DE69600235D1 - Einrichtung und Verfahren zur Montage von Bauteilen - Google Patents

Einrichtung und Verfahren zur Montage von Bauteilen

Info

Publication number
DE69600235D1
DE69600235D1 DE69600235T DE69600235T DE69600235D1 DE 69600235 D1 DE69600235 D1 DE 69600235D1 DE 69600235 T DE69600235 T DE 69600235T DE 69600235 T DE69600235 T DE 69600235T DE 69600235 D1 DE69600235 D1 DE 69600235D1
Authority
DE
Germany
Prior art keywords
assembling components
assembling
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69600235T
Other languages
English (en)
Other versions
DE69600235T2 (de
Inventor
Yoshihiro Yoshida
Noriaki Yoshida
Takeshi Takeda
Kanji Hata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69600235D1 publication Critical patent/DE69600235D1/de
Application granted granted Critical
Publication of DE69600235T2 publication Critical patent/DE69600235T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Transmission Devices (AREA)
  • Manipulator (AREA)
DE69600235T 1995-01-17 1996-01-11 Einrichtung und Verfahren zur Montage von Bauteilen Expired - Fee Related DE69600235T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00478695A JP3282938B2 (ja) 1995-01-17 1995-01-17 部品装着装置

Publications (2)

Publication Number Publication Date
DE69600235D1 true DE69600235D1 (de) 1998-05-20
DE69600235T2 DE69600235T2 (de) 1998-09-24

Family

ID=11593490

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69600235T Expired - Fee Related DE69600235T2 (de) 1995-01-17 1996-01-11 Einrichtung und Verfahren zur Montage von Bauteilen

Country Status (5)

Country Link
US (1) US5784778A (de)
EP (1) EP0724381B1 (de)
JP (1) JP3282938B2 (de)
CN (1) CN1082334C (de)
DE (1) DE69600235T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3549073B2 (ja) * 1995-09-11 2004-08-04 松下電器産業株式会社 電子部品実装方法および電子部品実装装置
JPH09293995A (ja) * 1996-02-26 1997-11-11 Matsushita Electric Ind Co Ltd 部品吸着方法
JPH10159930A (ja) * 1996-11-27 1998-06-16 Fuji Mach Mfg Co Ltd 回路部品搬送装置
US6101707A (en) * 1998-03-03 2000-08-15 Sanyo Electric Co., Ltd. Mounting head for electronic component-mounting apparatus
JP3739218B2 (ja) * 1998-04-02 2006-01-25 松下電器産業株式会社 部品装着方法及び装置
JP3387881B2 (ja) * 1999-03-17 2003-03-17 ティーディーケイ株式会社 電子部品挿入ヘッドおよび電子部品挿入装置
JP3768038B2 (ja) * 1999-08-06 2006-04-19 株式会社日立ハイテクインスツルメンツ 電子部品装着装置及び電子部品装着装置の装着ヘッド
JP3907876B2 (ja) 1999-08-25 2007-04-18 松下電器産業株式会社 電子部品装着装置
JP2001345597A (ja) * 2000-06-02 2001-12-14 Fuji Mach Mfg Co Ltd 電気部品装着装置および電気部品装着システム
CN100361476C (zh) * 2002-02-05 2008-01-09 国际商业机器公司 发送、呈现电子邮件的方法和电子邮件客户机
EP1586227B1 (de) * 2003-01-23 2008-04-16 Matsushita Electric Industrial Co., Ltd. Verfahren zur optimierung einer reihenfolge der komponentenanbringung, vorrichtung damit und anbringvorrichtung
JP4884026B2 (ja) * 2006-02-23 2012-02-22 山形カシオ株式会社 部品搭載装置
DE112008000767T5 (de) * 2007-04-03 2010-04-29 Panasonic Corporation, Kadoma-shi Verfahren zum Bestücken von Bauelementen
JP4997124B2 (ja) * 2008-01-21 2012-08-08 株式会社日立ハイテクインスツルメンツ 電子部品装着ヘッド及び電子部品装着装置
JP6049883B2 (ja) * 2013-07-25 2016-12-21 富士機械製造株式会社 部品実装機
JP7348041B2 (ja) * 2019-11-21 2023-09-20 ファナック株式会社 ワーク取出装置
CN116528502B (zh) * 2023-07-05 2023-08-22 北京三重华星电子科技有限公司 贴片装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0767033B2 (ja) * 1987-01-14 1995-07-19 三洋電機株式会社 自動装着装置
JPH0738516B2 (ja) * 1987-10-20 1995-04-26 松下電器産業株式会社 部品装着装置
JPH07109957B2 (ja) * 1988-06-21 1995-11-22 松下電器産業株式会社 電子部品装着方法
JPH07114556B2 (ja) * 1989-06-07 1995-12-06 株式会社日立製作所 電動機、電動機等に供される電流制御装置あるいはこれらに使用される演算装置、あるいはこれらの装置を具備する装置
JP2620646B2 (ja) * 1989-06-07 1997-06-18 三洋電機株式会社 電子部品自動装着装置
JP2823481B2 (ja) * 1993-05-26 1998-11-11 三洋電機株式会社 電子部品自動装着装置

Also Published As

Publication number Publication date
JP3282938B2 (ja) 2002-05-20
CN1082334C (zh) 2002-04-03
EP0724381A2 (de) 1996-07-31
JPH08195588A (ja) 1996-07-30
EP0724381A3 (de) 1997-03-05
EP0724381B1 (de) 1998-04-15
US5784778A (en) 1998-07-28
CN1136760A (zh) 1996-11-27
DE69600235T2 (de) 1998-09-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee