DE69705681T2 - Peltierkühler und Verwendung in einem Halbleiterlasermodul - Google Patents
Peltierkühler und Verwendung in einem HalbleiterlasermodulInfo
- Publication number
- DE69705681T2 DE69705681T2 DE69705681T DE69705681T DE69705681T2 DE 69705681 T2 DE69705681 T2 DE 69705681T2 DE 69705681 T DE69705681 T DE 69705681T DE 69705681 T DE69705681 T DE 69705681T DE 69705681 T2 DE69705681 T2 DE 69705681T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor laser
- laser module
- peltier cooler
- peltier
- cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08213507A JP3076246B2 (ja) | 1996-08-13 | 1996-08-13 | ペルチェクーラ内蔵半導体レーザモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69705681D1 DE69705681D1 (de) | 2001-08-23 |
DE69705681T2 true DE69705681T2 (de) | 2002-05-08 |
Family
ID=16640345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69705681T Expired - Fee Related DE69705681T2 (de) | 1996-08-13 | 1997-08-12 | Peltierkühler und Verwendung in einem Halbleiterlasermodul |
Country Status (4)
Country | Link |
---|---|
US (1) | US5960142A (de) |
EP (1) | EP0824281B1 (de) |
JP (1) | JP3076246B2 (de) |
DE (1) | DE69705681T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3298532B2 (ja) * | 1998-12-25 | 2002-07-02 | 日本電気株式会社 | 半導体レーザモジュール |
CA2349430A1 (en) * | 2000-05-31 | 2001-11-30 | The Furukawa Electric Co., Ltd. | Semiconductor laser diode module |
JP3518491B2 (ja) * | 2000-06-26 | 2004-04-12 | 株式会社日立製作所 | 光結合装置 |
JP4620268B2 (ja) * | 2001-02-27 | 2011-01-26 | アイシン精機株式会社 | 熱電モジュールを放熱部材に組み付ける方法 |
US7090412B2 (en) * | 2002-08-02 | 2006-08-15 | Sumitomo Electric Industries, Ltd. | Optical module |
JP2004207434A (ja) * | 2002-12-25 | 2004-07-22 | Mitsubishi Electric Corp | 光モジュールおよび光送信器 |
US20060107986A1 (en) * | 2004-01-29 | 2006-05-25 | Abramov Vladimir S | Peltier cooling systems with high aspect ratio |
JP4271993B2 (ja) * | 2003-05-29 | 2009-06-03 | 株式会社日立製作所 | 光モジュール |
CN100379045C (zh) * | 2004-01-18 | 2008-04-02 | 财团法人工业技术研究院 | 微型热电冷却装置的结构及制造方法 |
US20060179849A1 (en) * | 2005-02-14 | 2006-08-17 | Abramov Vladimir S | Peltier based heat transfer systems |
US7447033B2 (en) * | 2006-11-01 | 2008-11-04 | Apple Inc. | Embedded thermal-electric cooling modules for surface spreading of heat |
JP5071157B2 (ja) * | 2008-02-29 | 2012-11-14 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
US20100002235A1 (en) * | 2008-07-07 | 2010-01-07 | IRMicrosystems SA | Laser diode arrangements and method for gas detection |
US8811439B2 (en) | 2009-11-23 | 2014-08-19 | Seminex Corporation | Semiconductor laser assembly and packaging system |
US20110268150A1 (en) * | 2010-12-17 | 2011-11-03 | General Electric Company | System and method for measuring temperature |
JP6303481B2 (ja) * | 2013-12-20 | 2018-04-04 | セイコーエプソン株式会社 | 発光素子モジュール、量子干渉装置、原子発振器、電子機器および移動体 |
WO2020157853A1 (ja) * | 2019-01-30 | 2020-08-06 | 三菱電機株式会社 | 光送信モジュール |
WO2021024046A1 (ru) * | 2020-04-16 | 2021-02-11 | Владимир ВАХ | Узел прибора терморегуляции полупроводникового лазера |
JP2022171478A (ja) * | 2021-04-30 | 2022-11-11 | 日本発條株式会社 | 屈曲構造体及びその製造方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62144124A (ja) * | 1985-12-18 | 1987-06-27 | Fujitsu Ltd | 光学部品の固定方法 |
US4803361A (en) * | 1986-05-26 | 1989-02-07 | Hitachi, Ltd. | Photoelectric device with optical fiber and laser emitting chip |
JPS62276892A (ja) * | 1986-05-26 | 1987-12-01 | Hitachi Ltd | 電子部品 |
JPS6370589A (ja) * | 1986-09-12 | 1988-03-30 | Nec Corp | 半導体レ−ザモジユ−ル |
NL8800140A (nl) * | 1988-01-22 | 1989-08-16 | Philips Nv | Laserdiode module. |
JPH01220491A (ja) * | 1988-02-29 | 1989-09-04 | Nec Corp | 半導体レーザ装置 |
JPH01243488A (ja) * | 1988-03-25 | 1989-09-28 | Nec Corp | 光半導体モジュール |
US5068865A (en) * | 1988-06-09 | 1991-11-26 | Nec Corporation | Semiconductor laser module |
JP2833760B2 (ja) * | 1988-08-31 | 1998-12-09 | 日本電気株式会社 | フラットパッケージ形半導体レーザ光モジュール |
JP2619523B2 (ja) * | 1989-03-20 | 1997-06-11 | 富士通株式会社 | Ldチップキャリア固定構造 |
JP3035852B2 (ja) * | 1990-07-18 | 2000-04-24 | 富士通株式会社 | 半導体レーザモジュール |
JP2959678B2 (ja) * | 1990-09-25 | 1999-10-06 | 富士通株式会社 | 半導体レーザモジュール及び該モジュールの製造方法 |
JP3110039B2 (ja) * | 1990-10-31 | 2000-11-20 | 日本電気株式会社 | 半導体レーザモジュール |
JPH04218989A (ja) * | 1990-12-14 | 1992-08-10 | Fujitsu Ltd | 半導体レーザモジュール |
JPH04243181A (ja) * | 1991-01-17 | 1992-08-31 | Fujitsu Ltd | 半導体レーザモジュール |
JPH04105572U (ja) * | 1991-02-26 | 1992-09-10 | ソニー株式会社 | レーザ装置 |
NL9100367A (nl) * | 1991-02-28 | 1992-09-16 | Philips Nv | Opto-electronische inrichting bevattende een halfgeleiderlaser en een optische isolator. |
JP3149965B2 (ja) * | 1991-05-21 | 2001-03-26 | 日本電気株式会社 | 光半導体モジュ−ル |
JPH04355706A (ja) * | 1991-06-03 | 1992-12-09 | Oki Electric Ind Co Ltd | 半導体レーザモジュール |
AU659270B2 (en) * | 1992-02-20 | 1995-05-11 | Sony Corporation | Laser light beam generating apparatus |
JPH05327031A (ja) * | 1992-05-22 | 1993-12-10 | Fujitsu Ltd | 光半導体モジュール |
JPH06120609A (ja) * | 1992-10-06 | 1994-04-28 | Matsushita Electric Ind Co Ltd | 発光装置および受光装置とその製造方法 |
JPH08195528A (ja) * | 1995-01-13 | 1996-07-30 | Fujitsu Ltd | レーザダイオードモジュール |
JPH09511848A (ja) * | 1995-02-10 | 1997-11-25 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 半導体レーザ変調器又は増幅器と2つの光ガラスファイバとの間の結合を具えたオプトエレクトロニクスデバイス |
JP2937791B2 (ja) * | 1995-03-14 | 1999-08-23 | 日本電気株式会社 | ペルチエクラーク |
US5737349A (en) * | 1996-05-22 | 1998-04-07 | Lucent Technologies Inc. | Optical isolator and alignment method |
-
1996
- 1996-08-13 JP JP08213507A patent/JP3076246B2/ja not_active Expired - Fee Related
-
1997
- 1997-08-12 EP EP97113914A patent/EP0824281B1/de not_active Expired - Lifetime
- 1997-08-12 DE DE69705681T patent/DE69705681T2/de not_active Expired - Fee Related
- 1997-08-12 US US08/909,661 patent/US5960142A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3076246B2 (ja) | 2000-08-14 |
US5960142A (en) | 1999-09-28 |
EP0824281A1 (de) | 1998-02-18 |
EP0824281B1 (de) | 2001-07-18 |
JPH1065273A (ja) | 1998-03-06 |
DE69705681D1 (de) | 2001-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |