DE69700599T2 - Einrichtung zur montage von bauteilen - Google Patents

Einrichtung zur montage von bauteilen

Info

Publication number
DE69700599T2
DE69700599T2 DE69700599T DE69700599T DE69700599T2 DE 69700599 T2 DE69700599 T2 DE 69700599T2 DE 69700599 T DE69700599 T DE 69700599T DE 69700599 T DE69700599 T DE 69700599T DE 69700599 T2 DE69700599 T2 DE 69700599T2
Authority
DE
Germany
Prior art keywords
assembling components
assembling
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69700599T
Other languages
English (en)
Other versions
DE69700599D1 (de
Inventor
Yuzo Nishimori
Susumu Takaichi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69700599D1 publication Critical patent/DE69700599D1/de
Publication of DE69700599T2 publication Critical patent/DE69700599T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE69700599T 1996-03-12 1997-03-12 Einrichtung zur montage von bauteilen Expired - Lifetime DE69700599T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05495696A JP3560722B2 (ja) 1996-03-12 1996-03-12 基板搬送方法及び装置
PCT/JP1997/000775 WO1997034460A1 (en) 1996-03-12 1997-03-12 Component mounting apparatus

Publications (2)

Publication Number Publication Date
DE69700599D1 DE69700599D1 (de) 1999-11-11
DE69700599T2 true DE69700599T2 (de) 2000-05-18

Family

ID=12985129

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69700599T Expired - Lifetime DE69700599T2 (de) 1996-03-12 1997-03-12 Einrichtung zur montage von bauteilen

Country Status (7)

Country Link
US (1) US6272743B1 (de)
EP (1) EP0887000B1 (de)
JP (1) JP3560722B2 (de)
KR (1) KR100319118B1 (de)
CN (1) CN1096225C (de)
DE (1) DE69700599T2 (de)
WO (1) WO1997034460A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6405430B1 (en) * 1996-02-07 2002-06-18 Micron Technology, Inc. Workpiece moving methods
US6836960B2 (en) * 2000-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Board transfer apparatus, board transfer method, and component mounting apparatus
DE10039201A1 (de) * 2000-08-10 2002-02-28 Siemens Ag Verfahren zum Betreiben einer Bestückanlage, Bestückanlage zur Durchführung des Verfahrens und Übergabeeinrichtung für die Bestückanlage
CN100441078C (zh) * 2004-12-31 2008-12-03 技嘉科技股份有限公司 输送电路板至锡炉输送线的方法及其自动移载机
JP4995671B2 (ja) * 2007-08-30 2012-08-08 株式会社日立ハイテクインスツルメンツ 基板作業装置及び電子部品装着装置
CN101822136B (zh) * 2007-10-09 2013-03-13 先进装配系统有限责任两合公司 将元件输送至为基板装配元件的自动装配机的送料设备
CN101541144B (zh) * 2008-03-19 2011-03-30 富葵精密组件(深圳)有限公司 电路板传送系统以及电路板传送方法
KR101234403B1 (ko) 2012-02-03 2013-02-18 조명희 표면실장기술 설비의 푸쉬장치
CN106063399B (zh) 2013-09-18 2019-03-15 迈康尼股份公司 用于处理smt系统中的托盘的方法、系统和装置
CN103496579B (zh) * 2013-09-29 2015-10-28 上海德科电子仪表有限公司 自动移载机及其原点定位方法
DE102013016707B4 (de) * 2013-10-09 2015-05-07 Asm Assembly Systems Gmbh & Co. Kg Transportvorrichtung und Bestückvorrichtung damit
EP3344027B1 (de) * 2015-08-25 2022-12-14 FUJI Corporation Komponentenmontagelinie
JP6762968B2 (ja) * 2016-02-17 2020-09-30 株式会社Ｆｕｊｉ 作業装置および生産ライン
CN106493673B (zh) * 2016-10-20 2017-12-22 英业达科技有限公司 拆装装置
CN108323150A (zh) * 2017-12-29 2018-07-24 重庆市中光电显示技术有限公司 Fpc供料机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621967A (en) * 1982-01-18 1986-11-11 Usm Corporation Automatic board loaders
CA1215220A (en) * 1982-01-18 1986-12-16 Usm Corporation Automatic board loaders
US4558983A (en) * 1983-10-24 1985-12-17 Usm Corporation Automatic board handling mechanism
DE3540476A1 (de) * 1985-11-12 1987-05-14 Siemens Ag Vorrichtung zum be- und entladen einer leiterplattenbearbeitungseinrichtung
US5093984A (en) * 1990-05-18 1992-03-10 Aehr Test Systems Printed circuit board loader/unloader
GB2262495B (en) * 1991-03-18 1994-08-24 Fujitsu Ltd System for manufacturing printed wiring board units and method of manufacturing the same
JPH06283890A (ja) * 1993-01-28 1994-10-07 Sony Corp 基板搬送方式及びこれを用いた基板搬送装置
JP3377351B2 (ja) * 1995-12-18 2003-02-17 松下電器産業株式会社 電子部品実装機

Also Published As

Publication number Publication date
CN1096225C (zh) 2002-12-11
US6272743B1 (en) 2001-08-14
EP0887000B1 (de) 1999-10-06
KR100319118B1 (ko) 2002-02-19
EP0887000A1 (de) 1998-12-30
JPH09246785A (ja) 1997-09-19
KR19990087679A (ko) 1999-12-27
DE69700599D1 (de) 1999-11-11
WO1997034460A1 (en) 1997-09-18
JP3560722B2 (ja) 2004-09-02
CN1213486A (zh) 1999-04-07

Similar Documents

Publication Publication Date Title
DE69807447D1 (de) Einrichtung zur montage von elektronischen bauteilen
DE69733229D1 (de) Einrichtung zur Montage von elektronischen Bauteilen
DE69823946D1 (de) Enddeckel, Arbeitseinheit und Verfahren zur Montage dieser Arbeitseinheit
ATA203196A (de) Bauelement
DE69822927D1 (de) Einrichtung zur montage von elektronischen bauteilen
DE69703687D1 (de) Verfahren und einrichtung zur montage von bauteilen
DE69603201T2 (de) Einrichtung zur montage von bauteilen
DE69700599D1 (de) Einrichtung zur montage von bauteilen
DE59701655D1 (de) Bauelement
DE69722898D1 (de) Verfahren und Einrichtung zur Montage von Bauteilen
DE9414643U1 (de) Vorrichtung zur Montage von Bauwerkabschnitten übereinander
DE69600283T2 (de) Vorrichtung zur Montage von elektronischen Bauelementen
DE69712628D1 (de) Einrichtung zur montage von filtern
DE69805562D1 (de) Einrichtung zur Montage von elektronischen Bauteilen
DE59700457D1 (de) Einrichtung zur Befestigung
ATA176394A (de) Einrichtung zur befestigung von zwei bauteilen aneinander
DE29702567U1 (de) Bauelement
DE29610829U1 (de) Bauelement
ATA53197A (de) Einrichtung zur tarnung
DE29714038U1 (de) Vorrichtung zur Absicherung von Plätzen
DE29611918U1 (de) Befestigungsvorrichtung zur Befestigung von Bauteilen
ATA207897A (de) Einrichtung zur schwenkverbindung von bauteilen
ATA127296A (de) Vorrichtung zur befestigung von bauelementen
DE29716422U1 (de) Anordnung zur Montage von Bauteilen
DE9411251U1 (de) Schlagvorrichtung zur Selbstverteidigung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)