DE69601846D1 - Abschirmung gegen elektromagnetische Impulse und Verfahren zur Herstellung - Google Patents
Abschirmung gegen elektromagnetische Impulse und Verfahren zur HerstellungInfo
- Publication number
- DE69601846D1 DE69601846D1 DE69601846T DE69601846T DE69601846D1 DE 69601846 D1 DE69601846 D1 DE 69601846D1 DE 69601846 T DE69601846 T DE 69601846T DE 69601846 T DE69601846 T DE 69601846T DE 69601846 D1 DE69601846 D1 DE 69601846D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- against electromagnetic
- shielding against
- electromagnetic impulses
- impulses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31605—Next to free metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25014895 | 1995-09-04 | ||
JP20886096A JP3385163B2 (ja) | 1995-09-04 | 1996-07-19 | 電磁波シールド及びその形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69601846D1 true DE69601846D1 (de) | 1999-04-29 |
DE69601846T2 DE69601846T2 (de) | 1999-11-25 |
Family
ID=26517087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1996601846 Expired - Fee Related DE69601846T2 (de) | 1995-09-04 | 1996-09-02 | Abschirmung gegen elektromagnetische Impulse und Verfahren zur Herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US5945213A (de) |
EP (1) | EP0761842B1 (de) |
JP (1) | JP3385163B2 (de) |
KR (1) | KR970019806A (de) |
CN (1) | CN1159733A (de) |
DE (1) | DE69601846T2 (de) |
TW (1) | TW348371B (de) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
EP0817557A3 (de) * | 1996-07-03 | 1998-05-06 | Nisshinbo Industries, Inc. | Material zur Abschirmung gegen die elektromagnetische Ausstrahlung und dessen Herstellungsverfahren |
TW486238U (en) | 1996-08-18 | 2002-05-01 | Helmut Kahl | Shielding cap |
US6188174B1 (en) * | 1996-10-01 | 2001-02-13 | Nisshinbo Insustries, Inc. | Electromagnetic radiation shield panel and method of producing the same |
US6780491B1 (en) * | 1996-12-12 | 2004-08-24 | Micron Technology, Inc. | Microstructures including hydrophilic particles |
JP2000043484A (ja) * | 1998-07-30 | 2000-02-15 | Ricoh Co Ltd | 電子黒板システム |
US20010033478A1 (en) * | 2000-04-21 | 2001-10-25 | Shielding For Electronics, Inc. | EMI and RFI shielding for printed circuit boards |
JP2002057485A (ja) * | 2000-06-01 | 2002-02-22 | Yokohama Rubber Co Ltd:The | 電波吸収体組成物 |
JP3723927B2 (ja) | 2000-07-11 | 2005-12-07 | 日本ライナー株式会社 | エポキシ樹脂を短時間で硬化する方法及び、該硬化方法によって得られたエポキシ樹脂硬化物による電磁波吸収方法 |
JP5014529B2 (ja) * | 2000-07-18 | 2012-08-29 | 株式会社イノアックコーポレーション | 難燃性を有する導電性多孔体およびその製造方法 |
JP2002076675A (ja) * | 2000-08-31 | 2002-03-15 | Canon Inc | 電波吸収体及びその製造方法 |
US6768654B2 (en) * | 2000-09-18 | 2004-07-27 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
US6472014B1 (en) * | 2001-04-17 | 2002-10-29 | Novellus Systems, Inc. | Uniform surface texturing for PVD/CVD hardware |
US6776826B1 (en) * | 2001-07-27 | 2004-08-17 | Gbn Technologies, Inc. | Composition and method for electroless plating of non-conductive substrates |
JP2003073845A (ja) * | 2001-08-29 | 2003-03-12 | Sony Corp | 回転式メッキ装置およびメッキ方法 |
EP1512173A1 (de) * | 2002-05-16 | 2005-03-09 | National University Of Singapore | Stromlose kupfermetallisierung auf wafer-ebene und bumping-prozess und platierungslösungen für einen halbleiterwafer und microchip |
US7208115B2 (en) * | 2003-03-31 | 2007-04-24 | Lockheed Martin Corporation | Method of fabricating a polymer matrix composite electromagnetic shielding structure |
JP5095909B2 (ja) | 2003-06-24 | 2012-12-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 触媒組成物および析出方法 |
JP4521731B2 (ja) * | 2003-07-25 | 2010-08-11 | ピーピージー インダストリーズ オハイオ, インコーポレイテツド | ガラスおよびセラミック基材をコーティングするための方法および組成物 |
CA2559382A1 (en) * | 2004-01-19 | 2005-07-28 | Japan Science And Technology Agency | Woody electric wave absorber |
CN100438739C (zh) * | 2004-06-10 | 2008-11-26 | 鸿富锦精密工业(深圳)有限公司 | 抗磨损的防电磁干扰层 |
US8094007B2 (en) * | 2004-06-17 | 2012-01-10 | Honeywell International Inc. | Alarm status voice annunciation using broadcast band transmissions |
EP1657973A3 (de) * | 2004-11-16 | 2009-01-21 | Garett Lin | Mehrschichtige Struktur zum Dämpfen elektromagnetischer Wellen und deren Herstellungsverfahren |
EP1676937B1 (de) * | 2004-11-26 | 2016-06-01 | Rohm and Haas Electronic Materials, L.L.C. | UV härtbare Katalysatormischung |
DE102004062869A1 (de) * | 2004-12-21 | 2006-07-06 | Mayr, Ralph | Modul zur Datenübertragung und Peripheriegerät zur Aufnahme des Moduls |
US20070152195A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Electrostatic dissipative composite material |
US20070154717A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Thermally stable composite material |
US20070154716A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Composite material |
US7476339B2 (en) * | 2006-08-18 | 2009-01-13 | Saint-Gobain Ceramics & Plastics, Inc. | Highly filled thermoplastic composites |
JP2008085305A (ja) * | 2006-08-31 | 2008-04-10 | Bridgestone Corp | 光透過性電磁波シールド材の製造方法、光透過性電磁波シールド材、およびディスプレイ用フィルタ |
KR100776231B1 (ko) * | 2006-09-11 | 2007-11-29 | 구자은 | 전도성 금속 증착용 폴리우레탄 조성물 |
KR100761435B1 (ko) * | 2006-12-19 | 2007-09-27 | 구자은 | 수분산 폴리우레탄을 이용한 진공증착용 전자파 차폐 층 |
JP2009129969A (ja) * | 2007-11-20 | 2009-06-11 | Bridgestone Corp | 画像形成方法、光透過性電磁波シールド材の製造方法、並びに光透過性電磁波シールド材 |
EP2299795B1 (de) * | 2008-06-26 | 2014-01-01 | KAGAWA, Seiji | Elektromagnetische wellen absorbierender film und absorptionsmittel für elektromagnetische wellen |
KR101013737B1 (ko) * | 2008-07-11 | 2011-02-14 | 주식회사 이넥트론 | Abs 수지상 무전해 도금을 위한 표면 전처리 방법 |
KR101154164B1 (ko) * | 2008-12-08 | 2012-06-14 | 삼성에스디아이 주식회사 | 광학 필터 및 그 제조방법 |
US8361540B2 (en) | 2008-12-16 | 2013-01-29 | Lockheed Martin Corporation | Randomized circular grids for low-scatter EM shielding of a sensor window |
WO2010078413A1 (en) | 2008-12-31 | 2010-07-08 | Apinee, Inc. | Preservation of wood, compositions and methods thereof |
WO2010138348A2 (en) * | 2009-05-28 | 2010-12-02 | 3M Innovative Properties Company | Electromagnetic shielding article |
US9203130B2 (en) * | 2009-11-18 | 2015-12-01 | Dsm Ip Assets B.V. | RF filter housing |
RU2511717C2 (ru) * | 2010-03-30 | 2014-04-10 | ДжейЭкс НИППОН МАЙНИНГ ЭНД МЕТАЛЗ КОРПОРЕЙШН | Композит для электромагнитного экранирования |
KR101021212B1 (ko) * | 2010-08-30 | 2011-03-11 | (주)상아프론테크 | 쉴드캔용 판재 및 이의 제조방법 |
CN101966768A (zh) * | 2010-09-16 | 2011-02-09 | 冠捷显示科技(厦门)有限公司 | 多功能组合材料以及使用该组合材料的电源板 |
WO2012157704A1 (ja) * | 2011-05-18 | 2012-11-22 | 戸田工業株式会社 | 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜 |
US9878464B1 (en) | 2011-06-30 | 2018-01-30 | Apinee, Inc. | Preservation of cellulosic materials, compositions and methods thereof |
PL2671853T3 (pl) * | 2012-06-06 | 2015-05-29 | !Obac Ltd | Magnetyczna powierzchnia podłogi |
US9861019B2 (en) * | 2012-12-06 | 2018-01-02 | Goodrich Corporation | Deterministic EMI grid layout for controlling optical diffraction |
US9856565B2 (en) | 2012-12-31 | 2018-01-02 | Sabic Global Technologies B.V. | Metallization and surface coating solution on glass filler high peformance amorphous polymer compositions |
KR101347858B1 (ko) * | 2013-05-10 | 2014-01-03 | 이성근 | 전자파 차폐기능이 부여된 휴대폰 케이스 덮개원단 및 이의 제조방법 |
CN103319999A (zh) * | 2013-06-04 | 2013-09-25 | 上海大学 | 一种基于石墨烯的新型防电磁辐射保护膜的制备方法 |
CN103525340B (zh) * | 2013-09-04 | 2015-08-19 | 九江福莱克斯有限公司 | 一种水溶性环氧改性丙烯酸酯树脂胶黏剂及其使用该胶黏剂制备的电磁屏蔽胶膜 |
EP2918704B1 (de) * | 2014-03-14 | 2019-08-07 | FRANZ Oberflächentechnik GmbH & Co KG | Verfahren zum Konditionieren eines Bauteils |
CN104371438B (zh) * | 2014-11-24 | 2016-08-17 | 郑州工业应用技术学院 | 一种建筑用聚合物复合涂料及其制备方法 |
DE102015219493A1 (de) * | 2015-10-08 | 2017-04-13 | BSH Hausgeräte GmbH | Hausgerät mit abschirmender Abdeckung |
JP6785686B2 (ja) | 2017-03-02 | 2020-11-18 | 三菱製紙株式会社 | 金属調に加飾されたプラスチック成形品 |
CN108831678A (zh) * | 2018-06-19 | 2018-11-16 | 南通米兰特电气有限公司 | 阻磁变压器 |
US11757421B2 (en) | 2021-09-01 | 2023-09-12 | Ge Aviation Systems Llc | Circuit and method for an electrical filter |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3657003A (en) * | 1970-02-02 | 1972-04-18 | Western Electric Co | Method of rendering a non-wettable surface wettable |
US4517118A (en) * | 1983-06-27 | 1985-05-14 | Acheson Industries, Inc. | New nickel coating composition for shielding electronic equipment and the like |
US4663240A (en) * | 1984-11-06 | 1987-05-05 | Enthone, Incorporated | RFI shielded plastic articles and process for making same |
US5603983A (en) * | 1986-03-24 | 1997-02-18 | Ensci Inc | Process for the production of conductive and magnetic transitin metal oxide coated three dimensional substrates |
US5076841A (en) * | 1990-05-31 | 1991-12-31 | Shipley Company Inc. | Coating composition |
US5399432A (en) * | 1990-06-08 | 1995-03-21 | Potters Industries, Inc. | Galvanically compatible conductive filler and methods of making same |
-
1996
- 1996-07-19 JP JP20886096A patent/JP3385163B2/ja not_active Expired - Fee Related
- 1996-08-27 US US08/703,731 patent/US5945213A/en not_active Expired - Fee Related
- 1996-08-28 TW TW085110463A patent/TW348371B/zh active
- 1996-09-02 KR KR1019960037782A patent/KR970019806A/ko not_active Application Discontinuation
- 1996-09-02 DE DE1996601846 patent/DE69601846T2/de not_active Expired - Fee Related
- 1996-09-02 EP EP96114015A patent/EP0761842B1/de not_active Expired - Lifetime
- 1996-09-04 CN CN96122707A patent/CN1159733A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0761842B1 (de) | 1999-03-24 |
JPH09135097A (ja) | 1997-05-20 |
JP3385163B2 (ja) | 2003-03-10 |
TW348371B (en) | 1998-12-21 |
KR970019806A (ko) | 1997-04-30 |
US5945213A (en) | 1999-08-31 |
CN1159733A (zh) | 1997-09-17 |
EP0761842A1 (de) | 1997-03-12 |
DE69601846T2 (de) | 1999-11-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |