DE69703687T2 - Verfahren und einrichtung zur montage von bauteilen - Google Patents

Verfahren und einrichtung zur montage von bauteilen

Info

Publication number
DE69703687T2
DE69703687T2 DE69703687T DE69703687T DE69703687T2 DE 69703687 T2 DE69703687 T2 DE 69703687T2 DE 69703687 T DE69703687 T DE 69703687T DE 69703687 T DE69703687 T DE 69703687T DE 69703687 T2 DE69703687 T2 DE 69703687T2
Authority
DE
Germany
Prior art keywords
assembling components
assembling
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69703687T
Other languages
English (en)
Other versions
DE69703687D1 (de
Inventor
Yasuhiro Maenishi
Takeshi Kuribayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69703687D1 publication Critical patent/DE69703687D1/de
Application granted granted Critical
Publication of DE69703687T2 publication Critical patent/DE69703687T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69703687T 1996-06-11 1997-06-11 Verfahren und einrichtung zur montage von bauteilen Expired - Fee Related DE69703687T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14906296A JP3728350B2 (ja) 1996-06-11 1996-06-11 部品実装方法及び部品実装装置
PCT/JP1997/002007 WO1997048263A1 (en) 1996-06-11 1997-06-11 Component mounting method and component mounting apparatus

Publications (2)

Publication Number Publication Date
DE69703687D1 DE69703687D1 (de) 2001-01-18
DE69703687T2 true DE69703687T2 (de) 2001-07-05

Family

ID=15466845

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69703687T Expired - Fee Related DE69703687T2 (de) 1996-06-11 1997-06-11 Verfahren und einrichtung zur montage von bauteilen

Country Status (7)

Country Link
US (1) US6289582B1 (de)
EP (1) EP0904678B1 (de)
JP (1) JP3728350B2 (de)
KR (1) KR100319794B1 (de)
CN (1) CN1110237C (de)
DE (1) DE69703687T2 (de)
WO (1) WO1997048263A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1081998B1 (de) * 1999-09-03 2005-11-30 Matsushita Electric Industrial Co., Ltd. Bauteilen-bestückungsverfahren und Einrichtung
US6792674B2 (en) 2000-04-28 2004-09-21 Hitachi High-Tech Instruments Company, Ltd. Apparatus for mounting electronic components
CN100508726C (zh) * 2000-08-04 2009-07-01 松下电器产业株式会社 用于优化元件安装顺序的方法,采用该方法的装置及组装机器
US6862803B2 (en) 2000-08-29 2005-03-08 Matsushita Electric Industrial Co., Ltd. Method for mounting electronic component
US6594531B2 (en) * 2000-12-22 2003-07-15 Koninklijke Philips Electronics N.V. Modular optimizer with foreign module learning feature for optimization of component placement machines
WO2002056662A1 (fr) * 2001-01-10 2002-07-18 Matsushita Electric Industrial Co., Ltd. Dispositif de montage de composants, fournisseur de services et procede de prestation de services
EP1282350B1 (de) * 2001-07-20 2006-04-26 Hitachi High-Tech Instruments Co., Ltd. Einrichtung zur Montage elektronischer Bauteile
JP3711054B2 (ja) * 2001-09-21 2005-10-26 三洋電機株式会社 部品装着装置における部品配置方法
JP3589658B2 (ja) * 2001-09-28 2004-11-17 松下電器産業株式会社 最適化装置、装着装置及び電子部品装着システム
JP3934002B2 (ja) * 2002-07-23 2007-06-20 松下電器産業株式会社 部品実装順序最適化方法、部品実装順序最適化プログラム、及び部品実装装置
EP1583411A3 (de) * 2004-03-16 2007-10-24 Assembléon N.V. Verfahren und Vorrichtung zum Bestucken mit einem Bestuckautomat
JP2007109893A (ja) * 2005-10-13 2007-04-26 Matsushita Electric Ind Co Ltd 部品実装順序決定方法
DE102006027411B3 (de) * 2006-06-13 2007-11-29 Siemens Ag Verfahren zum Bestücken eines Substrats mit elektrischen Bauteilen und Bestückautomat
US8156642B2 (en) * 2007-04-03 2012-04-17 Panasonic Corporation Component mounting method
CN102946694A (zh) * 2012-11-05 2013-02-27 成都九洲迪飞科技有限责任公司 集成电子模块元器件表面贴装工艺
JP6469986B2 (ja) * 2014-07-28 2019-02-13 株式会社Ｆｕｊｉ 部品収納具の組合せ決定方法、および部品実装機の部品装着方法
JP6326630B2 (ja) * 2014-08-18 2018-05-23 パナソニックＩｐマネジメント株式会社 部品配置の決定方法
US10394228B2 (en) * 2014-11-26 2019-08-27 Fuji Corporation Component mounting line changeover support system and changeover support method
US10455750B2 (en) * 2015-01-20 2019-10-22 Fuji Corporation Inspection support device and inspection support method
WO2016139793A1 (ja) * 2015-03-05 2016-09-09 富士機械製造株式会社 実装管理装置
CN110602939B (zh) * 2015-03-26 2020-10-27 株式会社富士 元件安装线的最优化装置及元件安装线的最优化方法
US9769970B2 (en) * 2015-12-16 2017-09-19 Panasonic Factory Solutions Asia Pacific Apparatus and method for feeding electronic components for insertion onto circuit boards
WO2019011412A1 (de) * 2017-07-11 2019-01-17 Siemens Aktiengesellschaft Verfahren und steuerungseinrichtung zur durchlaufzeitoptimierten produktion von leiterplatten auf einer bestückungslinie
CN112136374B (zh) * 2018-05-30 2022-01-04 雅马哈发动机株式会社 元件补给管理系统和元件安装系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206098A (ja) 1984-03-28 1985-10-17 松下電器産業株式会社 自動実装機の部品供給部の分割切替装置
JPS6221300A (ja) 1985-07-19 1987-01-29 松下電器産業株式会社 部品供給装置
US4914808A (en) 1987-10-16 1990-04-10 Sanyo Electric Co., Ltd Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences
JP2966082B2 (ja) * 1990-11-06 1999-10-25 株式会社日立製作所 実装順序決定方法及びその実装方法
JPH05304396A (ja) 1991-07-12 1993-11-16 Canon Inc 部品の実装順序の決定方法及びその装置
JP2957778B2 (ja) 1991-10-11 1999-10-06 三洋電機株式会社 部品装着順序最適化方法
JPH0783198A (ja) 1993-09-17 1995-03-28 Japan Servo Co Ltd 軸流フアン
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP3196626B2 (ja) * 1995-12-26 2001-08-06 ソニー株式会社 部品実装方法

Also Published As

Publication number Publication date
EP0904678A1 (de) 1999-03-31
US6289582B1 (en) 2001-09-18
WO1997048263A1 (en) 1997-12-18
KR20000015956A (ko) 2000-03-25
JP3728350B2 (ja) 2005-12-21
CN1110237C (zh) 2003-05-28
KR100319794B1 (ko) 2002-02-19
CN1221553A (zh) 1999-06-30
JPH09331196A (ja) 1997-12-22
DE69703687D1 (de) 2001-01-18
EP0904678B1 (de) 2000-12-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee