DE69702049T2 - Vorrichtung und verfahren zum schnellen ausnehmen von leiterplatten - Google Patents

Vorrichtung und verfahren zum schnellen ausnehmen von leiterplatten

Info

Publication number
DE69702049T2
DE69702049T2 DE69702049T DE69702049T DE69702049T2 DE 69702049 T2 DE69702049 T2 DE 69702049T2 DE 69702049 T DE69702049 T DE 69702049T DE 69702049 T DE69702049 T DE 69702049T DE 69702049 T2 DE69702049 T2 DE 69702049T2
Authority
DE
Germany
Prior art keywords
quickly removing
removing circuits
circuits
quickly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69702049T
Other languages
English (en)
Other versions
DE69702049D1 (de
Inventor
Patrick Carr
John Hill
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PMJ CENCORP LONGMONT LLC
Original Assignee
PMJ CENCORP LONGMONT LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PMJ CENCORP LONGMONT LLC filed Critical PMJ CENCORP LONGMONT LLC
Application granted granted Critical
Publication of DE69702049D1 publication Critical patent/DE69702049D1/de
Publication of DE69702049T2 publication Critical patent/DE69702049T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5196—Multiple station with conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/303752—Process
    • Y10T409/303808—Process including infeeding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/304536—Milling including means to infeed work to cutter
    • Y10T409/305544—Milling including means to infeed work to cutter with work holder
    • Y10T409/3056—Milling including means to infeed work to cutter with work holder and means to selectively position work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306048—Milling with means to advance work or product
DE69702049T 1996-02-26 1997-02-26 Vorrichtung und verfahren zum schnellen ausnehmen von leiterplatten Expired - Fee Related DE69702049T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/606,675 US5894648A (en) 1996-02-26 1996-02-26 High speed depaneling apparatus and method
PCT/US1997/003087 WO1997031515A1 (en) 1996-02-26 1997-02-26 High speed depaneling apparatus and method

Publications (2)

Publication Number Publication Date
DE69702049D1 DE69702049D1 (de) 2000-06-21
DE69702049T2 true DE69702049T2 (de) 2000-09-14

Family

ID=24428994

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69702049T Expired - Fee Related DE69702049T2 (de) 1996-02-26 1997-02-26 Vorrichtung und verfahren zum schnellen ausnehmen von leiterplatten

Country Status (5)

Country Link
US (1) US5894648A (de)
EP (1) EP0883980B1 (de)
AU (1) AU1979797A (de)
DE (1) DE69702049T2 (de)
WO (1) WO1997031515A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6047470A (en) * 1997-08-20 2000-04-11 Micron Technology, Inc. Singulation methods
US6192563B1 (en) * 1998-03-02 2001-02-27 Pmj Cencorp Llc Apparatus having improved cycle time for removing a PC board from a panel
US6357108B1 (en) * 1998-11-20 2002-03-19 Pmj Cencorp, Llc Depaneling system having multiple router stations
DE10009974B4 (de) * 2000-03-02 2004-07-29 Ief Werner Gmbh Vorrichtung und Verfahren zum Heraustrennen von Einzelleiterplatten aus Mehrfachnutzen
US6700398B1 (en) 2000-11-28 2004-03-02 Kingston Technology Company In-line D.C. testing of multiple memory modules in a panel before panel separation
CA2434359A1 (en) * 2001-01-16 2002-07-25 Tyco Electronics Corporation Circuit board router apparatus and method thereof
ES2271541T3 (es) 2002-01-22 2007-04-16 Pmj Automec Usa, Inc. D/B/A Pmj Cencorp, Inc. Sistemas de corte de paneles.
US6890604B2 (en) * 2002-05-13 2005-05-10 Trio Industries Holdings, Llc Method and system for powder coating passage doors
US7152271B2 (en) * 2003-03-18 2006-12-26 Tyco Electronics Corporation Apparatus for adjusting a vacuum selector
US7392583B2 (en) * 2003-11-10 2008-07-01 Bob Allen Williams Securing solid-matrix panels for cutting using a tooling fixture
US7469453B2 (en) * 2005-09-26 2008-12-30 Cencorp Usa, Inc. Depaneling system having fixture pallets that tilt toward an operator
WO2008105744A2 (en) * 2007-03-01 2008-09-04 Jsb Tech Private Limited Method and apparatus for assembling surface mount devices
JP4939583B2 (ja) * 2009-09-09 2012-05-30 日東電工株式会社 回路付きサスペンション基板集合体シートおよびその製造方法
US10070534B2 (en) * 2016-08-01 2018-09-04 Piergiacomi Sud-S.R.L. Tool for cutting the isthmuses of printed circuit boards
WO2020035711A1 (en) * 2018-08-13 2020-02-20 Disruptive Technologies Research As Pcb structures in smt
CN110282341A (zh) * 2019-06-25 2019-09-27 英业达科技有限公司 取放装置
CN110919359B (zh) * 2019-12-17 2021-03-09 厦门宏泰智能制造有限公司 一种网络终端的自动装配方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1179960B (it) * 1984-02-09 1987-09-23 Prt Pluritec Italia Spa Metodo di scontornatura e relativa macchina scontornatrice di circuiti stampati
US4830554A (en) * 1986-06-23 1989-05-16 Cencorp, Inc. Routing apparatus for cutting printed circuit boards
DE3737868A1 (de) * 1987-11-07 1989-05-18 Loehr & Herrmann Gmbh Vorrichtung zum trennen und besaeumen von leiterplatten
JPH0744405Y2 (ja) * 1989-03-07 1995-10-11 ローム株式会社 プリント基板の切断装置
US5084952A (en) * 1989-11-07 1992-02-04 Cencorp, Inc. Method and apparatus for increasing a substrate processing area without increasing the length of a manufacturing line
US5117554A (en) * 1989-11-22 1992-06-02 Cencorp, Inc. Tab routing method and apparatus
US5317943A (en) * 1990-03-06 1994-06-07 Robert K. Dowdle Method and apparatus for ultrasonically cutting mat board
US5121539A (en) * 1991-07-17 1992-06-16 Trumpf Gmbh & Company Apparatus and method for cutting stacked sheet-like workpieces
US5210922A (en) * 1991-12-06 1993-05-18 Cencorp, Inc. Acquiring and maintaining support for and registration with each board during depaneling and transferring of each liberated board to a subsequent station
US5429461A (en) * 1992-10-05 1995-07-04 Komo Machine, Incorporated Machining apparatus and work table assembly therefor
US5438740A (en) * 1994-02-28 1995-08-08 Cencorp, Inc. Reconfigurable fixturing pallet for registering and supporting multi-board panels on the table of a programmable routing machine

Also Published As

Publication number Publication date
EP0883980B1 (de) 2000-05-17
DE69702049D1 (de) 2000-06-21
US5894648A (en) 1999-04-20
AU1979797A (en) 1997-09-10
WO1997031515A1 (en) 1997-08-28
EP0883980A1 (de) 1998-12-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee