US20060201848A1 - Method for reducing mask precipitation defects - Google Patents
Method for reducing mask precipitation defects Download PDFInfo
- Publication number
- US20060201848A1 US20060201848A1 US11/079,617 US7961705A US2006201848A1 US 20060201848 A1 US20060201848 A1 US 20060201848A1 US 7961705 A US7961705 A US 7961705A US 2006201848 A1 US2006201848 A1 US 2006201848A1
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- United States
- Prior art keywords
- reticle
- container
- recited
- purging
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000007547 defect Effects 0.000 title claims description 6
- 238000001556 precipitation Methods 0.000 title 1
- 238000010926 purge Methods 0.000 claims abstract description 18
- 239000000356 contaminant Substances 0.000 claims abstract description 14
- 230000007613 environmental effect Effects 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 239000011261 inert gas Substances 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims 7
- 239000012535 impurity Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 22
- 238000003825 pressing Methods 0.000 description 6
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- 235000012431 wafers Nutrition 0.000 description 4
- 239000012777 electrically insulating material Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XNFHHOXCDUAYSR-SFHVURJKSA-N n-[[(2s)-oxolan-2-yl]methyl]-5,6-diphenylfuro[2,3-d]pyrimidin-4-amine Chemical compound C([C@H]1OCCC1)NC(C1=2)=NC=NC=2OC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 XNFHHOXCDUAYSR-SFHVURJKSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
Definitions
- the present invention relates in general to semiconductor technology, and more specifically to containers which store a reticle. Even more specifically, the invention relates to a method for reducing mask precipitate defects.
- a square cross-sectional or rectangular cross-sectional container made of a plastic material is frequently used to transport articles. These articles may include silicon wafers, reticles or other substrates used for building integrated circuit (IC) devices.
- a reticle is a transparent ceramic substrate that is coated with a metallic layer forming a pattern for an electronic circuit. It is generally used in an imaging step during a photolithographic process wherein a pattern of a circuit is reproduced on the surface of an electronic substrate, i.e., on a wafer surface.
- Reticle containers have been known in the art.
- U.S. Pat. No. 4,719,705 an adjustable transporter for moving a reticle past an optical slit as a step in the production of semiconductor wafers is disclosed.
- the reticle stage rides along a pair of optically flat planar, intersecting, bearing surfaces supported by air bearings on each bearing surface. Pressurized air and vacuum may be simultaneously employed to effect substantially friction-free motion while preventing displacement from the bearing surfaces. Axial adjustments on each air bearing permit precise adjustment of the reticle stage and reticle.
- U.S. Pat. No. 4,842,136 is a dust-proof container for keeping a mask or reticle usable to transfer a pattern onto a semiconductor wafer for the manufacture of integrated circuits.
- the container includes a casing, within which supporting pins for supporting the mask or reticle are formed. Also in the casing, there are provided leaf springs for pressing the mask or reticle toward the supporting pins, and a releasing mechanism for releasing the reticle pressing force of the leaf springs.
- the releasing mechanism is responsive to a non-mechanical signal such as an electric signal to release the reticle pressing force.
- a shape memory alloy may be usable in the releasing mechanism.
- An opening/closing mechanism is provided to open/close a door, which is operable to cover an opening formed in the casing for the insertion and extraction of the mask or reticle.
- a shape memory alloy may be used in the opening/closing mechanism.
- a container for a plate-like article such as a reticle, includes a bottom member having a holding portion for holding the article in a substantially laid-down state; an upper member to be mated with the bottom member to define a space above the upper surface of the article; a pressing member for resiliently pressing in the space the article against the holding portion; and a fixing portion having an engaging member supported by the upper member and engageable with an end portion of the bottom member.
- the engaging member is effective to prevent an upward opening motion of the upper member due to a reaction force of the pressing member.
- a releasing portion is partially projectable into the fixing portion to press the same in the same direction as the direction of the opening motion of the upper member to thereby release the engaging member.
- U.S. Pat. No. 5,727,685 discloses a cassette or box for containing and holding a planar substrate such as a reticle.
- the box has a clamp bar coupled to corner supports by a spring or flexure and a linkage.
- the clamp bar is pivotally attached to bottom corner supports and a spring or flexure and linked to a top corner support, such that movement of the load bar causes the corner supports to pivot away from a reticle being held only at the comers.
- An elevation bar is also used to preposition the reticle in one direction.
- a reticle support mechanism is disclosed in U.S. Pat. No. 6,216,873.
- a reticle may be quickly and easily located and removed, and it is capable of securely supporting a reticle for storage and/or transport.
- An embodiment of the mechanism includes a pair of reticle supports mounted to a door of a container, and a pair of reticle retainers mounted to a shell of the container. When the container shell is coupled with the container door, sections of the reticle support and reticle retainer engage chamfered edges of the reticle and sandwich the reticle in a secure position within the container. As a result of engaging the reticle at its chamfered edges, potentially harmful contact with the upper and lower surfaces and vertical edges of the reticle is avoided.
- the container includes a container body constructed of a top lid, a bottom lid and four side panels forming a cavity therein, wherein one of the four side panels allows access to the cavity.
- the top lid, the bottom lid and the four side panels are made of an electrically insulating material, at least four support means mounted on the bottom lid in a spaced-apart relationship for supporting the insulating article thereon.
- An electrically conductive layer substantially overlaps the bottom lid so as to sufficiently shield the insulating article when positioned on the support means.
- the container may further include a metallic knob situated in a top lid.
- the electrically conductive layer can be formed of a metallic material, or may be formed of a metallic material that does not produce contaminating particles, or may be formed of stainless steel.
- the electrically conductive layer may also be encapsulated as an insert in the bottom lid.
- the top lid, bottom lid and four sidewall panels may be formed of a substantially transparent plastic material.
- the container may further include an insert of an electrically conductive layer molded in the bottom lid.
- the container may further include a metal shield shaped substantially similar to the top lid for positioning between the top lid and the insulating article to form a metal enclosure with the electrically conductive layer on the bottom lid surrounding the insulating article.
- the container which is equipped with a metal shield surrounding an insulating article, includes a container body constructed of a top lid, a bottom lid and four side panels forming a cavity therein.
- One of the four sidewall panels allows access to the cavity, while the top lid, bottom lid and four side panels may be formed of an electrically insulating material.
- the metal layer substantially covers the bottom lid and a cup-shaped metal enclosure positioned between the top lid and the insulating article cooperating with the metal layer on the bottom lid to substantially surround the insulating article.
- the metal layer and the cup-shaped metal enclosure may be formed of a contaminating particle-free metallic material.
- the container may further include a metal knob situated in the top lid.
- the metal layer may be formed as an insert in the bottom lid.
- the container may further include a second metal layer being molded as an insert in the bottom lid.
- the top lid, bottom lid and four side panels may be formed of a substantially transparent plastic material.
- the metal layer and the cup-shaped metal enclosure may be formed of stainless steel.
- the insulating article positioned on the plurality of support means may be a chrome coated quartz reticle plate.
- the electrostatic discharge-free container may be a reticle pod for storing chrome coated reticle plate.
- a container includes a metal enclosure for shielding an insulating article therein including a container body constructed of a top lid, a bottom lid and four side panels forming a cavity therein wherein one of the four side panels allows access to the cavity.
- the top lid, bottom lid and four side panels are formed of an electrically insulating material.
- the container may further include a second metal layer molded as an insert in the bottom lid.
- the metal layer and the cup-shaped metal enclosure may be fabricated of a contaminating particle-free metallic material.
- a reticle SMIF pod for in situ orientation is disclosed in U.S. Pat. No. 6,338,409 issued to Neary et al.
- the SMIF pod comprises a pod door.
- a pod cover is removably receivable on the door to define an interior space.
- a nest assembly has a plate resting on the pod door in the interior space and a core extending downwardly from the plate through an opening in the pod door.
- the plate is rotatably mounted on the pod door to selectively orient a workpiece, supported on the plate, in use.
- Alignment means align the plate relative to the pod door in one of plural orthogonal positions.
- the pod door comprises an upper door plate and a lower door plate and a latch mechanism disposed there between for latching the pod door to the pod cover.
- the alignment means comprises an alignment leg extending downwardly from the plate and plural spaced apart bores in the pod door for selectively receiving the alignment leg.
- the alignment means may comprise plural alignment legs extending downwardly from the plate and plural spaced apart bores in the pod door each for receiving one of the alignment legs.
- the alignment means comprises a locking tab extending radially from the core and plural seats orthogonally positioned in the door for selectively receiving the locking tab.
- the alignment means may comprise plural orthogonally spaced locking tabs extending radially from the core and plural seats orthogonally positioned in the door each for receiving one of the locking tabs.
- Means is provided for biasing the plate downwardly against the pod door.
- the nest assembly comprises a flange on the core.
- the biasing means comprises a retaining spring disposed between the pod door and the flange.
- the pod door comprises an upper door plate and a lower door plate and the flange is sandwiched between the upper door plate and the lower door plate.
- the core includes a downwardly facing groove for actuation by an external engagement device to effect rotation of the plate.
- FIG. 1 a conventional pod known to the applicants, which is used for transporting reticles, is shown in FIG. 1 .
- the pod 10 comprises an upper cover 12 with a handle 14 affixed to the cover for easy carrying of the pod by an operator, an upper liner 16 , a support 18 for a reticle base 20 , a lower liner 22 , and a lower cover 24 .
- the configuration of the support 18 relative to the reticle, and especially with regard to the reticle chrome coating is such that during transportation the chrome coating can be scratched by the support thus releasing chrome particles, which is highly undesirable.
- the present invention relates to a container for transporting a reticle during a semiconductor manufacturing process, the reticle comprising a base made of isolating material and a metallic layer deposited onto a surface of the base, and specifically relates to a method for isolating environmental contaminants, which comprises filling the container with inert gas, thereby purging said environmental contaminants.
- inert gas is used to purge the environment of the container (e.g., a reticle pod) directly, so as to isolate environmental contaminants.
- FIG. 1 is an exploded perspective view of a conventional reticle pod.
- the present invention relates to a container for transporting a reticle during a semiconductor manufacturing process, the reticle comprising a base made of isolating material and a metallic layer deposited onto a surface of the base, and specifically relates to a method for isolating environmental contaminants which comprises filling the container with inert gas, thereby purging said environmental contaminants before the reticle is ready for exposure.
- a method for isolating environmental contaminants which comprises filling the container with inert gas, thereby purging said environmental contaminants before the reticle is ready for exposure.
- the container may be, e.g., a reticle pod, reticle stocker or internal reticle library of a scanner (reticle library).
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Library & Information Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
In a container for transporting a reticle during a semiconductor manufacturing process, the reticle including a base made of isolating material and a metallic layer deposited onto a surface of the base, disclosed is a method for isolating and removing environmental contaminants which includes filling the container with inert gas, thereby purging the environmental contaminants, as well as inlet and outlet features to allow for the purging of clean inert gas and impurities.
Description
- The present invention relates in general to semiconductor technology, and more specifically to containers which store a reticle. Even more specifically, the invention relates to a method for reducing mask precipitate defects.
- In the semiconductor fabrication process, a square cross-sectional or rectangular cross-sectional container made of a plastic material is frequently used to transport articles. These articles may include silicon wafers, reticles or other substrates used for building integrated circuit (IC) devices. A reticle is a transparent ceramic substrate that is coated with a metallic layer forming a pattern for an electronic circuit. It is generally used in an imaging step during a photolithographic process wherein a pattern of a circuit is reproduced on the surface of an electronic substrate, i.e., on a wafer surface.
- Reticle containers have been known in the art. In U.S. Pat. No. 4,719,705, an adjustable transporter for moving a reticle past an optical slit as a step in the production of semiconductor wafers is disclosed. The reticle stage rides along a pair of optically flat planar, intersecting, bearing surfaces supported by air bearings on each bearing surface. Pressurized air and vacuum may be simultaneously employed to effect substantially friction-free motion while preventing displacement from the bearing surfaces. Axial adjustments on each air bearing permit precise adjustment of the reticle stage and reticle.
- In U.S. Pat. No. 4,842,136 is a dust-proof container for keeping a mask or reticle usable to transfer a pattern onto a semiconductor wafer for the manufacture of integrated circuits. The container includes a casing, within which supporting pins for supporting the mask or reticle are formed. Also in the casing, there are provided leaf springs for pressing the mask or reticle toward the supporting pins, and a releasing mechanism for releasing the reticle pressing force of the leaf springs. The releasing mechanism is responsive to a non-mechanical signal such as an electric signal to release the reticle pressing force. A shape memory alloy may be usable in the releasing mechanism. An opening/closing mechanism is provided to open/close a door, which is operable to cover an opening formed in the casing for the insertion and extraction of the mask or reticle. A shape memory alloy may be used in the opening/closing mechanism. With the dust-proof container of the invention, the necessity of use of a mechanical-signal transmitting system such as a linkage or otherwise in the casing is avoided. This effectively prevents creation of dust or foreign particles within the casing due to mechanical friction contact. Also, the possibility of adhesion of dust or foreign particles to the mask or reticle contained in the container can be minimized.
- In U.S. Pat. No. 5,314,068, a container for a plate-like article, such as a reticle, includes a bottom member having a holding portion for holding the article in a substantially laid-down state; an upper member to be mated with the bottom member to define a space above the upper surface of the article; a pressing member for resiliently pressing in the space the article against the holding portion; and a fixing portion having an engaging member supported by the upper member and engageable with an end portion of the bottom member. The engaging member is effective to prevent an upward opening motion of the upper member due to a reaction force of the pressing member. In addition, a releasing portion is partially projectable into the fixing portion to press the same in the same direction as the direction of the opening motion of the upper member to thereby release the engaging member.
- U.S. Pat. No. 5,727,685 discloses a cassette or box for containing and holding a planar substrate such as a reticle. The box has a clamp bar coupled to corner supports by a spring or flexure and a linkage. The clamp bar is pivotally attached to bottom corner supports and a spring or flexure and linked to a top corner support, such that movement of the load bar causes the corner supports to pivot away from a reticle being held only at the comers. An elevation bar is also used to preposition the reticle in one direction.
- A reticle support mechanism is disclosed in U.S. Pat. No. 6,216,873. In the mechanism, a reticle may be quickly and easily located and removed, and it is capable of securely supporting a reticle for storage and/or transport. An embodiment of the mechanism includes a pair of reticle supports mounted to a door of a container, and a pair of reticle retainers mounted to a shell of the container. When the container shell is coupled with the container door, sections of the reticle support and reticle retainer engage chamfered edges of the reticle and sandwich the reticle in a secure position within the container. As a result of engaging the reticle at its chamfered edges, potentially harmful contact with the upper and lower surfaces and vertical edges of the reticle is avoided.
- A reticle container equipped with a metal shield is disclosed in U.S. Pat. No. 6,247,599. In a preferred embodiment, the container includes a container body constructed of a top lid, a bottom lid and four side panels forming a cavity therein, wherein one of the four side panels allows access to the cavity. The top lid, the bottom lid and the four side panels are made of an electrically insulating material, at least four support means mounted on the bottom lid in a spaced-apart relationship for supporting the insulating article thereon. An electrically conductive layer substantially overlaps the bottom lid so as to sufficiently shield the insulating article when positioned on the support means.
- The container may further include a metallic knob situated in a top lid. The electrically conductive layer can be formed of a metallic material, or may be formed of a metallic material that does not produce contaminating particles, or may be formed of stainless steel. The electrically conductive layer may also be encapsulated as an insert in the bottom lid. The top lid, bottom lid and four sidewall panels may be formed of a substantially transparent plastic material. The container may further include an insert of an electrically conductive layer molded in the bottom lid. The container may further include a metal shield shaped substantially similar to the top lid for positioning between the top lid and the insulating article to form a metal enclosure with the electrically conductive layer on the bottom lid surrounding the insulating article.
