DE69531126D1 - Trägerelement für Kühlvorrichtung und elektronisches Gehäuse mit einem solchen Element - Google Patents
Trägerelement für Kühlvorrichtung und elektronisches Gehäuse mit einem solchen ElementInfo
- Publication number
- DE69531126D1 DE69531126D1 DE69531126T DE69531126T DE69531126D1 DE 69531126 D1 DE69531126 D1 DE 69531126D1 DE 69531126 T DE69531126 T DE 69531126T DE 69531126 T DE69531126 T DE 69531126T DE 69531126 D1 DE69531126 D1 DE 69531126D1
- Authority
- DE
- Germany
- Prior art keywords
- cooling device
- electronic housing
- support element
- support
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8354894 | 1994-04-22 | ||
JP8354894 | 1994-04-22 | ||
JP13758194 | 1994-06-20 | ||
JP13758194 | 1994-06-20 | ||
JP16109294 | 1994-07-13 | ||
JP16109294 | 1994-07-13 | ||
JP17062894 | 1994-07-22 | ||
JP17062894 | 1994-07-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69531126D1 true DE69531126D1 (de) | 2003-07-31 |
DE69531126T2 DE69531126T2 (de) | 2004-05-06 |
Family
ID=27466841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69531126T Expired - Fee Related DE69531126T2 (de) | 1994-04-22 | 1995-04-19 | Trägerelement für Kühlvorrichtung und elektronisches Gehäuse mit einem solchen Element |
Country Status (4)
Country | Link |
---|---|
US (2) | US5838064A (de) |
EP (1) | EP0678917B1 (de) |
CA (1) | CA2147396C (de) |
DE (1) | DE69531126T2 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5985697A (en) * | 1996-05-06 | 1999-11-16 | Sun Microsystems, Inc. | Method and apparatus for mounting an integrated circuit to a printed circuit board |
US7133726B1 (en) * | 1997-03-28 | 2006-11-07 | Applera Corporation | Thermal cycler for PCR |
FR2764115B1 (fr) * | 1997-06-02 | 2001-06-08 | Sgs Thomson Microelectronics | Dispositif semiconducteur et procede de connexion des fils internes de masse d'un tel dispositif |
WO1999018607A1 (en) * | 1997-10-03 | 1999-04-15 | The Board Of Trustees Of The University Of Arkansas | Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method |
US5966288A (en) * | 1998-05-22 | 1999-10-12 | Northern Telecom Limited | Assemblies of electronic devices and flexible containers thereof |
JP3070579B2 (ja) * | 1998-06-10 | 2000-07-31 | 日本電気株式会社 | 半導体装置の実装構造および実装方法 |
TW444158B (en) * | 1998-07-08 | 2001-07-01 | Hon Hai Prec Ind Co Ltd | Heat sink device and its manufacture method |
JP3161423B2 (ja) * | 1998-08-11 | 2001-04-25 | 日本電気株式会社 | Lsiの実装構造 |
JP3196762B2 (ja) * | 1999-04-20 | 2001-08-06 | 日本電気株式会社 | 半導体チップ冷却構造 |
JP2000323599A (ja) * | 1999-05-13 | 2000-11-24 | Nec Corp | Lsiのパッケージ構造 |
AU713440B3 (en) * | 1999-05-25 | 1999-12-02 | First International Computer, Inc. | A support structure for a central processing unit |
DE10017925A1 (de) * | 2000-04-11 | 2001-10-25 | Infineon Technologies Ag | Vorrichtung zum Befestigen einer Wärmeverteilungsabdeckung auf einer Leiterplatte |
US6459582B1 (en) * | 2000-07-19 | 2002-10-01 | Fujitsu Limited | Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
DE10039770A1 (de) * | 2000-08-16 | 2002-02-28 | Bosch Gmbh Robert | Kühlvorrichtung |
TW535936U (en) * | 2001-02-27 | 2003-06-01 | Quanta Comp Inc | Stabilizing sheet of heat sink |
GB0106547D0 (en) * | 2001-03-16 | 2001-05-02 | Aavid Thermalloy Ltd | Heat sinks |
US6635513B2 (en) * | 2001-05-29 | 2003-10-21 | Hewlett-Packard Development Company, L.P. | Pre-curved spring bolster plate |
US6606246B2 (en) * | 2001-09-21 | 2003-08-12 | Intel Corporation | Method and apparatus for retaining cooling apparatus and bus bar |
US6710264B2 (en) * | 2001-11-16 | 2004-03-23 | Hewlett-Packard Development Company, L.P. | Method and apparatus for supporting a circuit component having solder column interconnects using external support |
TW584373U (en) * | 2002-08-21 | 2004-04-11 | Delta Electronics Inc | Heat sink and electronics having said heat sink |
WO2004093187A1 (ja) * | 2003-04-16 | 2004-10-28 | Fujitsu Limited | 電子部品パッケージ、電子部品パッケージ組立体およびプリント基板ユニット |
EP1478018A1 (de) * | 2003-05-14 | 2004-11-17 | Gainward Co., Ltd. | Metallische Schutzschildanordnung zur Vermeidung einer Beschädigung eines Chips |
US7119433B2 (en) * | 2004-06-16 | 2006-10-10 | International Business Machines Corporation | Packaging for enhanced thermal and structural performance of electronic chip modules |
US20060118969A1 (en) * | 2004-12-03 | 2006-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Flip chip ball grid array package assemblies and electronic devices with heat dissipation capability |
JP4764159B2 (ja) * | 2005-12-20 | 2011-08-31 | 富士通セミコンダクター株式会社 | 半導体装置 |
TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | Ceramtec Ag | 構件或電路用的攜帶體 |
KR101391925B1 (ko) * | 2007-02-28 | 2014-05-07 | 페어차일드코리아반도체 주식회사 | 반도체 패키지 및 이를 제조하기 위한 반도체 패키지 금형 |
US8269248B2 (en) * | 2009-03-02 | 2012-09-18 | Thompson Joseph B | Light emitting assemblies and portions thereof |
US8547705B2 (en) | 2009-08-20 | 2013-10-01 | Nec Corporation | Semiconductor device having power supply-side and ground-side metal reinforcing members insulated from each other |
US9417015B2 (en) | 2012-02-22 | 2016-08-16 | Thermal Corp. | Heat exchanger backing plate and method of assembling same |
CN104851856B (zh) * | 2014-02-15 | 2018-01-19 | 商丘工学院 | 一种半导体散热器 |
US10629513B2 (en) * | 2015-06-04 | 2020-04-21 | Eaton Intelligent Power Limited | Ceramic plated materials for electrical isolation and thermal transfer |
KR20180054515A (ko) * | 2015-06-10 | 2018-05-24 | 젠썸 인코포레이티드 | 단열 특징부를 가진 자동차 전지용 열전 모듈 |
CN107690726A (zh) | 2015-06-10 | 2018-02-13 | 金瑟姆股份有限公司 | 具有集成冷板组件的车辆电池热电装置及其组装方法 |
US10244668B2 (en) * | 2015-08-05 | 2019-03-26 | Panasonic Intellectual Property Management Co., Ltd. | Heat dissipating structure and electronic apparatus |
WO2018063171A1 (en) * | 2016-09-28 | 2018-04-05 | Intel Corporation | Thermal conductivity for integrated circuit packaging |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
US11450626B2 (en) * | 2020-08-25 | 2022-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package |
US11910518B2 (en) * | 2021-05-26 | 2024-02-20 | Huawei Technologies Canada Co., Ltd. | Method and apparatus for heat sink mounting |
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Publication number | Priority date | Publication date | Assignee | Title |
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US3780795A (en) * | 1972-06-19 | 1973-12-25 | Rca Corp | Multilayer heat sink |
US4446504A (en) * | 1981-06-08 | 1984-05-01 | Thermalloy Incorporated | Mounting means with solderable studs |
US4853828A (en) * | 1985-08-22 | 1989-08-01 | Dart Controls, Inc. | Solid state device package mounting apparatus |
JPS62150867A (ja) * | 1985-12-25 | 1987-07-04 | Nec Corp | 高密度セラミツクパツケ−ジ |
US4744009A (en) * | 1986-10-31 | 1988-05-10 | Amp Incorporated | Protective carrier and securing means therefor |
US4937707A (en) * | 1988-05-26 | 1990-06-26 | International Business Machines Corporation | Flexible carrier for an electronic device |
FR2638895A1 (fr) * | 1988-11-08 | 1990-05-11 | Bull Sa | Support de circuit integre et son procede de fabrication, circuit integre adapte au support et boitier en resultant |
FR2638896B1 (fr) * | 1988-11-08 | 1990-12-21 | Bull Sa | Boitier de circuit integre de haute densite, support de circuit integre et carte d'interconnexion en resultant |
JP2536218B2 (ja) * | 1990-02-26 | 1996-09-18 | 日本電気株式会社 | ヒ―トシンク搭載型半導体装置 |
JPH0439957A (ja) * | 1990-06-05 | 1992-02-10 | Fujitsu Ltd | 半導体パッケージの放熱具 |
JPH0467658A (ja) * | 1990-07-09 | 1992-03-03 | Toshiba Corp | 半導体装置 |
DE4111247C3 (de) * | 1991-04-08 | 1996-11-21 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
US5261155A (en) * | 1991-08-12 | 1993-11-16 | International Business Machines Corporation | Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders |
US5203075A (en) * | 1991-08-12 | 1993-04-20 | Inernational Business Machines | Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
DE69216016T2 (de) * | 1991-09-13 | 1997-04-03 | Fuji Electric Co Ltd | Halbleiteranordnung |
US5378924A (en) * | 1992-09-10 | 1995-01-03 | Vlsi Technology, Inc. | Apparatus for thermally coupling a heat sink to a lead frame |
DE4310446C1 (de) * | 1993-03-31 | 1994-05-05 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
-
1995
- 1995-04-19 US US08/423,455 patent/US5838064A/en not_active Expired - Fee Related
- 1995-04-19 DE DE69531126T patent/DE69531126T2/de not_active Expired - Fee Related
- 1995-04-19 EP EP95105834A patent/EP0678917B1/de not_active Expired - Lifetime
- 1995-04-20 CA CA002147396A patent/CA2147396C/en not_active Expired - Fee Related
- 1995-12-15 US US08/573,131 patent/US5814535A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2147396A1 (en) | 1995-10-23 |
US5814535A (en) | 1998-09-29 |
CA2147396C (en) | 1999-09-14 |
US5838064A (en) | 1998-11-17 |
EP0678917A1 (de) | 1995-10-25 |
EP0678917B1 (de) | 2003-06-25 |
DE69531126T2 (de) | 2004-05-06 |
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