DE69631627D1 - Substratbehälter mit Eckenhalterung - Google Patents

Substratbehälter mit Eckenhalterung

Info

Publication number
DE69631627D1
DE69631627D1 DE69631627T DE69631627T DE69631627D1 DE 69631627 D1 DE69631627 D1 DE 69631627D1 DE 69631627 T DE69631627 T DE 69631627T DE 69631627 T DE69631627 T DE 69631627T DE 69631627 D1 DE69631627 D1 DE 69631627D1
Authority
DE
Germany
Prior art keywords
corner bracket
substrate container
container
substrate
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69631627T
Other languages
English (en)
Other versions
DE69631627T2 (de
Inventor
Joseph Laganza
Hoon-Yeng Yap
Teodorico A Cruz
Erik Magnussen
Craig S Dunning
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
SVG Lithography Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SVG Lithography Systems Inc filed Critical SVG Lithography Systems Inc
Application granted granted Critical
Publication of DE69631627D1 publication Critical patent/DE69631627D1/de
Publication of DE69631627T2 publication Critical patent/DE69631627T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Packaging Frangible Articles (AREA)
DE69631627T 1995-10-19 1996-10-09 Substratbehälter mit Eckenhalterung Expired - Fee Related DE69631627T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US54533195A 1995-10-19 1995-10-19
US545331 1995-10-19
US08/686,085 US5727685A (en) 1995-10-19 1996-07-24 Reticle container with corner holding
US686085 1996-07-24

Publications (2)

Publication Number Publication Date
DE69631627D1 true DE69631627D1 (de) 2004-04-01
DE69631627T2 DE69631627T2 (de) 2004-08-19

Family

ID=27067900

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69631627T Expired - Fee Related DE69631627T2 (de) 1995-10-19 1996-10-09 Substratbehälter mit Eckenhalterung

Country Status (6)

Country Link
US (1) US5727685A (de)
EP (1) EP0769807B1 (de)
JP (2) JP4054080B2 (de)
KR (1) KR100440812B1 (de)
CA (1) CA2188196A1 (de)
DE (1) DE69631627T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10154646A (ja) * 1996-11-22 1998-06-09 Nikon Corp 搬送装置
JPH10310145A (ja) * 1997-05-13 1998-11-24 Zeon Kasei Co Ltd 薄板用コンテナ
US5972727A (en) * 1998-06-30 1999-10-26 Advanced Micro Devices Reticle sorter
US6280646B1 (en) 1999-07-16 2001-08-28 Micron Technology, Inc. Use of a chemically active reticle carrier for photomask etching
US6239863B1 (en) 1999-10-08 2001-05-29 Silicon Valley Group, Inc. Removable cover for protecting a reticle, system including and method of using the same
US6847434B2 (en) * 2000-02-10 2005-01-25 Asml Holding N.V. Method and apparatus for a pellicle frame with porous filtering inserts
US6507390B1 (en) 2000-02-10 2003-01-14 Asml Us, Inc. Method and apparatus for a reticle with purged pellicle-to-reticle gap
US6307619B1 (en) 2000-03-23 2001-10-23 Silicon Valley Group, Inc. Scanning framing blade apparatus
KR100597035B1 (ko) * 2001-03-01 2006-07-04 에이에스엠엘 네델란즈 비.브이. 마스크핸들링방법, 마스크, 그를 위한 그리퍼를 포함하는기구 또는 장치, 디바이스 제조방법 및 그 디바이스
US6736386B1 (en) * 2001-04-10 2004-05-18 Dupont Photomasks, Inc. Covered photomask holder and method of using the same
DE20106909U1 (de) * 2001-04-21 2002-08-29 ACR Automation in Cleanroom GmbH, 78078 Niedereschach Transportbox für optische Masken
US6809793B1 (en) 2002-01-16 2004-10-26 Advanced Micro Devices, Inc. System and method to monitor reticle heating
TWI319123B (en) * 2002-02-22 2010-01-01 Asml Holding Nv System and method for using a two part cover for protecting a reticle
US6822731B1 (en) 2003-06-18 2004-11-23 Asml Holding N.V. Method and apparatus for a pellicle frame with heightened bonding surfaces
US6862817B1 (en) 2003-11-12 2005-03-08 Asml Holding N.V. Method and apparatus for kinematic registration of a reticle
US7720558B2 (en) * 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
JP4943345B2 (ja) * 2004-12-23 2012-05-30 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
JP4581681B2 (ja) * 2004-12-27 2010-11-17 株式会社ニコン レチクル保護装置および露光装置
US7607543B2 (en) 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
US20060201848A1 (en) * 2005-03-14 2006-09-14 Ting-Yu Lin Method for reducing mask precipitation defects
US7894923B2 (en) * 2006-12-19 2011-02-22 Koshti Sushant S Methods and apparatus for sensing substrates in carriers
DE102007047186B4 (de) * 2007-10-02 2014-01-09 Carl Zeiss Sms Gmbh Aufnahmevorrichtung zur Aufnahme einer Photolithographiemaske
US10371920B2 (en) 2012-03-22 2019-08-06 Nikon Research Corporation Of America Mirror assembly with heat transfer mechanism
EP2863423B1 (de) * 2012-06-14 2019-09-11 Murata Machinery, Ltd. Deckelöffnungs- und schliessvorrichtung
TW201446101A (zh) * 2013-05-30 2014-12-01 Hon Hai Prec Ind Co Ltd 承載裝置
EP3609428B1 (de) 2017-04-12 2024-01-24 MAKO Surgical Corp. Verpackungssysteme und verfahren zur montage eines werkzeugs auf einer chirurgischen vorrichtung
CN108919603B (zh) * 2018-09-07 2024-08-13 无锡中微掩模电子有限公司 一种集成电路掩模版用新型多片盒
US11690680B2 (en) 2019-03-19 2023-07-04 Mako Surgical Corp. Trackable protective packaging for tools and methods for calibrating tool installation using the same
US11395711B2 (en) 2019-06-05 2022-07-26 Stryker European Operations Limited Packaging systems and methods for mounting a tool on a surgical device using the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615006A (en) * 1969-06-26 1971-10-26 Ibm Storage container
JPS5895812A (ja) * 1981-12-01 1983-06-07 Nippon Kogaku Kk <Nikon> 基板の収納容器及び収納容器の装着装置
JPS59103438U (ja) * 1982-12-28 1984-07-12 富士通株式会社 マスクハンドリング用治具
US4776462A (en) * 1985-09-27 1988-10-11 Canon Kabushiki Kaisha Container for a sheet-like article
US4886169A (en) * 1987-10-13 1989-12-12 Texas Instruments Incorporated Bellows clamp actuator
JPH01100938A (ja) * 1987-10-14 1989-04-19 Hitachi Electron Eng Co Ltd Ｉｃマスク用角形ガラス板のチャック機構
US4958214A (en) * 1988-04-22 1990-09-18 Control Data Corporation Protective carrier for semiconductor packages
JPH0310251A (ja) * 1989-06-08 1991-01-17 Hitachi Electron Eng Co Ltd 板状ワーク搬送装置
KR930006273Y1 (ko) * 1990-08-08 1993-09-17 삼성전관 주식회사 기판이 수납되는 카세트의 위치고정장치
US5154380A (en) * 1990-08-31 1992-10-13 Mihai Risca Container holder
US5066245A (en) * 1990-11-09 1991-11-19 Amp Incorporated Retention device for flat pack sockets
JP3089590B2 (ja) * 1991-07-12 2000-09-18 キヤノン株式会社 板状物収納容器およびその蓋開口装置
US5161789A (en) * 1991-08-27 1992-11-10 Rogers Winston L Universal clamping device
JPH05251302A (ja) * 1992-03-05 1993-09-28 Nec Kyushu Ltd 縮小投影露光装置
JPH0758192A (ja) * 1993-08-12 1995-03-03 Nikon Corp 基板収納ケース
JPH07153661A (ja) * 1993-11-30 1995-06-16 Fuji Electric Co Ltd レティクル取出・収納装置
EP0660655B1 (de) * 1993-12-27 1998-01-28 GOLD INDUSTRIES Co. Ltd. Behältereinrichtungen-Zusammenbau zum Transportieren von Präzisionsvorrichtung

Also Published As

Publication number Publication date
US5727685A (en) 1998-03-17
KR100440812B1 (ko) 2004-10-14
KR970023650A (ko) 1997-05-30
CA2188196A1 (en) 1997-04-20
EP0769807A3 (de) 1997-05-02
EP0769807A2 (de) 1997-04-23
DE69631627T2 (de) 2004-08-19
JP2007279766A (ja) 2007-10-25
JP4054080B2 (ja) 2008-02-27
EP0769807B1 (de) 2004-02-25
JPH09218502A (ja) 1997-08-19

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: ASML HOLDING, N.V., VELDHOVEN, NL

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee