TW200631682A - Method for reducing mask precipitation defects - Google Patents

Method for reducing mask precipitation defects

Info

Publication number
TW200631682A
TW200631682A TW095108432A TW95108432A TW200631682A TW 200631682 A TW200631682 A TW 200631682A TW 095108432 A TW095108432 A TW 095108432A TW 95108432 A TW95108432 A TW 95108432A TW 200631682 A TW200631682 A TW 200631682A
Authority
TW
Taiwan
Prior art keywords
purging
container
inert gas
reducing mask
precipitation defects
Prior art date
Application number
TW095108432A
Other languages
Chinese (zh)
Other versions
TWI288668B (en
Inventor
Yi-Ming Dai
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200631682A publication Critical patent/TW200631682A/en
Application granted granted Critical
Publication of TWI288668B publication Critical patent/TWI288668B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Library & Information Science (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

In a container for transporting a reticle during a semiconductor manufacturing process, the reticle including the base made of isolating material and a metallic layer deposited onto a surface of the base, disclosed is a method for isolating and removing environmental contaminants which includes filling the container with inert gas, thereby purging the environmental contaminants, as well as inlet and outlet features to allow for the purging of clean inert gas and impurities.
TW095108432A 2005-03-14 2006-03-13 Method for reducing mask precipitation defects TWI288668B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/079,617 US20060201848A1 (en) 2005-03-14 2005-03-14 Method for reducing mask precipitation defects

Publications (2)

Publication Number Publication Date
TW200631682A true TW200631682A (en) 2006-09-16
TWI288668B TWI288668B (en) 2007-10-21

Family

ID=36969685

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108432A TWI288668B (en) 2005-03-14 2006-03-13 Method for reducing mask precipitation defects

Country Status (4)

Country Link
US (1) US20060201848A1 (en)
CN (1) CN1983035A (en)
SG (2) SG160394A1 (en)
TW (1) TWI288668B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI779505B (en) * 2020-05-14 2022-10-01 台灣積體電路製造股份有限公司 Reticle pod and method for preventing reticle contamination
US11703754B2 (en) 2020-05-14 2023-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Particle prevention method in reticle pod

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7402362B2 (en) * 2004-02-26 2008-07-22 Taiwan Semiconductor Manufacturing Co., Inc. Method and system for reducing and monitoring precipitated defects on masking reticles
TW200808628A (en) * 2006-08-09 2008-02-16 Gudeng Prec Ind Co Ltd Filling device of conveying box
DE102006044591A1 (en) * 2006-09-19 2008-04-03 Carl Zeiss Smt Ag Optical arrangement, in particular projection exposure apparatus for EUV lithography, as well as reflective optical element with reduced contamination
US8215510B2 (en) * 2008-03-24 2012-07-10 Taiwan Semiconductor Manufacturing Company, Ltd. Photomask storage apparatus
US9588417B2 (en) * 2015-05-28 2017-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Photomask pellicle
CN106914454A (en) * 2017-03-13 2017-07-04 上海华力微电子有限公司 A kind of device and sweep-out method for removing reticle surface particulate pollutant
CN110899246A (en) * 2018-09-14 2020-03-24 长鑫存储技术有限公司 Device and method for cleaning photomask defects

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719705A (en) * 1986-06-24 1988-01-19 The Perkin-Elmer Corporation Reticle transporter
US4842136A (en) * 1987-02-13 1989-06-27 Canon Kabushiki Kaisha Dust-proof container having improved construction for holding a reticle therein
JP3089590B2 (en) * 1991-07-12 2000-09-18 キヤノン株式会社 Plate-shaped container and lid opening device
US5727685A (en) * 1995-10-19 1998-03-17 Svg Lithography Systems, Inc. Reticle container with corner holding
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
US6247599B1 (en) * 2000-01-14 2001-06-19 Taiwan Semiconductor Manufacturing Company, Ltd Electrostatic discharge-free container equipped with metal shield
US6196391B1 (en) * 2000-01-20 2001-03-06 Taiwan Semiconductor Manufacturing Company, Ltd Electrostatic discharge-free container for insulating articles
US6338409B1 (en) * 2000-04-13 2002-01-15 International Business Machines Corporation Reticle SMIF pod in situ orientation
US6496248B2 (en) * 2000-12-15 2002-12-17 Nikon Corporation Stage device and exposure apparatus and method
US20030045098A1 (en) * 2001-08-31 2003-03-06 Applied Materials, Inc. Method and apparatus for processing a wafer
US6948619B2 (en) * 2002-07-05 2005-09-27 Taiwan Semiconductor Manufacturing Co., Ltd Reticle pod and reticle with cut areas
US7402362B2 (en) * 2004-02-26 2008-07-22 Taiwan Semiconductor Manufacturing Co., Inc. Method and system for reducing and monitoring precipitated defects on masking reticles
US7655363B2 (en) * 2006-04-28 2010-02-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for solving mask precipitated defect issue

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI779505B (en) * 2020-05-14 2022-10-01 台灣積體電路製造股份有限公司 Reticle pod and method for preventing reticle contamination
US11703754B2 (en) 2020-05-14 2023-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Particle prevention method in reticle pod

Also Published As

Publication number Publication date
TWI288668B (en) 2007-10-21
CN1983035A (en) 2007-06-20
SG160394A1 (en) 2010-04-29
SG126020A1 (en) 2006-10-30
US20060201848A1 (en) 2006-09-14

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