DE69715960D1 - Herstellungsverfahren eines Vliesstoffsubstrats für Leiterplattensubstrat und Herstellungsverfahren eines vorimpregnierten Materials - Google Patents

Herstellungsverfahren eines Vliesstoffsubstrats für Leiterplattensubstrat und Herstellungsverfahren eines vorimpregnierten Materials

Info

Publication number
DE69715960D1
DE69715960D1 DE69715960T DE69715960T DE69715960D1 DE 69715960 D1 DE69715960 D1 DE 69715960D1 DE 69715960 T DE69715960 T DE 69715960T DE 69715960 T DE69715960 T DE 69715960T DE 69715960 D1 DE69715960 D1 DE 69715960D1
Authority
DE
Germany
Prior art keywords
manufacturing
substrate
circuit board
impregnated material
board substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69715960T
Other languages
English (en)
Other versions
DE69715960T2 (de
Inventor
Masayuki Sakai
Hideo Hatanaka
Masahide Tsukamoto
Seiichi Nakatani
Masayuki Okano
Tamao Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69715960D1 publication Critical patent/DE69715960D1/de
Publication of DE69715960T2 publication Critical patent/DE69715960T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4326—Condensation or reaction polymers
    • D04H1/4334—Polyamides
    • D04H1/4342—Aromatic polyamides
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
    • D04H1/64—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives the bonding agent being applied in wet state, e.g. chemical agents in dispersions or solutions
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26—Polyamides; Polyimides
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H17/00—Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
    • D21H17/20—Macromolecular organic compounds
    • D21H17/33—Synthetic macromolecular compounds
    • D21H17/46—Synthetic macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H17/52—Epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H05K2203/097—Corona discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/184—Nonwoven scrim
    • Y10T442/198—Coated or impregnated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2041—Two or more non-extruded coatings or impregnations
    • Y10T442/2049—Each major face of the fabric has at least one coating or impregnation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2475—Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2861—Coated or impregnated synthetic organic fiber fabric
    • Y10T442/2893—Coated or impregnated polyamide fiber fabric
    • Y10T442/2902—Aromatic polyamide fiber fabric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/608—Including strand or fiber material which is of specific structural definition
    • Y10T442/614—Strand or fiber material specified as having microdimensions [i.e., microfiber]
    • Y10T442/626—Microfiber is synthetic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Textile Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
DE69715960T 1996-05-15 1997-05-14 Herstellungsverfahren eines Vliesstoffsubstrats für Leiterplattensubstrat und Herstellungsverfahren eines vorimpregnierten Materials Expired - Fee Related DE69715960T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12063096 1996-05-15

Publications (2)

Publication Number Publication Date
DE69715960D1 true DE69715960D1 (de) 2002-11-07
DE69715960T2 DE69715960T2 (de) 2003-01-30

Family

ID=14790988

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69715960T Expired - Fee Related DE69715960T2 (de) 1996-05-15 1997-05-14 Herstellungsverfahren eines Vliesstoffsubstrats für Leiterplattensubstrat und Herstellungsverfahren eines vorimpregnierten Materials

Country Status (4)

Country Link
US (2) US5858884A (de)
EP (1) EP0807703B1 (de)
CN (1) CN1086005C (de)
DE (1) DE69715960T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3631385B2 (ja) 1998-11-18 2005-03-23 王子製紙株式会社 積層板用基材およびその製造方法
JP2000239995A (ja) * 1999-02-19 2000-09-05 Matsushita Electric Ind Co Ltd 絶縁基材とプリプレグおよびそれを用いた回路基板
US6258203B1 (en) 1999-09-21 2001-07-10 Ahlstrom Glassfibre Oy Base webs for printed circuit board production using the foam process and acrylic fibers
EP1277880A1 (de) * 2001-07-21 2003-01-22 Teijin Twaron GmbH Verfahren zur Herstellung von p-Aramid Papier, p-Aramid Papier, p-Aramid Pulpe und die Verwendung des Papiers und der Pulpe
US6987079B2 (en) * 2001-08-14 2006-01-17 W.R. Grace & Co.-Conn. Supported catalyst systems
JP4437464B2 (ja) * 2005-06-01 2010-03-24 株式会社ルネサステクノロジ 半導体装置及びデータ処理システム
CN101357552B (zh) * 2007-07-30 2011-06-15 比亚迪股份有限公司 一种用于光固化涂层表面的印刷方法
CN105002617B (zh) * 2015-06-08 2017-07-07 东台市华阳玻纤有限责任公司 一种用于食品加工机械的密封编织基材的制备方法
WO2017054200A1 (zh) * 2015-09-30 2017-04-06 安徽省大富光电科技有限公司 一种图形导电材料、电子设备
CN109808280B (zh) * 2018-12-27 2021-11-05 浙江华正新材料股份有限公司 一种芳纶布高强度高柔韧性覆铜板的制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3025185A (en) * 1957-08-21 1962-03-13 Du Pont Heat stable coated fabric comprising wholly aromatic polyamide fabric coated with copolymer of vinylidene fluoride and hexafluoropropene
US3391056A (en) * 1964-05-27 1968-07-02 Hercules Inc Resin-coated fibrous sheet material and members prepared therefrom
US3855047A (en) * 1970-07-08 1974-12-17 Minnesota Mining & Mfg Sheet-like nonwoven web and flexible article of polyester and aromatic polyamide staple fibers
US4346140A (en) * 1981-03-30 1982-08-24 E. I. Du Pont De Nemours And Company Composite structure of an aromatic polyamide fabric coated with a fluorosilicone rubber
DE3323007C1 (de) * 1983-06-25 1984-06-28 Deutsche Thomson-Brandt Gmbh, 7730 Villingen-Schwenningen Spurfolgesystem mit einem optischen Abtaster für ein Audio- oder Video-Plattenwiedergabegerät
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
US4632859A (en) * 1984-08-03 1986-12-30 The Kendall Company Reinforced silicone modified epoxy tape backing
US4729921A (en) * 1984-10-19 1988-03-08 E. I. Du Pont De Nemours And Company High density para-aramid papers
US4897301A (en) * 1985-01-23 1990-01-30 Toyo Boseki Kabushiki Kaisha Flexible sheet reinforced with poly(aromatic amide) non-woven fabric and use thereof
US4687681A (en) * 1985-02-13 1987-08-18 Westinghouse Electric Corp. Method of making a chemically bonded coating on a fibrous or filamentous substrate
US5229199A (en) * 1985-08-13 1993-07-20 E. I. Du Pont De Nemours And Company Rigid composite comprising woven aramid fabrics coated with an adhesion modifier and embedded in a matrix resin
US4698267A (en) * 1985-09-17 1987-10-06 E. I. Du Pont De Nemours And Company High density para-aramid papers
JPS62261190A (ja) * 1986-05-08 1987-11-13 帝人株式会社 プリント配線板
JPS62274688A (ja) * 1986-05-22 1987-11-28 帝人株式会社 プリント配線板
JPS62274689A (ja) * 1986-05-22 1987-11-28 帝人株式会社 プリント配線板
JPS62273792A (ja) * 1986-05-22 1987-11-27 帝人株式会社 プリント配線板
JPH01141925A (ja) * 1987-11-30 1989-06-02 Honshu Paper Co Ltd パラ配向アラミド繊維シートを基材とする改良複合材料
GB8813250D0 (en) * 1988-06-04 1988-07-06 Scapa Group Plc Coated textile materials
JPH0395232A (ja) * 1989-09-08 1991-04-19 Honshu Paper Co Ltd パラ配向アラミド繊維状物質を基材とする改良複合材料及びその製造法
JPH07115268A (ja) * 1993-10-20 1995-05-02 Matsushita Electric Ind Co Ltd プリント配線板及びその製造方法
DE69631573T2 (de) * 1995-10-16 2004-12-16 Sumitomo Chemical Co., Ltd. Prepreg, Verfahren zu seiner Herstellung und gedrucktes Leiterplattensubstrat, das dasselbe verwendet
JP3401381B2 (ja) * 1996-02-19 2003-04-28 帝人株式会社 芳香族ポリアミド繊維紙及び該芳香族ポリアミド繊維紙からなるプリプレグ並びに積層板

Also Published As

Publication number Publication date
EP0807703A1 (de) 1997-11-19
EP0807703B1 (de) 2002-10-02
US5858884A (en) 1999-01-12
DE69715960T2 (de) 2003-01-30
CN1086005C (zh) 2002-06-05
US6045897A (en) 2000-04-04
CN1170055A (zh) 1998-01-14

Similar Documents

Publication Publication Date Title
HUP9903821A3 (en) Method and apparatus for manufacturing a web provided with a pattern of added material
DE69716270T2 (de) Klebefilm zum verbinden einer schaltung und einer leiterplatte
DE69718693T2 (de) Elektronisches Bauteil und Herstellungsverfahren
KR960011558A (ko) 레지스트 재료 및 패턴 형성
DE69429848T2 (de) Elektronische Anordnung und Verfahren zur Herstellung
DE69811128T2 (de) Steuerungsgerät und -methode für elektronische Einrichtung und elektronische Einrichtung
DE69840246D1 (de) Elektronisches Bauteil und Herstellungsverfahren
DE69816567D1 (de) Perforierte Schicht für absorbierende Wegwerfartikel und zugehöriges Herstellungsverfahren
HK1002550A1 (en) A liquid permeable surface material for an absorbent article and a method for its manufacture
DE69528224T2 (de) Gerät und Verfahren zum berührungslosen aktiven Spannen von sich bewegendem bandförmigem Material
DE69527334T2 (de) Verfahren zur Herstellung eines leitfähigen Musters und Verfahren zur Herstellung eines dasselbe enthaltenden Grünfolie-Laminierungskörpers
DE69815564T2 (de) Klebefolie zum Einsetzen von Wafern und Herstellungsverfahren von elektronischen Bauteilen
DE69716866T2 (de) Beschichtungsstruktur einer Scheibe zum chemisch-mechanischen Polieren und Verfahren
DE69715960D1 (de) Herstellungsverfahren eines Vliesstoffsubstrats für Leiterplattensubstrat und Herstellungsverfahren eines vorimpregnierten Materials
DE69500584T2 (de) Flexible Leiterplatte und deren Herstellungsverfahren
DE69830982D1 (de) Schaltungsplatte für stromschienen und herstellungsverfahren
DE69613745T2 (de) Magnetisches Mikrowellenmaterial und Bauelement für Hochfrequenzschaltkreis unter Verwendung desselben
DE69710021D1 (de) Verfahren zum Herstellen eines Keramik-Metall-Verbundsubstrat und Hartlotwerkstoff zur Verwendung in diesem Verfahren
DE69708021D1 (de) Baugruppen aus Substraten und elektronischen Bauteilen
DE69529583T2 (de) Formbrett und Herstellungsverfahren für eine Halbleiteranordnung
FI953918A (fi) Menetelmä ja laite liikkuvan materiaalirainan poikkileikkaamiseksi
DE59914875D1 (de) Verfahren und anordnung zur belichtung eines substrates
DE60007572D1 (de) Vliesstoffmaterial, vorimpregniertes Material und ein Leiterplattensubstrat aus diesem Material
DE69831392D1 (de) Herstellungsverfahren von elektronischen Bauteilen und Apparat zur Herstellung von dünnen Schichten
DE69516673T2 (de) Verfahren und gerät zur beschichtung eines substrats

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: STIPPL PATENTANWAELTE, 90482 NUERNBERG

8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee