DE69624822D1 - Vorrichtung und verfahren zum drucken - Google Patents
Vorrichtung und verfahren zum druckenInfo
- Publication number
- DE69624822D1 DE69624822D1 DE69624822T DE69624822T DE69624822D1 DE 69624822 D1 DE69624822 D1 DE 69624822D1 DE 69624822 T DE69624822 T DE 69624822T DE 69624822 T DE69624822 T DE 69624822T DE 69624822 D1 DE69624822 D1 DE 69624822D1
- Authority
- DE
- Germany
- Prior art keywords
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0804—Machines for printing sheets
- B41F15/0813—Machines for printing sheets with flat screens
- B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17579595A JP3431729B2 (ja) | 1995-07-12 | 1995-07-12 | 回路基板の製造方法及び製造装置 |
PCT/JP1996/001929 WO1997002953A1 (fr) | 1995-07-12 | 1996-07-11 | Procede et appareil d'impression |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69624822D1 true DE69624822D1 (de) | 2002-12-19 |
Family
ID=16002390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69624822T Expired - Lifetime DE69624822D1 (de) | 1995-07-12 | 1996-07-11 | Vorrichtung und verfahren zum drucken |
Country Status (6)
Country | Link |
---|---|
US (2) | US6135024A (de) |
EP (1) | EP0842772B8 (de) |
JP (1) | JP3431729B2 (de) |
KR (1) | KR100264411B1 (de) |
DE (1) | DE69624822D1 (de) |
WO (1) | WO1997002953A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3431729B2 (ja) * | 1995-07-12 | 2003-07-28 | 松下電器産業株式会社 | 回路基板の製造方法及び製造装置 |
JP2000263752A (ja) * | 1999-01-11 | 2000-09-26 | Micro Tekku Kk | スクリーン印刷機及びスクリーン印刷方法 |
JP3494055B2 (ja) * | 1999-01-21 | 2004-02-03 | 松下電器産業株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
DE10196259T1 (de) * | 2000-05-31 | 2003-05-15 | Honeywell Int Inc | Füllverfahren |
GB2367034B (en) * | 2000-07-18 | 2004-06-09 | Matsushita Electric Ind Co Ltd | Screen printing apparatus and method of the same |
US6386435B1 (en) * | 2000-08-11 | 2002-05-14 | Emc Corporation | Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shape |
JP2002307652A (ja) * | 2001-04-12 | 2002-10-23 | Matsushita Electric Ind Co Ltd | スクリーン印刷装置 |
US7084353B1 (en) | 2002-12-11 | 2006-08-01 | Emc Corporation | Techniques for mounting a circuit board component to a circuit board |
SG119230A1 (en) * | 2004-07-29 | 2006-02-28 | Micron Technology Inc | Interposer including at least one passive element at least partially defined by a recess formed therein method of manufacture system including same and wafer-scale interposer |
US7410090B2 (en) * | 2006-04-21 | 2008-08-12 | International Business Machines Corporation | Conductive bonding material fill techniques |
US9314864B2 (en) | 2007-07-09 | 2016-04-19 | International Business Machines Corporation | C4NP compliant solder fill head seals |
US8442069B2 (en) | 2008-04-14 | 2013-05-14 | Qualcomm Incorporated | System and method to enable uplink control for restricted association networks |
JP6340588B2 (ja) * | 2014-05-12 | 2018-06-13 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置 |
CN107567189A (zh) * | 2017-08-31 | 2018-01-09 | 惠东县建祥电子科技有限公司 | 一种改善pcb板蓝胶油墨封孔的方法 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1964182B2 (de) * | 1969-12-22 | 1974-03-21 | Mitter & Co, 4815 Schloss Holte | Rakelvorrichtung zur Auftragung flüssiger oder pastöser Medien auf Warenbahnen od. dgl., insbesondere für Filmdruckmaschinen |
US3754979A (en) * | 1970-05-01 | 1973-08-28 | Du Pont | Line resolution in screen printing |
US3902414A (en) * | 1970-10-01 | 1975-09-02 | Peter Zimmer | Screen printer using vibration to improve ink penetration |
US3877371A (en) * | 1972-09-28 | 1975-04-15 | Precision Screen Machines | Screen printing lint removing apparatus and method |
US4051777A (en) * | 1974-10-29 | 1977-10-04 | James A. Black | Stencilling apparatus with flow through print and flow action |
US4137842A (en) * | 1977-03-02 | 1979-02-06 | Miller Screen & Design, Inc. | Method and apparatus for applying decorative imprints to the surfaces of plastic workpieces |
DE2901830A1 (de) * | 1978-02-06 | 1979-08-09 | Buser Ag Maschf Fritz | Verfahren und vorrichtung zur steuerung des farbmengenauftrags auf eine warenbahn einer siebdruckmaschine |
US4179797A (en) * | 1978-03-23 | 1979-12-25 | Xerox Corporation | Method of making a resistor array |
GB2110662B (en) * | 1981-12-04 | 1985-03-20 | Cookson Group Plc | Improvements relating to the production of vitreous enamelled substrates |
EP0167906B1 (de) * | 1984-07-07 | 1990-12-05 | Rudolf August Kürten | Druckkopf für eine Siebdruckmaschine |
SE8501667L (sv) | 1985-04-03 | 1986-09-08 | Scandiafelt Ab | Maskin for formering, pressning och torkning av tunna pappersbanor |
JPS6293999A (ja) * | 1985-10-19 | 1987-04-30 | 大日本スクリ−ン製造株式会社 | プリント基板のスル−ホ−ル穴埋め方法 |
US4817524A (en) * | 1986-12-31 | 1989-04-04 | The Boeing Company | Screen printing method and apparatus |
JPS63121537U (de) * | 1987-01-31 | 1988-08-08 | ||
JPS6446227U (de) * | 1987-09-17 | 1989-03-22 | ||
JPH01133394A (ja) * | 1987-11-19 | 1989-05-25 | Matsushita Electric Ind Co Ltd | スルーホール形成方法 |
JPH01171944A (ja) * | 1987-12-28 | 1989-07-06 | Kyocera Corp | スクリーン印刷機 |
JP2558775B2 (ja) * | 1988-01-20 | 1996-11-27 | 松下電器産業株式会社 | スルーホール印刷装置 |
SE8802430L (sv) * | 1988-06-28 | 1989-12-29 | Svecia Silkscreen Maskiner Ab | Rakelarrangemang |
DE3823200C1 (de) * | 1988-07-08 | 1990-03-08 | Gerhard 4800 Bielefeld De Klemm | |
JPH0254988A (ja) * | 1988-08-19 | 1990-02-23 | Toshiba Corp | クリームはんだの印刷装置 |
US4911948A (en) * | 1988-09-07 | 1990-03-27 | Acumeter Laboratories, Inc. | Method of screen printing and application of hot melt upon moving web substrates |
JP2870905B2 (ja) * | 1989-12-25 | 1999-03-17 | 松下電器産業株式会社 | スクリーン印刷方法および装置 |
JPH04124638A (ja) * | 1990-09-14 | 1992-04-24 | Fuji Photo Film Co Ltd | 帯状の磁気記録層を有する写真感光材料 |
JPH04124638U (ja) * | 1991-04-26 | 1992-11-13 | オリンパス光学工業株式会社 | 印刷装置 |
US5309837A (en) * | 1991-06-24 | 1994-05-10 | Tani Denkikogyo Co., Ltd. | Method for screen printing of paste |
JP3193448B2 (ja) | 1992-04-17 | 2001-07-30 | 株式会社アイホー | 撹拌機 |
JPH0671848A (ja) * | 1992-08-28 | 1994-03-15 | Murata Mfg Co Ltd | スクリーン印刷装置 |
JPH0679538A (ja) * | 1992-09-03 | 1994-03-22 | Brother Ind Ltd | 加工治具 |
JP3158757B2 (ja) * | 1993-01-13 | 2001-04-23 | 株式会社村田製作所 | チップ型コモンモードチョークコイル及びその製造方法 |
US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
JPH0717015A (ja) * | 1993-07-01 | 1995-01-20 | Hitachi Techno Eng Co Ltd | スクリ−ン印刷機 |
US5715748A (en) * | 1993-07-22 | 1998-02-10 | Minami Engineering Co., Ltd. | Squeegee for screen printing machine |
JPH07164614A (ja) * | 1993-12-16 | 1995-06-27 | Matsushita Electric Ind Co Ltd | スクリーン印刷装置 |
US5707575A (en) * | 1994-07-28 | 1998-01-13 | Micro Substrates Corporation | Method for filling vias in ceramic substrates with composite metallic paste |
JP3431729B2 (ja) * | 1995-07-12 | 2003-07-28 | 松下電器産業株式会社 | 回路基板の製造方法及び製造装置 |
-
1995
- 1995-07-12 JP JP17579595A patent/JP3431729B2/ja not_active Expired - Fee Related
-
1996
- 1996-07-11 WO PCT/JP1996/001929 patent/WO1997002953A1/ja active IP Right Grant
- 1996-07-11 KR KR1019970709945A patent/KR100264411B1/ko not_active IP Right Cessation
- 1996-07-11 US US08/983,448 patent/US6135024A/en not_active Expired - Fee Related
- 1996-07-11 DE DE69624822T patent/DE69624822D1/de not_active Expired - Lifetime
- 1996-07-11 EP EP96923060A patent/EP0842772B8/de not_active Expired - Lifetime
-
2000
- 2000-08-30 US US09/650,725 patent/US6453811B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR19990028623A (ko) | 1999-04-15 |
EP0842772B8 (de) | 2003-04-09 |
JPH0927669A (ja) | 1997-01-28 |
EP0842772A1 (de) | 1998-05-20 |
WO1997002953A1 (fr) | 1997-01-30 |
EP0842772A4 (de) | 1999-04-21 |
JP3431729B2 (ja) | 2003-07-28 |
KR100264411B1 (ko) | 2000-08-16 |
US6453811B1 (en) | 2002-09-24 |
US6135024A (en) | 2000-10-24 |
EP0842772B1 (de) | 2002-11-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69631747D1 (de) | Verfahren und Gerät zum Drucken | |
DE69629279D1 (de) | Verfahren und vorrichtung zum gravieren | |
DE69711043D1 (de) | Vorrichtung und verfahren zum siebdrucken | |
DE69630519D1 (de) | Vorrichtung und verfahren zum reinigen | |
DE69428431D1 (de) | Verfahren und vorrichtung zum druckformen | |
DE69324096D1 (de) | Verfahren und Vorrichtung zum Drucken | |
DE69600392T2 (de) | Vorrichtung und verfahren zum gestalten von bahndefiniertenkurven | |
DE59508637D1 (de) | Verfahren und Vorrichtung zum Stapeln | |
DE69721586D1 (de) | Vorrichtung und verfahren zum hydroformen | |
DE19681378T1 (de) | Verfahren und Vorrichtung zum Gravieren | |
DE69605465D1 (de) | Verfahren und Vorrichtung zum Etikettieren | |
DE69631720D1 (de) | Verfahren und Vorrichtung zum Drucken von Mehrfachkopien | |
DE59601324D1 (de) | Verfahren und Vorrichtung zum Depalettieren | |
DE69619724T2 (de) | Verfahren und Vorrichtung zum Umhüllen von Blättern | |
DE69900396D1 (de) | Verfahren und Vorrichtung zum Drucken | |
DE69616752D1 (de) | Druckgerät und verfahren zum drucken | |
DE69616613D1 (de) | Verfahren und Vorrichtung zum Tiefziehen | |
DE69515535D1 (de) | Verfahren und Vorrichtung zum Bildvergleich | |
DE69624822D1 (de) | Vorrichtung und verfahren zum drucken | |
DE69610889D1 (de) | Vorrichtung zum Zuführen von Bauteilen und Verfahren zum Zuführen von Bauteilen | |
DE69530339T2 (de) | Vorrichtung und Verfahren zum Drucken | |
DE69411631D1 (de) | Verfahren und Vorrichtung zum Drucken | |
DE69734539D1 (de) | Vorrichtung und Verfahren zum Drucken | |
DE69400403T3 (de) | Verfahren und Vorrichtung zum Nacheinander Bedrucken von Bogen | |
DE69610550T2 (de) | Verfahren und vorrichtung zum pressgissen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |