DE69633737D1 - Vorrichtung mit halbleiter - Google Patents
Vorrichtung mit halbleiterInfo
- Publication number
- DE69633737D1 DE69633737D1 DE69633737T DE69633737T DE69633737D1 DE 69633737 D1 DE69633737 D1 DE 69633737D1 DE 69633737 T DE69633737 T DE 69633737T DE 69633737 T DE69633737 T DE 69633737T DE 69633737 D1 DE69633737 D1 DE 69633737D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12023795 | 1995-05-18 | ||
JP7120237A JPH08316411A (ja) | 1995-05-18 | 1995-05-18 | 半導体装置 |
PCT/JP1996/001264 WO1996036496A1 (en) | 1995-05-18 | 1996-05-14 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69633737D1 true DE69633737D1 (de) | 2004-12-02 |
DE69633737T2 DE69633737T2 (de) | 2006-02-09 |
Family
ID=14781244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69633737T Expired - Lifetime DE69633737T2 (de) | 1995-05-18 | 1996-05-14 | Halbleitervorrichtung |
Country Status (10)
Country | Link |
---|---|
US (3) | US5986341A (de) |
EP (1) | EP0870627B1 (de) |
JP (1) | JPH08316411A (de) |
KR (1) | KR100417055B1 (de) |
CN (1) | CN1068546C (de) |
AU (1) | AU710390B2 (de) |
DE (1) | DE69633737T2 (de) |
ES (1) | ES2230563T3 (de) |
TW (1) | TW359825B (de) |
WO (1) | WO1996036496A1 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3156896B2 (ja) * | 1994-01-28 | 2001-04-16 | 富士通株式会社 | 半導体装置の製造方法およびかかる製造方法により製造された半導体装置 |
JPH08316411A (ja) * | 1995-05-18 | 1996-11-29 | Hitachi Ltd | 半導体装置 |
AU1174197A (en) * | 1996-12-26 | 1998-07-31 | Hitachi Limited | Semiconductor device and method of manufacturing the same |
US6255725B1 (en) * | 1998-05-28 | 2001-07-03 | Shinko Electric Industries Co., Ltd. | IC card and plane coil for IC card |
RU2190284C2 (ru) * | 1998-07-07 | 2002-09-27 | Закрытое акционерное общество "Техно-ТМ" | Двусторонний электронный прибор |
US6872187B1 (en) | 1998-09-01 | 2005-03-29 | Izex Technologies, Inc. | Orthoses for joint rehabilitation |
SG80077A1 (en) * | 1998-10-19 | 2001-04-17 | Sony Corp | Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
TW484101B (en) * | 1998-12-17 | 2002-04-21 | Hitachi Ltd | Semiconductor device and its manufacturing method |
US6542720B1 (en) * | 1999-03-01 | 2003-04-01 | Micron Technology, Inc. | Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices |
US7416537B1 (en) | 1999-06-23 | 2008-08-26 | Izex Technologies, Inc. | Rehabilitative orthoses |
FR2806189B1 (fr) * | 2000-03-10 | 2002-05-31 | Schlumberger Systems & Service | Circuit integre renforce et procede de renforcement de circuits integres |
US6977112B2 (en) * | 2000-07-10 | 2005-12-20 | Canon Finetech, Inc. | Non-contact information recording medium for ink-jet recording and image forming process |
DE10045196C2 (de) * | 2000-09-13 | 2002-12-05 | Infineon Technologies Ag | Maschinenlesbares Etikett |
DE10111028A1 (de) * | 2001-03-07 | 2002-09-19 | Infineon Technologies Ag | Chipkartenmodul |
FI112550B (fi) * | 2001-05-31 | 2003-12-15 | Rafsec Oy | Älytarra ja älytarraraina |
ES2649545T3 (es) * | 2001-09-18 | 2018-01-12 | Nagravision S.A. | Procedimiento de fabricación de una etiqueta electrónica fina |
JP4066929B2 (ja) * | 2003-10-08 | 2008-03-26 | 株式会社日立製作所 | 電子装置及びその製造方法 |
JP4256328B2 (ja) * | 2003-12-05 | 2009-04-22 | 株式会社東芝 | 電界効果トランジスタ、半導体装置及びフォトリレー |
JP2005276176A (ja) * | 2004-02-27 | 2005-10-06 | Toshiba Corp | 携帯可能電子装置 |
US7210635B2 (en) * | 2004-07-02 | 2007-05-01 | Caterpillar Inc | System and method for encapsulation and protection of components |
WO2006055547A2 (en) | 2004-11-15 | 2006-05-26 | Izex Technologies, Inc. | Instrumented orthopedic and other medical implants |
US8308794B2 (en) | 2004-11-15 | 2012-11-13 | IZEK Technologies, Inc. | Instrumented implantable stents, vascular grafts and other medical devices |
DE102005058977A1 (de) * | 2005-12-09 | 2007-06-14 | Atmel Germany Gmbh | Transpondereinrichtung mit Mega-Pads |
US7362086B2 (en) * | 2005-12-19 | 2008-04-22 | Silicon Laboratories Inc. | Integrated current sensor |
US7679162B2 (en) * | 2005-12-19 | 2010-03-16 | Silicon Laboratories Inc. | Integrated current sensor package |
US7397234B2 (en) * | 2005-12-19 | 2008-07-08 | Silicon Laboratories Inc. | Current sensor with reset circuit |
KR100809028B1 (ko) * | 2006-06-07 | 2008-03-03 | (주)아이디밸리 | 교통카드용 알에프 모듈 |
US7990132B2 (en) * | 2006-06-30 | 2011-08-02 | Silicon Laboratories Inc. | Current sensor including an integrated circuit die including a first and second coil |
US7821251B2 (en) * | 2006-12-12 | 2010-10-26 | Silicon Laboratories Inc. | Current sensor |
US7728578B2 (en) * | 2008-05-15 | 2010-06-01 | Silicon Laboratories Inc. | Method and apparatus for high current measurement |
JP5501174B2 (ja) * | 2009-09-17 | 2014-05-21 | 株式会社半導体エネルギー研究所 | 半導体装置 |
USD776664S1 (en) * | 2015-05-20 | 2017-01-17 | Chaya Coleena Hendrick | Smart card |
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US4825056A (en) * | 1985-11-21 | 1989-04-25 | Kabushiki Kaisha Toshiba | Thin-film electromagnetic transducer |
JPS63149191A (ja) * | 1986-12-15 | 1988-06-21 | 日立マクセル株式会社 | Icカ−ド |
JPH01157896A (ja) * | 1987-09-28 | 1989-06-21 | Mitsubishi Electric Corp | 非接触型icカード及び非接触型カードリーダライタ |
US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
JPH0387299A (ja) * | 1989-08-31 | 1991-04-12 | Sharp Corp | Icカード |
US5198647A (en) * | 1989-11-28 | 1993-03-30 | Mitsubishi Denki Kabushiki Kaisha | Plural-coil non-contact ic card having pot cores and shielding walls |
JPH0427599A (ja) * | 1990-04-09 | 1992-01-30 | Mitsubishi Heavy Ind Ltd | Icタグ及び生産制御システム |
JPH04341896A (ja) * | 1991-05-20 | 1992-11-27 | Hitachi Ltd | 半導体装置及びメモリーカード |
JPH0664379A (ja) * | 1992-08-12 | 1994-03-08 | Oki Electric Ind Co Ltd | Icカードおよびその製造方法 |
GB9313749D0 (en) * | 1993-07-02 | 1993-08-18 | Gec Avery Ltd | A device comprising a flexible printed circuit |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US5480842A (en) * | 1994-04-11 | 1996-01-02 | At&T Corp. | Method for fabricating thin, strong, and flexible die for smart cards |
JPH08316411A (ja) * | 1995-05-18 | 1996-11-29 | Hitachi Ltd | 半導体装置 |
CN1106627C (zh) * | 1995-08-01 | 2003-04-23 | 奥地利塑料卡及证件系统股份有限公司 | 带有一个拥有一个构件的模块的和带有一个线圈的数据载体和用于制造这种数据载体的方法 |
US5719437A (en) * | 1996-04-19 | 1998-02-17 | Lucent Technologies Inc. | Smart cards having thin die |
DE19710144C2 (de) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
US5909050A (en) * | 1997-09-15 | 1999-06-01 | Microchip Technology Incorporated | Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
-
1995
- 1995-05-18 JP JP7120237A patent/JPH08316411A/ja active Pending
-
1996
- 1996-05-14 EP EP96913742A patent/EP0870627B1/de not_active Expired - Lifetime
- 1996-05-14 CN CN96194857A patent/CN1068546C/zh not_active Expired - Fee Related
- 1996-05-14 KR KR1019970708118A patent/KR100417055B1/ko not_active IP Right Cessation
- 1996-05-14 AU AU56599/96A patent/AU710390B2/en not_active Ceased
- 1996-05-14 DE DE69633737T patent/DE69633737T2/de not_active Expired - Lifetime
- 1996-05-14 US US08/930,083 patent/US5986341A/en not_active Expired - Lifetime
- 1996-05-14 WO PCT/JP1996/001264 patent/WO1996036496A1/ja active IP Right Grant
- 1996-05-14 ES ES96913742T patent/ES2230563T3/es not_active Expired - Lifetime
- 1996-05-21 TW TW085106000A patent/TW359825B/zh not_active IP Right Cessation
-
1999
- 1999-10-12 US US09/417,466 patent/US6140697A/en not_active Expired - Fee Related
-
2000
- 2000-04-25 US US09/557,218 patent/US6239483B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU710390B2 (en) | 1999-09-16 |
DE69633737T2 (de) | 2006-02-09 |
ES2230563T3 (es) | 2005-05-01 |
US6140697A (en) | 2000-10-31 |
JPH08316411A (ja) | 1996-11-29 |
KR100417055B1 (ko) | 2004-04-29 |
KR19990014775A (ko) | 1999-02-25 |
CN1188451A (zh) | 1998-07-22 |
CN1068546C (zh) | 2001-07-18 |
US6239483B1 (en) | 2001-05-29 |
WO1996036496A1 (en) | 1996-11-21 |
AU5659996A (en) | 1996-11-29 |
US5986341A (en) | 1999-11-16 |
EP0870627A1 (de) | 1998-10-14 |
EP0870627B1 (de) | 2004-10-27 |
EP0870627A4 (de) | 2001-02-07 |
TW359825B (en) | 1999-06-01 |
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Legal Events
Date | Code | Title | Description |
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8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: RENESAS TECHNOLOGY CORP., TOKYO, JP |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: RENESAS ELECTRONICS CORP., KAWASAKI-SHI, KANAG, JP |