DE69705681T2 - Peltierkühler und Verwendung in einem Halbleiterlasermodul - Google Patents

Peltierkühler und Verwendung in einem Halbleiterlasermodul

Info

Publication number
DE69705681T2
DE69705681T2 DE69705681T DE69705681T DE69705681T2 DE 69705681 T2 DE69705681 T2 DE 69705681T2 DE 69705681 T DE69705681 T DE 69705681T DE 69705681 T DE69705681 T DE 69705681T DE 69705681 T2 DE69705681 T2 DE 69705681T2
Authority
DE
Germany
Prior art keywords
semiconductor laser
laser module
peltier cooler
peltier
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69705681T
Other languages
English (en)
Other versions
DE69705681D1 (de
Inventor
Haruhito Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69705681D1 publication Critical patent/DE69705681D1/de
Publication of DE69705681T2 publication Critical patent/DE69705681T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02407Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Mountings; Housings characterised by the shape of the housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02251Out-coupling of light using optical fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/02325Mechanically integrated components on mount members or optical micro-benches

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
DE69705681T 1996-08-13 1997-08-12 Peltierkühler und Verwendung in einem Halbleiterlasermodul Expired - Fee Related DE69705681T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08213507A JP3076246B2 (ja) 1996-08-13 1996-08-13 ペルチェクーラ内蔵半導体レーザモジュール

Publications (2)

Publication Number Publication Date
DE69705681D1 DE69705681D1 (de) 2001-08-23
DE69705681T2 true DE69705681T2 (de) 2002-05-08

Family

ID=16640345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69705681T Expired - Fee Related DE69705681T2 (de) 1996-08-13 1997-08-12 Peltierkühler und Verwendung in einem Halbleiterlasermodul

Country Status (4)

Country Link
US (1) US5960142A (de)
EP (1) EP0824281B1 (de)
JP (1) JP3076246B2 (de)
DE (1) DE69705681T2 (de)

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* Cited by examiner, † Cited by third party
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JP3298532B2 (ja) * 1998-12-25 2002-07-02 日本電気株式会社 半導体レーザモジュール
CA2349430A1 (en) * 2000-05-31 2001-11-30 The Furukawa Electric Co., Ltd. Semiconductor laser diode module
JP3518491B2 (ja) * 2000-06-26 2004-04-12 株式会社日立製作所 光結合装置
JP4620268B2 (ja) * 2001-02-27 2011-01-26 アイシン精機株式会社 熱電モジュールを放熱部材に組み付ける方法
US7090412B2 (en) * 2002-08-02 2006-08-15 Sumitomo Electric Industries, Ltd. Optical module
JP2004207434A (ja) * 2002-12-25 2004-07-22 Mitsubishi Electric Corp 光モジュールおよび光送信器
US20060107986A1 (en) * 2004-01-29 2006-05-25 Abramov Vladimir S Peltier cooling systems with high aspect ratio
JP4271993B2 (ja) * 2003-05-29 2009-06-03 株式会社日立製作所 光モジュール
CN100379045C (zh) * 2004-01-18 2008-04-02 财团法人工业技术研究院 微型热电冷却装置的结构及制造方法
US20060179849A1 (en) * 2005-02-14 2006-08-17 Abramov Vladimir S Peltier based heat transfer systems
US7447033B2 (en) * 2006-11-01 2008-11-04 Apple Inc. Embedded thermal-electric cooling modules for surface spreading of heat
JP5071157B2 (ja) * 2008-02-29 2012-11-14 富士通オプティカルコンポーネンツ株式会社 光モジュール
US20100002235A1 (en) * 2008-07-07 2010-01-07 IRMicrosystems SA Laser diode arrangements and method for gas detection
US8811439B2 (en) 2009-11-23 2014-08-19 Seminex Corporation Semiconductor laser assembly and packaging system
US20110268150A1 (en) * 2010-12-17 2011-11-03 General Electric Company System and method for measuring temperature
JP6303481B2 (ja) * 2013-12-20 2018-04-04 セイコーエプソン株式会社 発光素子モジュール、量子干渉装置、原子発振器、電子機器および移動体
WO2020157853A1 (ja) * 2019-01-30 2020-08-06 三菱電機株式会社 光送信モジュール
WO2021024046A1 (ru) * 2020-04-16 2021-02-11 Владимир ВАХ Узел прибора терморегуляции полупроводникового лазера
JP2022171478A (ja) * 2021-04-30 2022-11-11 日本発條株式会社 屈曲構造体及びその製造方法

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JPS62144124A (ja) * 1985-12-18 1987-06-27 Fujitsu Ltd 光学部品の固定方法
US4803361A (en) * 1986-05-26 1989-02-07 Hitachi, Ltd. Photoelectric device with optical fiber and laser emitting chip
JPS62276892A (ja) * 1986-05-26 1987-12-01 Hitachi Ltd 電子部品
JPS6370589A (ja) * 1986-09-12 1988-03-30 Nec Corp 半導体レ−ザモジユ−ル
NL8800140A (nl) * 1988-01-22 1989-08-16 Philips Nv Laserdiode module.
JPH01220491A (ja) * 1988-02-29 1989-09-04 Nec Corp 半導体レーザ装置
JPH01243488A (ja) * 1988-03-25 1989-09-28 Nec Corp 光半導体モジュール
US5068865A (en) * 1988-06-09 1991-11-26 Nec Corporation Semiconductor laser module
JP2833760B2 (ja) * 1988-08-31 1998-12-09 日本電気株式会社 フラットパッケージ形半導体レーザ光モジュール
JP2619523B2 (ja) * 1989-03-20 1997-06-11 富士通株式会社 Ldチップキャリア固定構造
JP3035852B2 (ja) * 1990-07-18 2000-04-24 富士通株式会社 半導体レーザモジュール
JP2959678B2 (ja) * 1990-09-25 1999-10-06 富士通株式会社 半導体レーザモジュール及び該モジュールの製造方法
JP3110039B2 (ja) * 1990-10-31 2000-11-20 日本電気株式会社 半導体レーザモジュール
JPH04218989A (ja) * 1990-12-14 1992-08-10 Fujitsu Ltd 半導体レーザモジュール
JPH04243181A (ja) * 1991-01-17 1992-08-31 Fujitsu Ltd 半導体レーザモジュール
JPH04105572U (ja) * 1991-02-26 1992-09-10 ソニー株式会社 レーザ装置
NL9100367A (nl) * 1991-02-28 1992-09-16 Philips Nv Opto-electronische inrichting bevattende een halfgeleiderlaser en een optische isolator.
JP3149965B2 (ja) * 1991-05-21 2001-03-26 日本電気株式会社 光半導体モジュ−ル
JPH04355706A (ja) * 1991-06-03 1992-12-09 Oki Electric Ind Co Ltd 半導体レーザモジュール
AU659270B2 (en) * 1992-02-20 1995-05-11 Sony Corporation Laser light beam generating apparatus
JPH05327031A (ja) * 1992-05-22 1993-12-10 Fujitsu Ltd 光半導体モジュール
JPH06120609A (ja) * 1992-10-06 1994-04-28 Matsushita Electric Ind Co Ltd 発光装置および受光装置とその製造方法
JPH08195528A (ja) * 1995-01-13 1996-07-30 Fujitsu Ltd レーザダイオードモジュール
JPH09511848A (ja) * 1995-02-10 1997-11-25 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 半導体レーザ変調器又は増幅器と2つの光ガラスファイバとの間の結合を具えたオプトエレクトロニクスデバイス
JP2937791B2 (ja) * 1995-03-14 1999-08-23 日本電気株式会社 ペルチエクラーク
US5737349A (en) * 1996-05-22 1998-04-07 Lucent Technologies Inc. Optical isolator and alignment method

Also Published As

Publication number Publication date
JP3076246B2 (ja) 2000-08-14
US5960142A (en) 1999-09-28
EP0824281A1 (de) 1998-02-18
EP0824281B1 (de) 2001-07-18
JPH1065273A (ja) 1998-03-06
DE69705681D1 (de) 2001-08-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee