GB9522452D0 - Printed circuit boards and their manufacture - Google Patents
Printed circuit boards and their manufactureInfo
- Publication number
- GB9522452D0 GB9522452D0 GBGB9522452.3A GB9522452A GB9522452D0 GB 9522452 D0 GB9522452 D0 GB 9522452D0 GB 9522452 A GB9522452 A GB 9522452A GB 9522452 D0 GB9522452 D0 GB 9522452D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacture
- printed circuit
- circuit boards
- boards
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9522452A GB2307108A (en) | 1995-11-02 | 1995-11-02 | Formation of conductive vias in printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9522452A GB2307108A (en) | 1995-11-02 | 1995-11-02 | Formation of conductive vias in printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9522452D0 true GB9522452D0 (en) | 1996-01-03 |
GB2307108A GB2307108A (en) | 1997-05-14 |
Family
ID=10783284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9522452A Withdrawn GB2307108A (en) | 1995-11-02 | 1995-11-02 | Formation of conductive vias in printed circuit boards |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2307108A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110933873A (en) * | 2019-11-25 | 2020-03-27 | 江门市鼎峰照明电子科技有限公司 | Manufacturing method of double-sided circuit board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6280641B1 (en) | 1998-06-02 | 2001-08-28 | Mitsubishi Gas Chemical Company, Inc. | Printed wiring board having highly reliably via hole and process for forming via hole |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2881963B2 (en) * | 1990-05-25 | 1999-04-12 | ソニー株式会社 | Wiring board and manufacturing method thereof |
-
1995
- 1995-11-02 GB GB9522452A patent/GB2307108A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110933873A (en) * | 2019-11-25 | 2020-03-27 | 江门市鼎峰照明电子科技有限公司 | Manufacturing method of double-sided circuit board |
Also Published As
Publication number | Publication date |
---|---|
GB2307108A (en) | 1997-05-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB9615001D0 (en) | Printed circuit board | |
SG71838A1 (en) | Printed circuit boards | |
GB2300310B (en) | Printed-wiring board | |
GB9918909D0 (en) | Printed circuit board and method of producing the same | |
EP0798779A4 (en) | Ceramic circuit board | |
SG52992A1 (en) | Multilayer printed circuit board | |
GB9420182D0 (en) | Printed circuit manufacture | |
GB2296829B (en) | Printed circuit board connector | |
SG73972A1 (en) | Circuit board | |
EP0629107A3 (en) | Multiple wiring and X section printed circuit board technique. | |
TW452317U (en) | Printed circuit boards | |
GB2306904B (en) | Circuit boards | |
GB2288075B (en) | Circuit boards and their manufacture | |
GB9721706D0 (en) | Printed circuit boards | |
EP0692927A3 (en) | Improved printed circuit board and method | |
GB2302195B (en) | Electronic circuit | |
SG79881A1 (en) | Printed circuit board | |
EP0715489A3 (en) | Printed circuit board assembly | |
SG65618A1 (en) | Flexible printed circuit and manufacturing method therefor | |
AU5926396A (en) | Rigid-flex printed circuit boards | |
HU9501469D0 (en) | Linking unit for electrical connecting printed circuit board and separate electrical unit | |
GB9508857D0 (en) | Printed circuit board | |
TW426304U (en) | Printed circuit board | |
GB9523484D0 (en) | Printed circuit boards and their manufacture | |
GB9522452D0 (en) | Printed circuit boards and their manufacture |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |