DE69500584T2 - Flexible Leiterplatte und deren Herstellungsverfahren - Google Patents

Flexible Leiterplatte und deren Herstellungsverfahren

Info

Publication number
DE69500584T2
DE69500584T2 DE69500584T DE69500584T DE69500584T2 DE 69500584 T2 DE69500584 T2 DE 69500584T2 DE 69500584 T DE69500584 T DE 69500584T DE 69500584 T DE69500584 T DE 69500584T DE 69500584 T2 DE69500584 T2 DE 69500584T2
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
manufacturing process
flexible printed
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69500584T
Other languages
English (en)
Other versions
DE69500584D1 (de
Inventor
Miki Kato
Yukinori Tamano
Katsumi Kobayashi
Michiyuki Noba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE69500584D1 publication Critical patent/DE69500584D1/de
Application granted granted Critical
Publication of DE69500584T2 publication Critical patent/DE69500584T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0311Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/051Rolled
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/057Shape retainable
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271Mechanical force other than pressure, e.g. shearing or pulling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
DE69500584T 1994-02-04 1995-02-02 Flexible Leiterplatte und deren Herstellungsverfahren Expired - Lifetime DE69500584T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1239494 1994-02-04
JP6255482A JP2790056B2 (ja) 1994-02-04 1994-10-20 可撓性プリント配線板とその製造方法

Publications (2)

Publication Number Publication Date
DE69500584D1 DE69500584D1 (de) 1997-10-02
DE69500584T2 true DE69500584T2 (de) 1998-01-22

Family

ID=26348005

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69500584T Expired - Lifetime DE69500584T2 (de) 1994-02-04 1995-02-02 Flexible Leiterplatte und deren Herstellungsverfahren

Country Status (4)

Country Link
US (1) US5747743A (de)
EP (1) EP0666704B1 (de)
JP (1) JP2790056B2 (de)
DE (1) DE69500584T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19615499A1 (de) * 1996-04-19 1997-10-23 Vdo Schindling Zeigerinstrument
DE69825092T2 (de) * 1997-03-28 2004-12-09 Xerox Corp. Entwicklungsrolle mit segmentierten Elektroden
US6061245A (en) * 1998-01-22 2000-05-09 International Business Machines Corporation Free standing, three dimensional, multi-chip, carrier package with air flow baffle
DE19810854B4 (de) * 1998-03-13 2007-12-20 Siemens Ag Zeigerinstrument
FR2784260B1 (fr) * 1998-10-01 2000-12-22 Valeo Electronique Contacts sans soudure entre des pistes decoupees et un circuit imprime
AT412681B (de) * 2002-04-22 2005-05-25 Hueck Folien Gmbh Substrate mit unsichtbaren elektrisch leitfähigen schichten
EP1445670A1 (de) * 2003-02-06 2004-08-11 ETA SA Manufacture Horlogère Suisse Spiralfeder der Resonatorunruh und Fabrikationsmethode
FR2882180B1 (fr) * 2005-02-11 2009-05-15 Johnson Controls Tech Co Dispositif d'affichage pivotante portant un organe d'eclairage alimente par un ruban flexible en boucle
EP1818736A1 (de) * 2006-02-09 2007-08-15 The Swatch Group Research and Development Ltd. Stossfeste Spiralrolle
US8436618B2 (en) * 2007-02-19 2013-05-07 Schlumberger Technology Corporation Magnetic field deflector in an induction resistivity tool
US20090230969A1 (en) * 2007-02-19 2009-09-17 Hall David R Downhole Acoustic Receiver with Canceling Element
US8395388B2 (en) * 2007-02-19 2013-03-12 Schlumberger Technology Corporation Circumferentially spaced magnetic field generating devices
US7681517B2 (en) * 2008-02-28 2010-03-23 Visteon Global Technologies, Inc. Actively lit pointer
US8378842B2 (en) 2008-06-19 2013-02-19 Schlumberger Technology Corporation Downhole component with an electrical device in a blind-hole
JP5717961B2 (ja) * 2009-12-24 2015-05-13 日本メクトロン株式会社 フレキシブル回路基板の製造方法
US8400288B2 (en) * 2010-02-09 2013-03-19 Visteon Global Technologies, Inc. Hidden offset pointer over reconfigurable display
JP5284308B2 (ja) * 2010-04-19 2013-09-11 日本メクトロン株式会社 フレキシブル回路基板及びその製造方法
US9060433B2 (en) * 2013-01-04 2015-06-16 International Business Machines Corporation Thermal dissipative retractable flex assembly
TWI622328B (zh) * 2014-03-03 2018-04-21 Stretchable flexible circuit board
US10109939B2 (en) * 2016-03-16 2018-10-23 Rosemount Aerospace Inc. Flex circuit connector configuration
TWI607677B (zh) * 2016-11-21 2017-12-01 同泰電子科技股份有限公司 可撓性線路板結構
WO2019084105A1 (en) * 2017-10-24 2019-05-02 Avery Dennison Retail Information Services, Llc PLANAR-CONDUCTIVE DEVICE FORMING A COIL FOR AN RFID LABEL WHEN FOLDED
JP6887475B2 (ja) * 2019-05-24 2021-06-16 Nissha株式会社 筒状プリント基板およびプリント基板一体成形品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1862429U (de) * 1962-05-17 1962-11-22 Bbc Brown Boveri & Cie Gedruckte oder geaetzte schaltung in gedraengter bauart.
US3300572A (en) * 1963-12-18 1967-01-24 Sanders Associates Inc Extensible and retractable flexible circuit cable
US4376927A (en) * 1978-12-18 1983-03-15 Mcgalliard James D Printed circuit fuse assembly
US4381420A (en) * 1979-12-26 1983-04-26 Western Electric Company, Inc. Multi-conductor flat cable
US4509109A (en) * 1982-09-13 1985-04-02 Hansen Thomas C Electronically controlled coil assembly
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
US4783359A (en) * 1986-11-18 1988-11-08 Rogers Corporation Electronic signal time dealy device and method of making the same
JPS63273390A (ja) * 1987-04-30 1988-11-10 Mitsubishi Electric Corp 基板の組立装置
US4798918A (en) * 1987-09-21 1989-01-17 Intel Corporation High density flexible circuit
US4845311A (en) * 1988-07-21 1989-07-04 Hughes Aircraft Company Flexible coaxial cable apparatus and method
US5211128A (en) * 1990-03-29 1993-05-18 Nippondenso Co., Ltd. Automotive meter device having self-acting light-emitting pointer
WO1992022422A1 (en) * 1991-06-19 1992-12-23 Rogers Corporation Shape retaining flexible electrical circuit
JP2526467B2 (ja) * 1992-08-24 1996-08-21 日本電装株式会社 自発光指針式計器
JPH06231621A (ja) * 1993-02-01 1994-08-19 Murata Mfg Co Ltd フレキシブル配線ケーブル

Also Published As

Publication number Publication date
US5747743A (en) 1998-05-05
EP0666704A1 (de) 1995-08-09
DE69500584D1 (de) 1997-10-02
EP0666704B1 (de) 1997-08-27
JP2790056B2 (ja) 1998-08-27
JPH07263820A (ja) 1995-10-13

Similar Documents

Publication Publication Date Title
DE69500584T2 (de) Flexible Leiterplatte und deren Herstellungsverfahren
DE69935009D1 (de) Gedruckte leiterplatte und deren herstellungsverfahren
DE69812570T2 (de) Gerät mit Leiterplatte und dessen Zusammenbauverfahren
KR970700988A (ko) 다층 프린트 배선판 및 그 제조방법(multilayer printed wiring board and process for producing the same)
DE69636010D1 (de) Gedruckte schaltungsplatte und verfahren zu deren herstellung
DE69730629D1 (de) Leiterplatte und Elektronikkomponente
DE69631236D1 (de) Gedruckte Schaltungsplatten
DE69300615T2 (de) Mehrschichtige Leiterplatte und Herstellungsverfahren.
DE69406581T2 (de) Gedruckte Schaltungsplatten
GB2288075B (en) Circuit boards and their manufacture
DE59511037D1 (de) Mehrlagenleiterplatten und Multichipmodul-Substrate
DE69618070D1 (de) Gedruckte Schaltungskarte und Steckverbinder für eine gedruckte Schaltungskarte
DE69723001D1 (de) Gedruckte Leiterplatte und Verfahren zu deren Herstellung
EP0498043A3 (en) Printed circuit board comprising rigid and flexible parts and process for manufacturing the same
DE9401567U1 (de) Schaltplattenanordnung
KR960009581U (ko) 검사용 인쇄회로 기판
GB9523484D0 (en) Printed circuit boards and their manufacture
GB9522452D0 (en) Printed circuit boards and their manufacture
KR960026283U (ko) 인쇄 회로 기판
KR950028995U (ko) 인쇄회로기판
KR960019548U (ko) 인쇄회로기판 조립구조
KR960012958U (ko) 인쇄회로기판 고정구조
KR960015913U (ko) 인쇄회로기판
DE69842175D1 (de) Gedruckte Leiterplatte und Verfahren zu deren Herstellung
DE9418883U1 (de) Leiterplatte

Legal Events

Date Code Title Description
8364 No opposition during term of opposition