan Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same
WO2007103972A2 (en) * 2006-03-08 2007-09-13 Nanocoolers, Inc. High fill-factor vertical thermoelectric device
KR100806916B1 (ko) 2006-11-29 2008-02-22 요업기술원 열전 모듈용 삼중 복합 전극 및 이의 제조 방법
US20080245397A1 (en) * 2007-04-04 2008-10-09 Marlow Industries, Inc. System and Method of Manufacturing Thermoelectric Devices
US7374460B1 (en) 2007-04-17 2008-05-20 Traxxas Lp Electrical connector assembly
US20090090409A1 (en) * 2007-10-05 2009-04-09 Marlow Industries, Inc. System and Method for Assembling a Microthermoelectric Device
US7871847B2 (en) * 2007-10-05 2011-01-18 Marlow Industries, Inc. System and method for high temperature compact thermoelectric generator (TEG) device construction
EP2280432A4 (de) * 2008-05-23 2012-10-24 Murata Manufacturing Co Thermoelektrisches umwandlungsmodul und verfahren zur herstellung des thermoelektrischen umwandlungsmoduls
EP2299505B1 (de) * 2008-07-02 2015-01-21 Murata Manufacturing Co. Ltd. Thermoelektrisches umwandlungsmodul und verfahren zur herstellung des thermoelektrischen umwandlungsmoduls
KR101048876B1 (ko) * 2008-10-16 2011-07-13 한국전기연구원 슬라이스 적층 프레스법에 의한 기능성재료의 제조방법 및 이에 의해 제조된 기능성재료
EP2180534B1 (de) * 2008-10-27 2013-10-16 Corning Incorporated Energieumwandlungsvorrichtungen und Verfahren
CN101447548B (zh) * 2008-12-26 2011-03-30 中国科学院上海硅酸盐研究所 热电器件的制作方法
US8193439B2 (en) * 2009-06-23 2012-06-05 Laird Technologies, Inc. Thermoelectric modules and related methods
JP5641402B2 (ja) * 2010-02-01 2014-12-17 学校法人 龍谷大学 酸化物膜及びその製造方法、並びにターゲット及び酸化物焼結体の製造方法
US9786829B2 (en) * 2010-03-19 2017-10-10 Micropen Technologies Corporation Thermocouple device
FR2963165A1 (fr) * 2010-07-22 2012-01-27 St Microelectronics Crolles 2 Procede de generation d'energie electrique dans un dispositif semi-conducteur, et dispositif correspondant
TWI419386B (zh) * 2010-10-26 2013-12-11 Ind Tech Res Inst 可透光式熱電能量轉換裝置
DE102010043281A1 (de) * 2010-11-03 2012-05-03 Robert Bosch Gmbh Thermoelektrischer Generator mit thermoelektrischem Modul mit mäanderförmiger p-n-Anordnung
US9082928B2 (en) 2010-12-09 2015-07-14 Brian Isaac Ashkenazi Next generation thermoelectric device designs and methods of using same
EP2503610A1 (de) * 2011-03-22 2012-09-26 Technical University of Denmark Struktur, die zur Herstellung eines Thermogenerators, Thermogenerator, der diese Struktur umfasst, und Verfahren zu dessen Herstellung
CN102810626A (zh) * 2011-06-03 2012-12-05 清华大学 一种基于精密机械加工的微型热电器件制作方法
US8779276B2 (en) * 2011-07-14 2014-07-15 Sony Corporation Thermoelectric device
US9444027B2 (en) * 2011-10-04 2016-09-13 Infineon Technologies Ag Thermoelectrical device and method for manufacturing same
FR2989831B1 (fr) * 2012-04-19 2015-04-10 Valeo Systemes Thermiques Dispositif thermo electrique, echangeur de chaleur comprenant un tel dispositif et procede de fabrication
JP5670989B2 (ja) 2012-11-20 2015-02-18 アイシン高丘株式会社 熱電モジュールの製造方法
US20170005249A1 (en) * 2014-03-14 2017-01-05 Gentherm Gmbh Insulator and connector for thermoelectric devices in a thermoelectric assembly
US20160197260A1 (en) * 2015-01-05 2016-07-07 The Boeing Company Thermoelectric generator
US10672968B2 (en) * 2015-07-21 2020-06-02 Analog Devices Global Thermoelectric devices
CN105588067A (zh) * 2016-02-22 2016-05-18 苏州沃尚光电科技有限公司 一种路灯发电装置
JP6676459B2 (ja) * 2016-04-27 2020-04-08 株式会社小松製作所 光学センサ
DE102017125647B4 (de) 2017-11-02 2020-12-24 Infineon Technologies Ag Thermoelektrische Vorrichtungen und Verfahren zum Bilden von thermoelektrischen Vorrichtungen
KR102130594B1 (ko) * 2018-10-10 2020-07-06 주식회사 휴모트 벌크형 열전소자 제조 방법
JP7412702B2 (ja) * 2020-02-06 2024-01-15 三菱マテリアル株式会社 熱流スイッチング素子
FR3114689B1 (fr) * 2020-09-29 2022-10-14 Commissariat Energie Atomique Procédé de fabrication de dispositif thermoélectrique par fabrication additive de peignes à contacter entre eux
WO2023043332A1 (ru) * 2021-09-20 2023-03-23 Сергей Яковлевич СКИПИДАРОВ Термоэлектрический элемент

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE209545C (de)
IT1042975B (it) * 1975-09-30 1980-01-30 Snam Progetti Metodo per la costruzione di un modulo termoelettrico e modulo cosi ottenuto
DD209545B1 (de) * 1982-09-16 1989-05-24 Manfred Teubner Verfahren zur herstellung von thermoelektrischen moduln
JPH0828531B2 (ja) * 1986-07-15 1996-03-21 セイコー電子工業株式会社 電子腕時計用熱電素子の製造方法
US5246504A (en) * 1988-11-15 1993-09-21 Director-General, Agency Of Industrial Science And Technology Thermoelectric material
JPH05335630A (ja) * 1991-11-06 1993-12-17 Tokin Corp 熱電気変換モジュール及びそれを用いた熱電気変換装置
JPH05343747A (ja) * 1992-06-09 1993-12-24 Matsushita Electric Ind Co Ltd 熱電材料及びその製造方法並びにセンサー
JPH0829558A (ja) * 1994-07-20 1996-02-02 Seiko Instr Inc 電子時計
JPH0843555A (ja) 1994-07-29 1996-02-16 Seiko Instr Inc 電子時計
JPH08222770A (ja) * 1995-02-15 1996-08-30 Citizen Watch Co Ltd 熱電素子の製造方法
JPH118416A (ja) * 1997-06-13 1999-01-12 Citizen Watch Co Ltd 熱電発電素子の製造方法

Also Published As

Publication number Publication date
DE69730822T2 (de) 2005-09-29
US20010001961A1 (en) 2001-05-31
US6441295B2 (en) 2002-08-27
RU2151451C1 (ru) 2000-06-20
AU4964397A (en) 1998-06-10
EP0887869B9 (de) 2005-05-18
KR19990077112A (ko) 1999-10-25
US6232542B1 (en) 2001-05-15
CN1208503A (zh) 1999-02-17
WO1998022984A1 (fr) 1998-05-28
US20010001960A1 (en) 2001-05-31
KR100300919B1 (ko) 2001-10-29
EP0887869B1 (de) 2004-09-22
US6441296B2 (en) 2002-08-27
EP0887869A4 (de) 1999-12-15
JP3225049B2 (ja) 2001-11-05
EP0887869A1 (de) 1998-12-30
CN1163978C (zh) 2004-08-25

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Legal Events

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Owner name: CITIZEN HOLDINGS CO., LTD., NISHITOKYO, TOKIO/, JP