DE69517676D1 - Verfahren und vorrichtung für die montage von komponenten - Google Patents
Verfahren und vorrichtung für die montage von komponentenInfo
- Publication number
- DE69517676D1 DE69517676D1 DE69517676T DE69517676T DE69517676D1 DE 69517676 D1 DE69517676 D1 DE 69517676D1 DE 69517676 T DE69517676 T DE 69517676T DE 69517676 T DE69517676 T DE 69517676T DE 69517676 D1 DE69517676 D1 DE 69517676D1
- Authority
- DE
- Germany
- Prior art keywords
- assembling components
- assembling
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49137—Different components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/534—Multiple station assembly or disassembly apparatus
- Y10T29/53409—Multiple station assembly or disassembly apparatus including converging conveyors
- Y10T29/53413—Multiple station assembly or disassembly apparatus including converging conveyors and primary central conveyor
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9400077A SE9400077D0 (sv) | 1994-01-10 | 1994-01-10 | Maskinkoncept |
PCT/SE1995/000015 WO1995019099A1 (en) | 1994-01-10 | 1995-01-10 | A surface mount machine concept |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69517676D1 true DE69517676D1 (de) | 2000-08-03 |
DE69517676T2 DE69517676T2 (de) | 2000-12-28 |
Family
ID=20392549
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69517676T Expired - Fee Related DE69517676T2 (de) | 1994-01-10 | 1995-01-10 | Verfahren und vorrichtung für die montage von komponenten |
DE69526381T Expired - Fee Related DE69526381T2 (de) | 1994-01-10 | 1995-01-10 | Maschinenkonzept für Oberflächenmontage |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69526381T Expired - Fee Related DE69526381T2 (de) | 1994-01-10 | 1995-01-10 | Maschinenkonzept für Oberflächenmontage |
Country Status (5)
Country | Link |
---|---|
US (1) | US5778524A (de) |
EP (2) | EP0739580B1 (de) |
DE (2) | DE69517676T2 (de) |
SE (1) | SE9400077D0 (de) |
WO (1) | WO1995019099A1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6789310B1 (en) * | 1995-11-06 | 2004-09-14 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus |
FI105315B (fi) * | 1996-05-06 | 2000-07-14 | Pmj Automec Oyj | Laite piirilevyjen tai sen tapaisten levyjen valmistusvaiheiden automaattiseksi suorittamiseksi |
US6066206A (en) | 1997-02-21 | 2000-05-23 | Speedline Technologies, Inc. | Dual track stenciling system with solder gathering head |
US6230393B1 (en) * | 1997-07-07 | 2001-05-15 | Matsushita Electric Industrial Co., Ltd. | Method and device for mounting electronic component |
US6007631A (en) † | 1997-11-10 | 1999-12-28 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
JP4303345B2 (ja) * | 1998-03-12 | 2009-07-29 | Juki株式会社 | 表面実装部品搭載機 |
US6701610B1 (en) * | 1998-07-28 | 2004-03-09 | Koninklijke Philips Electronics N.V. | Pick and place machine with varied nozzle lengths |
DE19905958C1 (de) * | 1999-02-12 | 2000-06-21 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen mittels mehrerer unabhängiger Handhabungsssyteme |
US6866881B2 (en) | 1999-02-19 | 2005-03-15 | Speedline Technologies, Inc. | Dispensing system and method |
EP1159858B1 (de) * | 1999-03-08 | 2002-10-16 | Siemens Dematic AG | Vorrichtung zum bestücken von substraten mit elektrischen bauelementen |
US6054682A (en) * | 1999-03-11 | 2000-04-25 | Micron Electronics, Inc. | Method and system for reducing water vapor in integrated circuit packages prior to reflow |
KR100532015B1 (ko) | 1999-05-21 | 2005-11-29 | 마츠시타 덴끼 산교 가부시키가이샤 | 판상 부재의 반송지지장치 및 그 방법 |
CN1204801C (zh) * | 1999-11-05 | 2005-06-01 | 松下电器产业株式会社 | 元器件安装装置及方法 |
US6836960B2 (en) * | 2000-05-15 | 2005-01-04 | Matsushita Electric Industrial Co., Ltd. | Board transfer apparatus, board transfer method, and component mounting apparatus |
JP4498561B2 (ja) * | 2000-08-04 | 2010-07-07 | 富士機械製造株式会社 | 配線板支持装置の段取替え装置 |
KR100363898B1 (ko) * | 2000-11-24 | 2002-12-11 | 미래산업 주식회사 | 표면실장장치 및 그 방법 |
KR100363902B1 (ko) * | 2000-11-24 | 2002-12-11 | 미래산업 주식회사 | 표면실장장치 및 그 방법 |
US20040148767A1 (en) * | 2001-05-23 | 2004-08-05 | Mohammad Mehdianpour | Assembly system and method for assembling components on substrates |
CN1293794C (zh) * | 2001-05-23 | 2007-01-03 | 西门子公司 | 用于在基底上装配元件的装配系统和方法 |
DE10125398B4 (de) * | 2001-05-23 | 2005-10-06 | Siemens Ag | Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen |
US7082680B2 (en) * | 2001-11-21 | 2006-08-01 | Mirae Corporation | Mounting method of electronic components |
DE10201879A1 (de) * | 2002-01-18 | 2003-08-07 | Siemens Ag | Bestückeinrichtung, Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen |
DE10236004B4 (de) * | 2002-08-06 | 2007-08-23 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
US6993818B2 (en) * | 2003-03-17 | 2006-02-07 | Memx, Inc. | Multi-fixture assembly of cutting tools |
KR20060073542A (ko) * | 2003-07-03 | 2006-06-28 | 아셈블레온 엔. 브이. | 부품 배치 장치 |
CN101496463B (zh) * | 2006-07-31 | 2011-06-22 | 松下电器产业株式会社 | 组件安装条件确定方法 |
US7836582B2 (en) * | 2006-12-12 | 2010-11-23 | Universal Instruments Corporation | Printed circuit board assembly machine |
US8132317B2 (en) * | 2007-06-11 | 2012-03-13 | Research In Motion Limited | Apparatus for manufacture of electronic assemblies |
JP4957453B2 (ja) * | 2007-08-23 | 2012-06-20 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
DE102009013353B3 (de) * | 2009-03-16 | 2010-10-07 | Siemens Aktiengesellschaft | Verfahren zur Bestimmung von Rüstungen für konstante Tische von Bestückautomaten |
JP5906399B2 (ja) * | 2013-02-22 | 2016-04-20 | パナソニックIpマネジメント株式会社 | 電子部品実装システムおよび電子部品実装方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4231153A (en) * | 1979-02-22 | 1980-11-04 | Browne Lawrence T | Article placement system |
GB2150098B (en) * | 1983-11-24 | 1986-10-08 | Dyna Pert Precima Limited | Machine for placing electronic components on a substrate |
US4631812A (en) * | 1984-05-10 | 1986-12-30 | Quad Systems Corporation | Programmable substrate transport for electronic assembly |
GB2173426A (en) * | 1985-04-09 | 1986-10-15 | Dynapert Precima Ltd | Component placement machine |
WO1987003235A1 (en) * | 1985-11-27 | 1987-06-04 | Matsushita Electric Industrial Co., Ltd. | Method of carrying out operation in working apparatus |
EP0259489B1 (de) * | 1985-11-27 | 1992-05-20 | Matsushita Electric Industrial Co., Ltd. | Montagevorrichtung |
NL8702181A (nl) * | 1987-09-14 | 1989-04-03 | Philips Nv | Transportinrichting voor dragers. |
KR900015590A (ko) * | 1989-03-23 | 1990-10-27 | 프레데릭 얀 스미트 | 캐리어상에 부품을 배치하는 방법 및 그 방법을 수행하기 위한 장치 |
GB9000726D0 (en) * | 1990-01-12 | 1990-03-14 | Automation Tooling Syst | System for mounting components on circuit boards |
DE4002075A1 (de) * | 1990-01-25 | 1991-08-08 | Antriebs Steuerungstech Ges | Handhabungsvorrichtung und verfahren zum handhaben von werkstuecken |
FR2661311B1 (fr) * | 1990-04-20 | 1992-08-07 | Eurosoft Robotique | Dispositif et procede de montage automatique de composants electroniques. |
DE59202991D1 (de) * | 1991-01-28 | 1995-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Leiterplatten. |
US5145052A (en) * | 1991-04-10 | 1992-09-08 | Axis Usa, Inc. | Apparatus for substantially simultaneously processing multiple electric motor parts |
JP2540673B2 (ja) * | 1991-07-10 | 1996-10-09 | 株式会社テンリュウテクニックス | トレイおよび電子部品の供給装置 |
US5452509A (en) * | 1992-01-21 | 1995-09-26 | Yamaha Hatsudoki Kabushiki Kaisha | Surface mounter |
JP2767018B2 (ja) * | 1993-02-26 | 1998-06-18 | 株式会社村田製作所 | 電子部品の組立方法および組立装置 |
US5323528A (en) * | 1993-06-14 | 1994-06-28 | Amistar Corporation | Surface mount placement system |
US5517748A (en) * | 1994-10-07 | 1996-05-21 | Samsung Electronics Co., Ltd. | Apparatus for conveying circuit boards through a component-mounting station |
-
1994
- 1994-01-10 SE SE9400077A patent/SE9400077D0/xx unknown
-
1995
- 1995-01-10 DE DE69517676T patent/DE69517676T2/de not_active Expired - Fee Related
- 1995-01-10 DE DE69526381T patent/DE69526381T2/de not_active Expired - Fee Related
- 1995-01-10 US US08/669,414 patent/US5778524A/en not_active Expired - Fee Related
- 1995-01-10 EP EP95906581A patent/EP0739580B1/de not_active Expired - Lifetime
- 1995-01-10 WO PCT/SE1995/000015 patent/WO1995019099A1/en active IP Right Grant
- 1995-01-10 EP EP00106579A patent/EP1009211B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SE9400077D0 (sv) | 1994-01-14 |
DE69526381T2 (de) | 2002-11-07 |
DE69526381D1 (de) | 2002-05-16 |
EP1009211B1 (de) | 2002-04-10 |
EP0739580B1 (de) | 2000-06-28 |
EP0739580A1 (de) | 1996-10-30 |
WO1995019099A1 (en) | 1995-07-13 |
EP1009211A3 (de) | 2000-07-12 |
EP1009211A2 (de) | 2000-06-14 |
US5778524A (en) | 1998-07-14 |
DE69517676T2 (de) | 2000-12-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |