DE69602705T2 - Polyimidzusammensetzungen für die Elektroabscheidungsbeschichtung sowie daraus hergestellte Beschichtungen - Google Patents

Polyimidzusammensetzungen für die Elektroabscheidungsbeschichtung sowie daraus hergestellte Beschichtungen

Info

Publication number
DE69602705T2
DE69602705T2 DE69602705T DE69602705T DE69602705T2 DE 69602705 T2 DE69602705 T2 DE 69602705T2 DE 69602705 T DE69602705 T DE 69602705T DE 69602705 T DE69602705 T DE 69602705T DE 69602705 T2 DE69602705 T2 DE 69602705T2
Authority
DE
Germany
Prior art keywords
electrodeposition coating
made therefrom
coatings made
polyimide compositions
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69602705T
Other languages
English (en)
Other versions
DE69602705D1 (de
Inventor
Yoshihiro Oie
Hiroshi Itatani
Shinichi Furusaki
Sadakazu Hokamura
Yuji Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PI R&D Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE69602705D1 publication Critical patent/DE69602705D1/de
Publication of DE69602705T2 publication Critical patent/DE69602705T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • C09D5/4461—Polyamides; Polyimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S524/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S524/901—Electrodepositable compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE69602705T 1995-10-12 1996-10-14 Polyimidzusammensetzungen für die Elektroabscheidungsbeschichtung sowie daraus hergestellte Beschichtungen Expired - Lifetime DE69602705T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07264353A JP3089195B2 (ja) 1995-10-12 1995-10-12 電着用ポリイミド組成物

Publications (2)

Publication Number Publication Date
DE69602705D1 DE69602705D1 (de) 1999-07-08
DE69602705T2 true DE69602705T2 (de) 2000-02-10

Family

ID=17401982

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69602705T Expired - Lifetime DE69602705T2 (de) 1995-10-12 1996-10-14 Polyimidzusammensetzungen für die Elektroabscheidungsbeschichtung sowie daraus hergestellte Beschichtungen

Country Status (5)

Country Link
US (1) US5741599A (de)
EP (1) EP0770638B1 (de)
JP (1) JP3089195B2 (de)
CN (1) CN1068621C (de)
DE (1) DE69602705T2 (de)

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JP3321548B2 (ja) * 1996-06-17 2002-09-03 株式会社日立製作所 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法
CN1074032C (zh) * 1998-01-04 2001-10-31 中国科学院化学研究所 一种聚酰胺酸内涂胶及其制备方法和用途
TW408345B (en) 1998-04-21 2000-10-11 Matsushita Electric Ind Co Ltd Capacitor and its manufacturing method
JPH11307386A (ja) * 1998-04-21 1999-11-05 Matsushita Electric Ind Co Ltd コンデンサおよびその製造方法
KR100572646B1 (ko) 1998-07-17 2006-04-24 제이에스알 가부시끼가이샤 폴리이미드계 복합체 및 이 복합체를 사용한 전자 부품, 및 폴리이미드계 수성 분산액
JP4493114B2 (ja) * 1999-03-05 2010-06-30 大日本印刷株式会社 溶剤可溶型ポリイミドを用いた導電体積層体とその製法
JP2001096754A (ja) * 1999-07-23 2001-04-10 Konica Corp インクジェットヘッド及びインクジェットヘッドの製造方法
EP1070590A3 (de) * 1999-07-23 2001-06-13 Konica Corporation Tintenstrahlkopf und dazugehöriges Herstellungsverfahren
ATE293152T1 (de) 1999-08-06 2005-04-15 Pi R & D Co Ltd Zusammensetzung für polyimidelektroüberzug und verfahren zur nutzung derselben zur herstellung eines gemusterten polyimidfilms
JP4265048B2 (ja) * 1999-10-06 2009-05-20 Ｊｓｒ株式会社 電着用水性分散液、高誘電率フィルムおよび電子部品
JP4705216B2 (ja) * 2000-01-24 2011-06-22 大日本印刷株式会社 溶媒可溶性耐熱性ポリイミド樹脂及びその製造方法
JP2002029061A (ja) * 2000-07-18 2002-01-29 Konica Corp インクジェットヘッド及びインクジェットヘッドの製造方法
JP4067869B2 (ja) * 2002-05-13 2008-03-26 新日鐵化学株式会社 シロキサン変性ポリイミド樹脂
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US7259206B2 (en) * 2003-09-04 2007-08-21 Nippon Paint Co., Ltd. Water-borne resin composition and electrocoating composition
KR100995530B1 (ko) 2003-11-08 2010-11-19 주식회사 코오롱 플로린을 함유한 가교된 폴리이미드 필름의 제조방법
JP4594615B2 (ja) * 2003-12-05 2010-12-08 株式会社ピーアイ技術研究所 絶縁電線及び絶縁コイル
JP4737938B2 (ja) * 2004-02-13 2011-08-03 株式会社ピーアイ技術研究所 コイル用リング状絶縁板の製造方法
JP5240812B2 (ja) * 2007-02-21 2013-07-17 独立行政法人産業技術総合研究所 めっき皮膜−ポリイミド積層体及びその製造方法
TWI441878B (zh) 2007-05-07 2014-06-21 Mitsubishi Cable Ind Ltd 電沉積塗料組成物及電沉積方法
JP5252322B2 (ja) * 2007-10-17 2013-07-31 エージェンシー フォー サイエンス， テクノロジー アンド リサーチ カーボンナノチューブ及びポリマー含有複合膜
KR101660315B1 (ko) * 2010-02-11 2016-09-28 삼성전자 주식회사 고분자 및 이를 포함하는 조성물과 필름
WO2016003146A1 (ko) * 2014-06-30 2016-01-07 코오롱인더스트리 주식회사 고내열 폴리아믹산 용액 및 폴리이미드 필름
KR102248994B1 (ko) 2014-06-30 2021-05-07 코오롱인더스트리 주식회사 고내열 폴리아믹산 용액 및 폴리이미드 필름
CN107573842B (zh) * 2016-07-04 2020-05-12 大亚电线电缆股份有限公司 低介电的聚酰亚胺绝缘涂料及漆包线
KR102672003B1 (ko) * 2016-10-21 2024-06-03 한국전기연구원 전착코팅용 이미드계 고분자 콜로이드 분산액 및 그 제조방법
CN109796761A (zh) * 2018-12-25 2019-05-24 努比亚技术有限公司 显示屏组件、其制备方法和显示终端
CN111072964B (zh) * 2019-12-31 2022-07-12 北京欣奕华科技有限公司 一种聚酰亚胺前体组合物及其制备方法和应用
CN118146713A (zh) * 2022-12-07 2024-06-07 合肥汉之和新材料科技有限公司 一种聚酰亚胺电泳涂料、其制备方法及应用

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DE2111640A1 (de) * 1970-03-12 1971-09-30 Gen Electric Verfahren zur Herstellung von elektrophoretisch abscheidbaren UEberzugsmassen
US3892647A (en) * 1970-03-12 1975-07-01 Gen Electric Method of electrodepositing a polymer
US3855169A (en) * 1972-06-23 1974-12-17 Gen Electric Electrocoating compositions and method for making same
FR2292749A1 (fr) * 1974-11-28 1976-06-25 Mitsubishi Electric Corp Procede de preparation d'une dispersion aqueuse de vernis pour depot electrolytique
JPS5232943A (en) * 1975-09-10 1977-03-12 Mitsubishi Electric Corp Preparation of aqueous dispersion for electrodeposition
US4257861A (en) * 1978-05-22 1981-03-24 General Electric Company Electrocoating compositions and electrocoating method
NL8102200A (nl) * 1981-05-06 1982-12-01 Philips Nv Kleurenbeeldbuis.
US4425467A (en) * 1982-01-21 1984-01-10 Westinghouse Electric Corp. Method of preparing electrophorettable polymer emulsions
JPH0776440B2 (ja) * 1986-10-29 1995-08-16 三井東圧化学株式会社 金属の被覆方法
US5502143A (en) * 1992-12-25 1996-03-26 Pi Material Research Laboratory Process for preparing polyimide resins
EP0604319B1 (de) * 1992-12-25 1999-04-28 Hiroshi Itatani Polyamid-Lösungszusammensetzungen und Verfahren zur Herstellung

Also Published As

Publication number Publication date
JPH09104839A (ja) 1997-04-22
CN1068621C (zh) 2001-07-18
CN1154988A (zh) 1997-07-23
DE69602705D1 (de) 1999-07-08
JP3089195B2 (ja) 2000-09-18
EP0770638A1 (de) 1997-05-02
EP0770638B1 (de) 1999-06-02
US5741599A (en) 1998-04-21

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Legal Events

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8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PI R&D CO., LTD., YOKOHAMA, KANAGAWA, JP