TW535936U - Stabilizing sheet of heat sink - Google Patents

Stabilizing sheet of heat sink

Info

Publication number
TW535936U
TW535936U TW090202978U TW90202978U TW535936U TW 535936 U TW535936 U TW 535936U TW 090202978 U TW090202978 U TW 090202978U TW 90202978 U TW90202978 U TW 90202978U TW 535936 U TW535936 U TW 535936U
Authority
TW
Taiwan
Prior art keywords
heat sink
stabilizing sheet
stabilizing
sheet
sink
Prior art date
Application number
TW090202978U
Other languages
Chinese (zh)
Inventor
Jr-Jung Wang
Guo-Ming Huang
Hung-Jou Jan
Ming-Jiu Hou
Original Assignee
Quanta Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quanta Comp Inc filed Critical Quanta Comp Inc
Priority to TW090202978U priority Critical patent/TW535936U/en
Priority to US09/866,068 priority patent/US20020162645A1/en
Publication of TW535936U publication Critical patent/TW535936U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW090202978U 2001-02-27 2001-02-27 Stabilizing sheet of heat sink TW535936U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW090202978U TW535936U (en) 2001-02-27 2001-02-27 Stabilizing sheet of heat sink
US09/866,068 US20020162645A1 (en) 2001-02-27 2001-05-24 Heatsink assembly having stabilzation plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090202978U TW535936U (en) 2001-02-27 2001-02-27 Stabilizing sheet of heat sink

Publications (1)

Publication Number Publication Date
TW535936U true TW535936U (en) 2003-06-01

Family

ID=21681636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090202978U TW535936U (en) 2001-02-27 2001-02-27 Stabilizing sheet of heat sink

Country Status (2)

Country Link
US (1) US20020162645A1 (en)
TW (1) TW535936U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130065202A (en) * 2011-12-09 2013-06-19 삼성전기주식회사 Camera module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4197586A (en) * 1978-04-24 1980-04-08 Hewlett-Packard Company Electronic calculator assembly
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
EP0678917B1 (en) * 1994-04-22 2003-06-25 Nec Corporation Supporting member for cooling means and electronic package using the same
US5596485A (en) * 1995-03-16 1997-01-21 Amkor Electronics, Inc. Plastic packaged integrated circuit with heat spreader
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers

Also Published As

Publication number Publication date
US20020162645A1 (en) 2002-11-07

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model