SG126020A1 - Method for reducing mask precipitation defects - Google Patents
Method for reducing mask precipitation defectsInfo
- Publication number
- SG126020A1 SG126020A1 SG200508286A SG200508286A SG126020A1 SG 126020 A1 SG126020 A1 SG 126020A1 SG 200508286 A SG200508286 A SG 200508286A SG 200508286 A SG200508286 A SG 200508286A SG 126020 A1 SG126020 A1 SG 126020A1
- Authority
- SG
- Singapore
- Prior art keywords
- reducing mask
- precipitation defects
- precipitation
- defects
- mask
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Library & Information Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/079,617 US20060201848A1 (en) | 2005-03-14 | 2005-03-14 | Method for reducing mask precipitation defects |
Publications (1)
Publication Number | Publication Date |
---|---|
SG126020A1 true SG126020A1 (en) | 2006-10-30 |
Family
ID=36969685
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG201001739-0A SG160394A1 (en) | 2005-03-14 | 2005-12-21 | Method for reducing mask precipitation defects |
SG200508286A SG126020A1 (en) | 2005-03-14 | 2005-12-21 | Method for reducing mask precipitation defects |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG201001739-0A SG160394A1 (en) | 2005-03-14 | 2005-12-21 | Method for reducing mask precipitation defects |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060201848A1 (en) |
CN (1) | CN1983035A (en) |
SG (2) | SG160394A1 (en) |
TW (1) | TWI288668B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7402362B2 (en) * | 2004-02-26 | 2008-07-22 | Taiwan Semiconductor Manufacturing Co., Inc. | Method and system for reducing and monitoring precipitated defects on masking reticles |
TW200808628A (en) * | 2006-08-09 | 2008-02-16 | Gudeng Prec Ind Co Ltd | Filling device of conveying box |
DE102006044591A1 (en) * | 2006-09-19 | 2008-04-03 | Carl Zeiss Smt Ag | Optical arrangement, in particular projection exposure apparatus for EUV lithography, as well as reflective optical element with reduced contamination |
US8215510B2 (en) | 2008-03-24 | 2012-07-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photomask storage apparatus |
US9588417B2 (en) * | 2015-05-28 | 2017-03-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photomask pellicle |
CN106914454A (en) * | 2017-03-13 | 2017-07-04 | 上海华力微电子有限公司 | A kind of device and sweep-out method for removing reticle surface particulate pollutant |
CN110899246A (en) * | 2018-09-14 | 2020-03-24 | 长鑫存储技术有限公司 | Device and method for cleaning photomask defects |
TWI779505B (en) * | 2020-05-14 | 2022-10-01 | 台灣積體電路製造股份有限公司 | Reticle pod and method for preventing reticle contamination |
US11703754B2 (en) | 2020-05-14 | 2023-07-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Particle prevention method in reticle pod |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4719705A (en) * | 1986-06-24 | 1988-01-19 | The Perkin-Elmer Corporation | Reticle transporter |
US4842136A (en) * | 1987-02-13 | 1989-06-27 | Canon Kabushiki Kaisha | Dust-proof container having improved construction for holding a reticle therein |
JP3089590B2 (en) * | 1991-07-12 | 2000-09-18 | キヤノン株式会社 | Plate-shaped container and lid opening device |
US5727685A (en) * | 1995-10-19 | 1998-03-17 | Svg Lithography Systems, Inc. | Reticle container with corner holding |
US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
US6247599B1 (en) * | 2000-01-14 | 2001-06-19 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container equipped with metal shield |
US6196391B1 (en) * | 2000-01-20 | 2001-03-06 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container for insulating articles |
US6338409B1 (en) * | 2000-04-13 | 2002-01-15 | International Business Machines Corporation | Reticle SMIF pod in situ orientation |
US6496248B2 (en) * | 2000-12-15 | 2002-12-17 | Nikon Corporation | Stage device and exposure apparatus and method |
US20030045098A1 (en) * | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
US6948619B2 (en) * | 2002-07-05 | 2005-09-27 | Taiwan Semiconductor Manufacturing Co., Ltd | Reticle pod and reticle with cut areas |
US7402362B2 (en) * | 2004-02-26 | 2008-07-22 | Taiwan Semiconductor Manufacturing Co., Inc. | Method and system for reducing and monitoring precipitated defects on masking reticles |
US7655363B2 (en) * | 2006-04-28 | 2010-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for solving mask precipitated defect issue |
-
2005
- 2005-03-14 US US11/079,617 patent/US20060201848A1/en not_active Abandoned
- 2005-12-21 SG SG201001739-0A patent/SG160394A1/en unknown
- 2005-12-21 SG SG200508286A patent/SG126020A1/en unknown
-
2006
- 2006-03-13 TW TW095108432A patent/TWI288668B/en active
- 2006-03-14 CN CNA2006100648344A patent/CN1983035A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
SG160394A1 (en) | 2010-04-29 |
TW200631682A (en) | 2006-09-16 |
US20060201848A1 (en) | 2006-09-14 |
CN1983035A (en) | 2007-06-20 |
TWI288668B (en) | 2007-10-21 |
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