- In another preferred embodiment, the container, which is equipped with a metal shield surrounding an insulating article, includes a container body constructed of a top lid, a bottom lid and four side panels forming a cavity therein. One of the four sidewall panels allows access to the cavity, while the top lid, bottom lid and four side panels may be formed of an electrically insulating material. There is a plurality of support means on the bottom lid for supporting the insulating article. The metal layer substantially covers the bottom lid and a cup-shaped metal enclosure positioned between the top lid and the insulating article cooperating with the metal layer on the bottom lid to substantially surround the insulating article. In the container, the metal layer and the cup-shaped metal enclosure may be formed of a contaminating particle-free metallic material. The container may further include a metal knob situated in the top lid. The metal layer may be formed as an insert in the bottom lid. The container may further include a second metal layer being molded as an insert in the bottom lid. The top lid, bottom lid and four side panels may be formed of a substantially transparent plastic material. The metal layer and the cup-shaped metal enclosure may be formed of stainless steel. The insulating article positioned on the plurality of support means may be a chrome coated quartz reticle plate.
- The electrostatic discharge-free container may be a reticle pod for storing chrome coated reticle plate. In still another preferred embodiment, a container includes a metal enclosure for shielding an insulating article therein including a container body constructed of a top lid, a bottom lid and four side panels forming a cavity therein wherein one of the four side panels allows access to the cavity. The top lid, bottom lid and four side panels are formed of an electrically insulating material. There is a plurality of support means on the bottom lid for supporting the insulating article, a metal layer molded as an insert substantially overlaps the bottom lid, a cup-shaped metal enclosure positioned juxtaposed to the top lid cooperating with the metal layer to substantially surround the insulating article, and a metal knob situated in the top lid. The container may further include a second metal layer molded as an insert in the bottom lid. The metal layer and the cup-shaped metal enclosure may be fabricated of a contaminating particle-free metallic material.
- A reticle SMIF pod for in situ orientation is disclosed in U.S. Pat. No. 6,338,409 issued to Neary et al. The SMIF pod comprises a pod door. A pod cover is removably receivable on the door to define an interior space. A nest assembly has a plate resting on the pod door in the interior space and a core extending downwardly from the plate through an opening in the pod door. The plate is rotatably mounted on the pod door to selectively orient a workpiece, supported on the plate, in use.
- Alignment means align the plate relative to the pod door in one of plural orthogonal positions. The pod door comprises an upper door plate and a lower door plate and a latch mechanism disposed there between for latching the pod door to the pod cover. The alignment means comprises an alignment leg extending downwardly from the plate and plural spaced apart bores in the pod door for selectively receiving the alignment leg. The alignment means may comprise plural alignment legs extending downwardly from the plate and plural spaced apart bores in the pod door each for receiving one of the alignment legs. The alignment means comprises a locking tab extending radially from the core and plural seats orthogonally positioned in the door for selectively receiving the locking tab. The alignment means may comprise plural orthogonally spaced locking tabs extending radially from the core and plural seats orthogonally positioned in the door each for receiving one of the locking tabs. Means is provided for biasing the plate downwardly against the pod door. The nest assembly comprises a flange on the core. The biasing means comprises a retaining spring disposed between the pod door and the flange. The pod door comprises an upper door plate and a lower door plate and the flange is sandwiched between the upper door plate and the lower door plate. The core includes a downwardly facing groove for actuation by an external engagement device to effect rotation of the plate.
- Also, a conventional pod known to the applicants, which is used for transporting reticles, is shown in
FIG. 1 . Thepod 10 comprises anupper cover 12 with ahandle 14 affixed to the cover for easy carrying of the pod by an operator, anupper liner 16, asupport 18 for areticle base 20, alower liner 22, and alower cover 24. The configuration of thesupport 18 relative to the reticle, and especially with regard to the reticle chrome coating (not shown inFIG. 1 ) is such that during transportation the chrome coating can be scratched by the support thus releasing chrome particles, which is highly undesirable. - Problems associated by previous methods include an inability to fill with inert gas to the reticle pod in
FIG. 1 ; current 0.13 and 0.09 193 nm masks suffer from potential contamination; adverse effects on product yield and photomask productivity; a decrease in mask lifetime; mask CD loss after mask cleaning; and adverse effects on the photomask rework rate. These problems are overcome by the present invention. - The present invention relates to a container for transporting a reticle during a semiconductor manufacturing process, the reticle comprising a base made of isolating material and a metallic layer deposited onto a surface of the base, and specifically relates to a method for isolating environmental contaminants, which comprises filling the container with inert gas, thereby purging said environmental contaminants. By the method of the present invention, inert gas is used to purge the environment of the container (e.g., a reticle pod) directly, so as to isolate environmental contaminants.
- The above-identified and other objects, features, and advantages of the present invention will become apparent from the ensuing detailed description and the appended drawings, in which:
-
FIG. 1 is an exploded perspective view of a conventional reticle pod. - The present invention relates to a container for transporting a reticle during a semiconductor manufacturing process, the reticle comprising a base made of isolating material and a metallic layer deposited onto a surface of the base, and specifically relates to a method for isolating environmental contaminants which comprises filling the container with inert gas, thereby purging said environmental contaminants before the reticle is ready for exposure. By the method of the present invention, mask repeating defects are reduced, the lifetime of a 193 nm mask is increased, an increase in photo-productivity results, the frequency of mask cleaning is reduced, and the photo re-work rate is decreased. The container may be, e.g., a reticle pod, reticle stocker or internal reticle library of a scanner (reticle library).
- In the testing of the present invention, 193 nm mask precipitate defects were resolved. Table I, below, shows environment/reticle pod/reticle detection results, using a Sunway AIM-100 SO2 detector:
TABLE I Environment/reticle pod/reticle detection results, using a Sunway AIM-100 SO2 detector Result (concentration = Area Detector location ng/cm2/day) Mask Room Mini-environment 12 (without mask in pod) Mini-environment (with 15 mask in pod) Open environment 25 Pod with N2 purge: 1 hour 3 Scanner around Mini-environment 13 (without mask in pod) Open environment 25 - While the present invention has been described with respect to particular embodiments thereof, it is apparent that numerous other forms and modifications of the invention will be obvious to those skilled in the art. The appended claims and this invention generally should be construed to cover all such obvious forms and modifications, which are within the true spirit and scope of the present invention.
Claims (18)
1. In a container for transporting a reticle during a semiconductor manufacturing process, the reticle comprising a base made of isolating material and a metallic layer deposited onto a surface of the base, a method for removing environmental contaminants which comprises filling the container with inert gas, thereby purging said environmental contaminants.
2. The method as recited in claim 1 , wherein mask repeating defects are reduced by purging said environmental contaminants.
3. The method as recited in claim 1 , wherein the lifetime of a 193 nm mask is increased by purging said environmental contaminants.
4. The method as recited in claim 1 , wherein photo-productivity is increased by purging said environmental contaminants.
5. The method as recited in claim 1 , wherein the frequency of mask cleaning is reduced by purging said environmental contaminants.
6. The method as recited in claim 1 , wherein the photo re-work rate is decreased by purging said environmental contaminants.
7. The method as recited in claim 1 , wherein the container is a reticle pod.
8. The method as recited in claim 1 , wherein the container is a reticle stocker.
9. The method as recited in claim 1 , wherein the container is a reticle library.
10. In a container for transporting a reticle during a semiconductor manufacturing process, the reticle comprising a base made of isolating material and a metallic layer deposited onto a surface of the base, a method for removing reactants in the container which comprises filling the container with inert gas, thereby purging said reactants.
11. The method as recited in claim 10 , wherein mask repeating defects are reduced by purging said reactants.
12. The method as recited in claim 10 , wherein the lifetime of a 193 nm mask is increased by purging said reactants.
13. The method as recited in claim 10 , wherein photo-productivity is increased by purging said reactants.
14. The method as recited in claim 10 , wherein the frequency of mask cleaning is reduced by purging said reactants.
15. The method as recited in claim 10 , wherein the photo re-work rate is decreased by purging said reactants.
16. The method as recited in claim 10 , wherein the container is a reticle pod.
17. The method as recited in claim 10 , wherein the container is a reticle stocker.
18. The method as recited in claim 10 , wherein the container is a reticle library.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/079,617 US20060201848A1 (en) | 2005-03-14 | 2005-03-14 | Method for reducing mask precipitation defects |
| SG200508286A SG126020A1 (en) | 2005-03-14 | 2005-12-21 | Method for reducing mask precipitation defects |
| SG201001739-0A SG160394A1 (en) | 2005-03-14 | 2005-12-21 | Method for reducing mask precipitation defects |
| TW095108432A TWI288668B (en) | 2005-03-14 | 2006-03-13 | Method for reducing mask precipitation defects |
| CNA2006100648344A CN1983035A (en) | 2005-03-14 | 2006-03-14 | Methods for Reducing Reticle Deposition Defects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/079,617 US20060201848A1 (en) | 2005-03-14 | 2005-03-14 | Method for reducing mask precipitation defects |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20060201848A1 true US20060201848A1 (en) | 2006-09-14 |
Family
ID=36969685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/079,617 Abandoned US20060201848A1 (en) | 2005-03-14 | 2005-03-14 | Method for reducing mask precipitation defects |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060201848A1 (en) |
| CN (1) | CN1983035A (en) |
| SG (2) | SG126020A1 (en) |
| TW (1) | TWI288668B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050191563A1 (en) * | 2004-02-26 | 2005-09-01 | Yi-Ming Dai | Method and system for reducing and monitoring precipitated defects on masking reticles |
| US20080035237A1 (en) * | 2006-08-09 | 2008-02-14 | Gudeng Precision Industrial Co., Ltd. | Gas filling facility for photomask pod or the like |
| US20090231707A1 (en) * | 2006-09-19 | 2009-09-17 | Carl Zeiss Smt Ag | Optical arrangement, in particular projection exposure apparatus for euv lithography, as well as reflective optical element with reduced contamination |
| CN106206265A (en) * | 2015-05-28 | 2016-12-07 | 台湾积体电路制造股份有限公司 | Semiconductor device and method of forming the same |
| US11703754B2 (en) | 2020-05-14 | 2023-07-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Particle prevention method in reticle pod |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8215510B2 (en) * | 2008-03-24 | 2012-07-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photomask storage apparatus |
| CN106914454A (en) * | 2017-03-13 | 2017-07-04 | 上海华力微电子有限公司 | A kind of device and sweep-out method for removing reticle surface particulate pollutant |
| CN110899246A (en) * | 2018-09-14 | 2020-03-24 | 长鑫存储技术有限公司 | Device and method for cleaning photomask defects |
| TWI779505B (en) * | 2020-05-14 | 2022-10-01 | 台灣積體電路製造股份有限公司 | Reticle pod and method for preventing reticle contamination |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719705A (en) * | 1986-06-24 | 1988-01-19 | The Perkin-Elmer Corporation | Reticle transporter |
| US4842136A (en) * | 1987-02-13 | 1989-06-27 | Canon Kabushiki Kaisha | Dust-proof container having improved construction for holding a reticle therein |
| US5314068A (en) * | 1991-07-12 | 1994-05-24 | Canon Kabushiki Kaisha | Container for a plate-like article |
| US5727685A (en) * | 1995-10-19 | 1998-03-17 | Svg Lithography Systems, Inc. | Reticle container with corner holding |
| US6196391B1 (en) * | 2000-01-20 | 2001-03-06 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container for insulating articles |
| US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
| US6247599B1 (en) * | 2000-01-14 | 2001-06-19 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container equipped with metal shield |
| US6338409B1 (en) * | 2000-04-13 | 2002-01-15 | International Business Machines Corporation | Reticle SMIF pod in situ orientation |
| US20020075469A1 (en) * | 2000-12-15 | 2002-06-20 | Nikon Corporation | Stage device and exposure apparatus and method |
| US20030045131A1 (en) * | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
| US20040005209A1 (en) * | 2002-07-05 | 2004-01-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reticle pod |
| US20070254217A1 (en) * | 2006-04-28 | 2007-11-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for solving mask precipitated defect issue |
| US7402362B2 (en) * | 2004-02-26 | 2008-07-22 | Taiwan Semiconductor Manufacturing Co., Inc. | Method and system for reducing and monitoring precipitated defects on masking reticles |
-
2005
- 2005-03-14 US US11/079,617 patent/US20060201848A1/en not_active Abandoned
- 2005-12-21 SG SG200508286A patent/SG126020A1/en unknown
- 2005-12-21 SG SG201001739-0A patent/SG160394A1/en unknown
-
2006
- 2006-03-13 TW TW095108432A patent/TWI288668B/en active
- 2006-03-14 CN CNA2006100648344A patent/CN1983035A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719705A (en) * | 1986-06-24 | 1988-01-19 | The Perkin-Elmer Corporation | Reticle transporter |
| US4842136A (en) * | 1987-02-13 | 1989-06-27 | Canon Kabushiki Kaisha | Dust-proof container having improved construction for holding a reticle therein |
| US5314068A (en) * | 1991-07-12 | 1994-05-24 | Canon Kabushiki Kaisha | Container for a plate-like article |
| US5727685A (en) * | 1995-10-19 | 1998-03-17 | Svg Lithography Systems, Inc. | Reticle container with corner holding |
| US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
| US6247599B1 (en) * | 2000-01-14 | 2001-06-19 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container equipped with metal shield |
| US6196391B1 (en) * | 2000-01-20 | 2001-03-06 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container for insulating articles |
| US6338409B1 (en) * | 2000-04-13 | 2002-01-15 | International Business Machines Corporation | Reticle SMIF pod in situ orientation |
| US20020075469A1 (en) * | 2000-12-15 | 2002-06-20 | Nikon Corporation | Stage device and exposure apparatus and method |
| US20030045131A1 (en) * | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
| US20040005209A1 (en) * | 2002-07-05 | 2004-01-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reticle pod |
| US7402362B2 (en) * | 2004-02-26 | 2008-07-22 | Taiwan Semiconductor Manufacturing Co., Inc. | Method and system for reducing and monitoring precipitated defects on masking reticles |
| US20070254217A1 (en) * | 2006-04-28 | 2007-11-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for solving mask precipitated defect issue |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050191563A1 (en) * | 2004-02-26 | 2005-09-01 | Yi-Ming Dai | Method and system for reducing and monitoring precipitated defects on masking reticles |
| US7402362B2 (en) * | 2004-02-26 | 2008-07-22 | Taiwan Semiconductor Manufacturing Co., Inc. | Method and system for reducing and monitoring precipitated defects on masking reticles |
| US20080035237A1 (en) * | 2006-08-09 | 2008-02-14 | Gudeng Precision Industrial Co., Ltd. | Gas filling facility for photomask pod or the like |
| US20090231707A1 (en) * | 2006-09-19 | 2009-09-17 | Carl Zeiss Smt Ag | Optical arrangement, in particular projection exposure apparatus for euv lithography, as well as reflective optical element with reduced contamination |
| US8382301B2 (en) | 2006-09-19 | 2013-02-26 | Carl Zeiss Smt Gmbh | Optical arrangement, in particular projection exposure apparatus for EUV lithography, as well as reflective optical element with reduced contamination |
| US8585224B2 (en) | 2006-09-19 | 2013-11-19 | Carl Zeiss Smt Gmbh | Optical arrangement, in particular projection exposure apparatus for EUV lithography, as well as reflective optical element with reduced contamination |
| CN106206265A (en) * | 2015-05-28 | 2016-12-07 | 台湾积体电路制造股份有限公司 | Semiconductor device and method of forming the same |
| US11703754B2 (en) | 2020-05-14 | 2023-07-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Particle prevention method in reticle pod |
Also Published As
| Publication number | Publication date |
|---|---|
| SG126020A1 (en) | 2006-10-30 |
| SG160394A1 (en) | 2010-04-29 |
| CN1983035A (en) | 2007-06-20 |
| TW200631682A (en) | 2006-09-16 |
| TWI288668B (en) | 2007-10-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TAIW Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, TING-YU;DAI, YI-MING;LIAO, CHI-HUNG;AND OTHERS;REEL/FRAME:016218/0237 Effective date: 20050215 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |