DE69627624D1 - Lichtquelle und optisches Abtastgerät - Google Patents

Lichtquelle und optisches Abtastgerät

Info

Publication number
DE69627624D1
DE69627624D1 DE69627624T DE69627624T DE69627624D1 DE 69627624 D1 DE69627624 D1 DE 69627624D1 DE 69627624 T DE69627624 T DE 69627624T DE 69627624 T DE69627624 T DE 69627624T DE 69627624 D1 DE69627624 D1 DE 69627624D1
Authority
DE
Germany
Prior art keywords
light source
optical scanner
scanner
optical
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69627624T
Other languages
English (en)
Other versions
DE69627624T2 (de
Inventor
Hyun-Kuk Shin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qiang Technologies LLC
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of DE69627624D1 publication Critical patent/DE69627624D1/de
Publication of DE69627624T2 publication Critical patent/DE69627624T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/08—Disposition or mounting of heads or light sources relatively to record carriers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/126—Circuits, methods or arrangements for laser control or stabilisation
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/127—Lasers; Multiple laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
DE69627624T 1996-01-23 1996-10-24 Lichtquelle und optisches Abtastgerät Expired - Lifetime DE69627624T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960001396A KR100269710B1 (ko) 1996-01-23 1996-01-23 광출력장치 및 이를 채용한 광픽업장치

Publications (2)

Publication Number Publication Date
DE69627624D1 true DE69627624D1 (de) 2003-05-28
DE69627624T2 DE69627624T2 (de) 2003-10-16

Family

ID=19449940

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69627624T Expired - Lifetime DE69627624T2 (de) 1996-01-23 1996-10-24 Lichtquelle und optisches Abtastgerät

Country Status (7)

Country Link
US (1) US5801402A (de)
EP (1) EP0786839B1 (de)
JP (1) JPH09198707A (de)
KR (1) KR100269710B1 (de)
CN (1) CN1073734C (de)
DE (1) DE69627624T2 (de)
MY (1) MY120415A (de)

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US6909111B2 (en) * 2000-12-28 2005-06-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a light emitting device and thin film forming apparatus
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US7061949B1 (en) * 2002-08-16 2006-06-13 Jds Uniphase Corporation Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
JP4151355B2 (ja) * 2002-08-30 2008-09-17 住友電気工業株式会社 発光モジュール
KR100480623B1 (ko) * 2002-10-18 2005-03-31 삼성전자주식회사 광 노이즈를 차단한 광픽업 장치 및 이를 채용한 광기록및/또는 재생장치
KR100493035B1 (ko) * 2002-11-26 2005-06-07 삼성전자주식회사 광픽업용 레이저 다이오드
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DE102004042670B4 (de) * 2003-09-02 2018-07-12 CiS Forschungsinstitut für Mikrosensorik GmbH Mikrooptisches Strahler- und Empfängersystem
US6982437B2 (en) * 2003-09-19 2006-01-03 Agilent Technologies, Inc. Surface emitting laser package having integrated optical element and alignment post
US20050063648A1 (en) * 2003-09-19 2005-03-24 Wilson Robert Edward Alignment post for optical subassemblies made with cylindrical rods, tubes, spheres, or similar features
US7520679B2 (en) * 2003-09-19 2009-04-21 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical device package with turning mirror and alignment post
US20050063431A1 (en) 2003-09-19 2005-03-24 Gallup Kendra J. Integrated optics and electronics
US6998691B2 (en) * 2003-09-19 2006-02-14 Agilent Technologies, Inc. Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
US6953990B2 (en) * 2003-09-19 2005-10-11 Agilent Technologies, Inc. Wafer-level packaging of optoelectronic devices
JP4412142B2 (ja) * 2003-12-19 2010-02-10 Ｔｄｋ株式会社 光ヘッド
JP2005216458A (ja) * 2004-02-02 2005-08-11 Sharp Corp 光ピックアップ装置
US20050213995A1 (en) * 2004-03-26 2005-09-29 Myunghee Lee Low power and low jitter optical receiver for fiber optic communication link
US20060043278A1 (en) * 2004-08-30 2006-03-02 Honeywell International Inc. VCSEL pin sensor
US7253386B2 (en) * 2005-12-12 2007-08-07 Xerox Corporation Method and apparatus for monitoring and controlling laser intensity in a ROS scanning system
JP2008244101A (ja) * 2007-03-27 2008-10-09 Canon Inc モニタリング方法およびモニタリング機能を有するｖｃｓｅｌアレイ
FR2915029A1 (fr) * 2007-04-13 2008-10-17 Commissariat Energie Atomique Dispositif optoelectronique compact incluant au moins un laser emettant par la surface
CN101488059B (zh) * 2008-01-18 2010-09-29 世纪民生科技股份有限公司 光学导航传感器及其光学导航装置
JP2012038789A (ja) * 2010-08-04 2012-02-23 Alps Electric Co Ltd 半導体レーザ装置
US8592739B2 (en) * 2010-11-02 2013-11-26 Microsoft Corporation Detection of configuration changes of an optical element in an illumination system
JP2012151441A (ja) 2010-12-28 2012-08-09 Ricoh Co Ltd 光デバイス、光走査装置及び画像形成装置
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DE102013202170B4 (de) * 2013-02-11 2023-03-09 Robert Bosch Gmbh Optische Sensorchipvorrichtung und entsprechendes Herstellungsverfahren
US9547142B1 (en) 2015-09-16 2017-01-17 Sae Magnetics (H.K.) Ltd. Optical transmitter module
JP6749807B2 (ja) * 2016-07-26 2020-09-02 新光電気工業株式会社 光半導体装置
CN109195246B (zh) * 2018-07-25 2021-01-29 北京小米移动软件有限公司 光线发射控制方法、装置和存储介质
CN109301685A (zh) * 2018-08-17 2019-02-01 北京小米移动软件有限公司 激光器的功率控制方法及激光器
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Also Published As

Publication number Publication date
MY120415A (en) 2005-10-31
CN1159048A (zh) 1997-09-10
KR100269710B1 (ko) 2000-10-16
JPH09198707A (ja) 1997-07-31
EP0786839B1 (de) 2003-04-23
DE69627624T2 (de) 2003-10-16
EP0786839A1 (de) 1997-07-30
KR970060089A (ko) 1997-08-12
US5801402A (en) 1998-09-01
CN1073734C (zh) 2001-10-24

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Legal Events

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8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: QIANG TECHNOLOGIES,LLC, WILMINGTON, DEL., US